可拉伸柔性电路的原位封装3D打印工艺

doi:10.3901/JME.2019.15.064

机械工程学报 ›› 2019, Vol. 55 ›› Issue (15): 64-70.doi: 10.3901/JME.2019.15.064

• 特邀专栏：增材制造技术 • 上一篇下一篇

可拉伸柔性电路的原位封装3D打印工艺

朱伟军^1,2, 陈言坤¹, 张志坤¹, 田小永¹, 李涤尘¹

1. 西安交通大学机械制造系统工程国家重点实验室西安 710049;
2. 西安交通大学高端制造装备协同创新中心西安 710049

收稿日期:2018-11-09 修回日期:2019-01-09 出版日期:2019-08-05 发布日期:2019-08-05
通讯作者: 朱伟军(通信作者),男,1983年出生,博士。主要研究方向为增材制造(3D打印)技术。E-mail:wjzhu@xjtu.edu.cn
基金资助:
国家自然科学基金（51505457）和创新人才推进计划-青年科技新星（2017KJXX-14）资助项目。

In-situ Packaging 3D Printing Process for Stretchable Flexible Circuits

ZHU Weijun^1,2, CHEN Yankun¹, ZHANG Zhikun¹, TIAN Xiaoyong¹, LI Dichen¹

1. State Key Laboratory of Manufacturing Systems Engineering, Xi'an Jiaotong University, Xi'an 710049;
2. Collaborative Innovation Center of High-End Manufacturing Equipment, Xi'an Jiaotong University, Xi'an 710049

Received:2018-11-09 Revised:2019-01-09 Online:2019-08-05 Published:2019-08-05

摘要/Abstract

摘要： 可拉伸柔性电路是可拉伸柔性电子关键组成部分。金属铜导线具有良好的电学性能、力学性能、导热性等，在电子行业中应用广泛。但是，常规印刷成形的铜基电路不可拉伸，无法直接用于柔性电子。为此，基于电路结构的柔性化设计和3D打印加工技术，提出一种可拉伸柔性金属导线电路的原位封装3D打印技术，实现可拉伸金属导线及其封装层的同轴打印成形，将其嵌入到打印的柔性封装膜内，最终完成可拉伸柔性电路的一体化加工。设计了可拉伸变形的金属导线原位封装结构，开发了可用于原位封装打印的喷头结构，研究了原位封装3D打印工艺，在此基础上对柔性电路的拉伸性能进行了研究。发展了一种多材料多功能结构的一体化3D打印技术，探索了该技术在可拉伸柔性电路加工中的应用，为柔性电子的设计与加工提供了新思路。

关键词: 3D打印, 可拉伸变形, 屈曲结构, 柔性电子, 增材制造

Abstract: The stretchable flexible circuit is a key component of stretchable flexible electronics. Metal copper wires have good electrical properties, mechanical properties, thermal conductivity, etc., and are widely used in the electronics industry. However, conventionally printed copper-based circuits are not stretchable and cannot be directly used for flexible electronics. Therefore, based on the flexible design of the circuit structure and 3D printing processing technology, an in-situ package 3D printing technology for stretchable flexible metal wire circuits is proposed to realize coaxial printing of stretchable metal wires and their encapsulation layers. It is embedded in the printed flexible encapsulation film, and finally the integrated processing of the stretchable flexible circuit is completed. A metal wire in-situ package structure with stretchable deformation is designed. The nozzle structure that can be used for in-situ package printing is developed. The in-situ package 3D printing process is studied. Based on this, the tensile properties of the flexible circuit are studied. An integrated 3D printing technology with multi-material multi-function structure is developed, the application of this technology in the processing of stretchable flexible circuits is explored, and a new idea for the design and processing of flexible electronics is provided.

Key words: 3D printing, additive manufacturing, buckling structure, flexible electronics, stretchable flexibility

中图分类号:

TG156

朱伟军, 陈言坤, 张志坤, 田小永, 李涤尘. 可拉伸柔性电路的原位封装3D打印工艺[J]. 机械工程学报, 2019, 55(15): 64-70.

ZHU Weijun, CHEN Yankun, ZHANG Zhikun, TIAN Xiaoyong, LI Dichen. In-situ Packaging 3D Printing Process for Stretchable Flexible Circuits[J]. Journal of Mechanical Engineering, 2019, 55(15): 64-70.

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可拉伸柔性电路的原位封装3D打印工艺

In-situ Packaging 3D Printing Process for Stretchable Flexible Circuits

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