金属/非金属纳米线连接及应用研究进展

doi:10.3901/JME.2022.02.076

摘要/Abstract

摘要： 微纳连接是电子产品制造、封装、组装及功能化过程中的关键技术。纳米线由于独特的光学、电学及热学等特性，在小型化、多功能化的微纳电子器件中的作用日趋显著。因此，关于纳米线互连技术的相关研究已成为学术界和产业界共同的关注热点。与宏观尺度的互连相比，纳米线材料之间的互连在尺寸、结构及要求都具有一定的特殊性，这也催生了各种各样纳米连接方法的诞生与发展。综述了目前金属/非金属纳米线同质、异质连接的研究进展，归纳了常见的纳米线互连方法，如热致连接、光辐照连接、电场辅助连接及高能粒子束连接等方法及互连机制，介绍了其在柔性电子和其他微纳器件封装领域中的应用，并探讨了金属/非金属纳米线连接技术目前存在的问题及发展趋势。

关键词: 纳米线连接, 同质连接, 异质连接, 柔性电子, 微纳器件

Abstract: Micro-nano joining process is a key technique in the manufacturing, packaging, assembly and functionalization of electronic products. Because of its unique optical, electrical and thermal properties, nanowires are playing an increasingly important role in miniaturized and multifunctional micro-nano electronic devices. Therefore, the research on nanowire joining technology has become a common focus of both academia and industry. Compared with the macroscopic interconnection, the interconnection between nanowires has certain particularity in size, structure and requirements, which also gives rise to the birth and development of a variety of nanowire interconnection methods. This paper reviews the current metal/nonmetal nanowires research progress of homogeneous and heterogeneous connection, sums up the common methods of nanowires interconnection, such as thermal joining, light irradiation, electric auxiliary joining and high energy beam joining method and their mechanism, such as in flexible electronics and other applications in the field of micro-nano device packaging. The existing problems and development trend of metal/nonmetal nanowire joining technology are also discussed.

Key words: nanowires joining, homogeneous joining, heterogeneous joining, flexible electronics, micro-nano devices

中图分类号:

TG156

张贺, 王尚, 冯佳运, 马竟轩, 胡轩溢, 冯艳, 田艳红. 金属/非金属纳米线连接及应用研究进展[J]. 机械工程学报, 2022, 58(2): 76-87.

ZHANG He, WANG Shang, FENG Jiayun, MA Jingxuan, HU Xuanyi, FENG Yan, TIAN Yanhong. Recent Progress of Metal/Nonmetal Nanowire Joining Technology and Its Applications[J]. Journal of Mechanical Engineering, 2022, 58(2): 76-87.

参考文献

[1] 贺正楚,潘红玉. 德国"工业4.0"与"中国制造2025"[J]. 长沙理工大学学报,2015,30(3):103-110. HE Zhengchu,PAN Hongyu. Germany "Industry 4.0" and "Made in China 2025"[J]. Journal of Changsha University of Science & Technology[J]. 2015,30(3):103-110.
[2] 闫纪红,李柏林. 智能制造研究热点及趋势分析[J]. 科学通报,2020,65:684-694. YAN Jihong,LI Bolin. Research hotspots and tendency of intelligent manufacturing[J]. China Sci. Bull.,2020,65:684-694
[3] 黄圆,杭春进,田艳红,等. 纳米铜银核壳焊膏脉冲电流快速烧结连接铜基板研究[J]. 机械工程学报,2019,55(24):51-56. HUANG Yuan,HANG Chunjin,TIAN Yanhong,et al. Rapid sintering of nano copper-silver core-shell paste and interconnection of copper substrates by pulse current[J]. Journal of Mechanical Enigneering,2019,55(24):51-56.
[4] 邹贵生,闫剑锋,母凤文,等. 微连接和纳连接的研究新进展[J]. 焊接学报,2011,32(4):107-112,118. ZOU Guisheng,YAN Jianfeng,MU Fengwen,et al. Recent progress in microjoining and nanojoining[J]. Transactions of the China Welding Institution,2011,32(4):107-112,118.
[5] XU J,REN Z,DONG B,et al. Nanometer-scale heterogeneous interfacial sapphire wafer bonding for enabling plasmonic-enhanced nanofluidic mid-Infrared spectroscopy[J]. ACS Nano,2020,14:12159-12172.
[6] XU J,WANG C,JI X,et al. Direct bonding of high dielectric oxides for high-performance transistor applications[J]. Scripta Materialia,2020,178:307-312.
[7] 黄圆,田艳红,江智,等. 脉冲电流快速烧结纳米铜焊膏连接铜镍基板研究[J]. 机械工程学报,2017,53(4):34-42. HUANG Yuan,TIAN Yanhong,JIANG Zhi,et al. Rapidly sintering of nano copper paste and interconnection of copper and nickel substrate by pulse current[J]. Journal of Mechanical Enigneering,2017,53(4):34-42
[8] XU J,WANG C,TIAN Y,et al. Glass-on-LiNbO₃ heterostructure formed via a two-step plasma activated low-temperature direct bonding method[J]. Applied Surface Science,2018,459:621-629.
[9] XU J,WANG C,ZHANG R,et al. VUV/O3 activated direct heterogeneous bonding towards high-performance LiNbO₃-based optical devices[J]. Applied Surface Science,2019,495:143576.
[10] YE S,RATHMELL A R,CHEN Z,et al. Metal nanowire networks:The next generation of transparent conductors[J]. Advanced Materials,2014,26:6670-6687.
[11] MALLIKARJUNA K,HWANG H J,CHUNG W H,et al. Photonic welding of ultra-long copper nanowire network for flexible transparent electrodes using white flash light sintering[J]. RSC Advances,2016,6:4770-4779.
[12] CHUNG W H,KIM S H,KIM H S. Welding of silver nanowire networks via flash white light and UV-C irradiation for highly conductive and reliable transparent electrodes[J]. Scientific Reports,2016,6:32086.
[13] LIN L,ZOU G,LIU L,et al. Plasmonic engineering of metal-oxide nanowire heterojunctions in integrated nanowire rectification units[J]. Applied Physics Letters,2016,108:203107.
[14] GHOSH P,LU J,CHEN Z,et al. Photothermal-induced nanowelding of metal-semiconductor heterojunction in integrated nanowire units[J]. Advanced Electronic Materials,2018,4:1700614.
[15] LAGRANGE M,LANGLEY D P,GIUSTI G,et al. Optimization of silver nanowire-based transparent electrodes:Effects of density,size and thermal annealing[J]. Nanoscale,2015,7:17410-17423.
[16] LEE J Y,CONNOR S T,CUI Y,et al. Solution-processed metal nanowire mesh transparent electrodes[J]. Nano Letters,2018,8:689-692.
[17] DING S,JIU J,TIAN Y,et al. Fast fabrication of copper nanowire transparent electrodes by a high intensity pulsed light sintering technique in air[J]. Physical Chemistry Chemical Physics,2015,17:31110-31116.
[18] DING S,TIAN Y,JIANG Z,et al. Joining of silver nanowires by femtosecond laser irradiation method[J]. Materials Transactions,2015,56:981-983.
[19] FENG J,TIAN Y,WANG S,et al. Femtosecond laser irradiation induced heterojunctions between carbon nanofibers and silver nanowires for a flexible strain sensor[J]. Journal of Materials Science & Technology,2021,84:139-146.
[20] GUO H,LIN N,CHEN Y,et al. Copper nanowires as fully transparent conductive electrodes[J]. Scientific Reports,2013,3:2323.
[21] DING S,TIAN Y,JIU J,et al. Highly conductive and transparent copper nanowire electrodes on surface coated flexible and heat-sensitive substrates[J]. RSC Advances,2018,8:2109-2115.
[22] KARIM S,TOIMIL-MOLARES M E,BALOGH A G,et al. Morphological evolution of Au nanowires controlled by Rayleigh instability[J]. Nanotechnology,2006,17:5954-5959.
[23] TOIMIL MOLARES M E,BALOGH A G,CORNELIUS T W,et al. Fragmentation of nanowires driven by Rayleigh instability[J]. Applied Physics Letters,2004,85:5337-5339.
[24] HUANG Y,TIAN Y,HANG C,et al. TiO₂-Coated core-shell Ag nanowire networks for robust and washable flexible transparent electrodes[J]. ACS Applied Nano Materials,2019,2:2456-2466.
[25] PETRYAYEVA E,KRULL U J. Localized surface plasmon resonance:Nanostructures,bioassays and biosensing-A review[J]. Analytica Chimica Acta,2011,706:8-24.
[26] KIM K,YOON S J,KIM D. Nanowire-based enhancement of localized surface plasmon resonance for highly sensitive detection:A theoretical study[J]. Opt Express,2006,14:12419-12431.
[27] TANG X,ZHOU L,DU X,et al. Enhancing absorption properties of composite nanosphere and nanowire arrays by localized surface plasmon resonance shift[J]. Results in Physics,2017,7:87-94.
[28] GARNETT E C,CAI W,CHA J J,et al. Self-limited plasmonic welding of silver nanowire junctions[J]. Nature Materials,2012,11:241-249.
[29] DING S,JIU J,GAO Y,et al. One-step fabrication of stretchable copper nanowire conductors by a fast photonic sintering technique and its application in wearable devices[J]. ACS Applied Materials & Interfaces,2016,8:6190-6199.
[30] DING S,TIAN Y. Recent progress of solution-processed Cu nanowires transparent electrodes and their applications[J]. RSC Advances,2019,9:26961-26980.
[31] LIN L,LIU L,PENG P,et al. In situnanojoining of Y- and T-shaped silver nanowires structures using femtosecond laser radiation[J]. Nanotechnology,2016,27:125201.
[32] DAI S,LI Q,LIU G,et al. Laser-induced single point nanowelding of silver nanowires[J]. Applied Physics Letters,2016,108:121103.
[33] NIAN Q,SAEI M,XU Y,et al. Crystalline nanojoining silver nanowire percolated networks on flexible substrate[J]. ACS Nano,2015,9:10018-10031.
[34] TOHMYOH H,IMAIZUMI T,HAYASHI H,et al. Welding of Pt nanowires by Joule heating[J]. Scripta Materialia,2007,57:953-956.
[35] TOHMYOH H,FUKUI S. Manipulation and Joule heat welding of Ag nanowires prepared by atomic migration[J]. Journal of Nanoparticle Research,2012,14:1116.
[36] SONG T B,CHEN Y,CHUNG C H,et al. Nanoscale Joule heating and electromigration enhanced ripening of silver nanowire contacts[J]. ACS Nano,2014,8:2804-2811.
[37] EOM H,LEE J,PICHITPAJONGKIT A,et al. Ag@Ni core-shell nanowire network for robust transparent electrodes against oxidation and sulfurization[J]. Small,2014,10:4171-4181.
[38] WANG S,TIAN Y,HANG C,et al. Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining[J]. Sci. Rep.,2018,8:5260.
[39] WANG S,TIAN Y,WANG C,et al. Communication:Ag NW networks enhanced by Ni Electroplating for flexible transparent electrodes[J]. Journal of the Electrochemical Society,2018,165:D328-D330.
[40] ZHANG H,WANG S,TIAN Y,et al. Electrodeposition fabrication of Cu@Ni core shell nanowire network for highly stable transparent conductive films[J]. Chemical Engineering Journal,2020,390:124495.
[41] ZHANG H,WANG S,HANG C,et al. Joining of copper nanowires by electrodepositing silver layer for high-performance transparent electrode[J]. Welding in the World,2021,65:1021-1030.
[42] SHEHLA H,ISHAQ A,KHAN Y,et al. Ion beam irradiation-induced nano-welding of Ag nanowires[J]. Micro & Nano Letters,2016,11:34-37.
[43] XU S,TIAN M,WANG J,et al. Nanometer-scale modification and welding of silicon and metallic nanowires with a high-Intensity electron beam[J]. Small,2005,1:1221-1229.
[44] PENG Y,CULLIS T,INKSON B. Bottom-up nanoconstruction by the welding of individual metallic nanoobjects using nanoscale solder[J]. Nano Letters,2009,9:91-96.
[45] GAO F,GU Z. Nano-soldering of magnetically aligned three-dimensional nanowire networks[J]. Nanotechnology,2010,21:115604.
[46] LEE J,LEE P,LEE H B,et al. Room-temperature nanosoldering of a very long metal nanowire network by conducting-polymer-assisted joining for a flexible touch-panel application[J]. Advanced Functional Materials,2013,23:4171-4176.
[47] LIANG J,LI L,TONG K,et al. Silver nanowire percolation network soldered with graphene oxide at room temperature and its application for fully stretchable polymer light-emitting diodes[J]. ACS Nano,2014,8:1590-1600.
[48] HUANG Y,TIAN Y,HANG C,et al. Self-limited nanosoldering of silver nanowires for high-performance flexible transparent heaters[J]. ACS Applied Materials & Interfaces,2019,11:21850-21858.
[49] GU J,WANG X,CHEN H,et al. Conductivity enhancement of silver nanowire networks via simple electrolyte solution treatment and solvent washing[J]. Nanotechnology,2018,29:265703.
[50] LIANG X,ZHAO T,JIANG W,et al. Highly transparent triboelectric nanogenerator utilizing in-situ chemically welded silver nanowire network as electrode for mechanical energy harvesting and body motion monitoring[J]. Nano Energy,2019,59:508-516.
[51] LU Y,HUANG J Y,WANG C,et al. Cold welding of ultrathin gold nanowires[J]. Nature Nanotechnology,2010,5:218.
[52] TOKUNO T,NOGI M,KARAKAWA M,et al. Fabrication of silver nanowire transparent electrodes at room temperature[J]. Nano Research,2011,4:1215-1222.
[53] LI J,TAO Y,CHEN S,et al. A flexible plasma-treated silver-nanowire electrode for organic light-emitting devices[J]. Scientific Reports,2017,7:16468.
[54] WANG R,ZHAI H,WANG T,et al. Plasma-induced nanowelding of a copper nanowire network and its application in transparent electrodes and stretchable conductors[J]. Nano Research,2016,9:2138-2148.
[55] 聂瑀灼. 纳米线定向自组装及互连制备阵列分布ZnO/SiC异质结研究[D]. 哈尔滨:哈尔滨工业大学,2018. NIE Yuzhuo. Study on the fabraction of array-distributed ZnO/SiC heterojunctions by self-assembly and interconnection techonlogy[D]. Harbin:Harbin Institute of Technology,2019.
[56] YU T,SOW C H,GANTIMAHAPATRUNI A,et al. Patterning and fusion of CuO nanorods with a focused laser beam[J]. Nanotechnology,2005,16:1238-1244.
[57] RICKEY K M,NIAN Q,ZHANG G,et al. Welding of semiconductor nanowires by coupling laser-induced peening and localized heating[J]. Scientific Reports,2015,5:16052.
[58] XING S,LIN L,ZOU G,et al. Two-photon absorption induced nanowelding for assembling ZnO nanowires with enhanced photoelectrical properties[J]. Applied Physics Letters,2019,115:103101.
[59] LIU G,LI Q,QIU M. Sacrificial solder based nanowelding of ZnO nanowires[J]. Journal of Physics:Conference Series,2016,680:012027.
[60] TERRONES M,BANHART F,GROBERT N,et al. Molecular junctions by joining single-walled carbon nanotubes[J]. Physical Review Letters,2002,89:075505.
[61] KRASHENINNIKOV A V,NORDLUND K,KEINONEN J,et al. Ion-irradiation-induced welding of carbon nanotubes[J]. Physical Review B,2002,66:245403.
[62] RAJBHAR M K,DAS P,SATPATI B,et al. Joining of two different ceramic nanomaterials for bottom-up fabrication of heterojunction devices[J]. Applied Surface Science,2019,478:651-660.
[63] XIAO M,LIN L,XING S,et al. Nanojoining and tailoring of current-voltage characteristics of metal-P type semiconductor nanowire heterojunction by femtosecond laser irradiation[J]. Journal of Applied Physics,2020,127:184901.
[64] ZHANG H,WANG S,TIAN Y,et al. High-efficiency extraction synthesis for high-purity copper nanowires and their applications in flexible transparent electrodes[J]. Nano Materials Science,2020,2:164-171.
[65] TIAN Y,ZHANG H,HANG C,et al. Recent advances in metal nanowire-based transparent conductive films:Fabrication and applications[J]. Science Foundation in China,2020,28(2):85-103.
[66] YANG Y,LIU J,FU Z W,et al. Galvanic replacement-free deposition of Au on Ag for core-shell nanocubes with enhanced chemical stability and SERS activity[J]. Journal of the American Chemical Society,2014,136:8153-8156.
[67] NAM V B,LEE D. Copper nanowires and their applications for flexible,transparent conducting films:A review[J]. Nanomaterials (Basel),2016,6(3):47.
[68] HUANG Y,LIU Y,YOUSSEF K,et al. A solution processed flexible nanocomposite substrate with efficient light extraction via periodic wrinkles for white organic light-emitting diodes[J]. Advanced Optical Materials,2018,6(23):1801015.
[69] 黄亦龙. 高性能银纳米线透明电极制备及其在OLED中的应用研究[D]. 哈尔滨:哈尔滨工业大学,2019. HUANG Yilong. Fabrication of high-performance silver nanowire flexible transparent electrodes and their application on OLED[D]. Harbin:Harbin Institute of Technology,2019.
[70] HAN S,HONG S,HAM J,et al. Fast plasmonic laser nanowelding for a Cu-nanowire percolation network for flexible transparent conductors and stretchable electronics[J]. Advanced Materials,2014,26:5808-5814.
[71] ZHANG H,TIAN Y,WANG S,et al. Highly stable flexible transparent electrode via rapid electrodeposition coating of Ag-Au alloy on copper nanowires for bifunctional electrochromic and supercapacitor device[J]. Chemical Engineering Journal,2020,399:125075.
[72] TIAN R,HANG C,TIAN Y,et al. Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment[J]. Journal of Alloys and Compounds,2019,777:463-471.
[73] TIAN R,HANG C,TIAN Y,et al. Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes[J]. Journal of Materials Processing Technology,2019,268:1-9.
[74] PENG P,HE P,ZOU G,et al. Interfacial nano-mechanical properties of copper joints bonded with silver nanopaste near room temperature[J]. Materials Transactions,2015,56:1010-1014.
[75] PENG P,HU A,HUANG H,et al. Room-temperature pressureless bonding with silver nanowire paste:Towards organic electronic and heat-sensitive functional devices packaging[J]. Journal of Materials Chemistry,2012,22:12997-13001.