Cu/SAC305/Cu微焊点的剪切蠕变试验及数值模拟

doi:10.3901/JME.2022.02.300

机械工程学报 ›› 2022, Vol. 58 ›› Issue (2): 300-306.doi: 10.3901/JME.2022.02.300

• 微纳连接界面与可靠性 • 上一篇下一篇

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Cu/SAC305/Cu微焊点的剪切蠕变试验及数值模拟

尹立孟¹, 苏子龙¹, 左存果¹, 张中文¹, 姚宗湘¹, 王刚¹, 王善林², 陈玉华²

1. 重庆科技学院冶金与材料工程学院重庆 401331;
2. 南昌航空大学航空制造工程学院南昌 330063

收稿日期:2021-03-30 修回日期:2021-06-07 出版日期:2022-01-20 发布日期:2022-03-19
通讯作者: 尹立孟(通信作者),男,1976年出生,博士,硕士研究生导师,巴渝学者特聘教授,重庆英才创新领军人才。主要研究方向为先进焊接与微连接理论及技术。E-mail:yeenlm@cqust.edu.cn
基金资助:
国家自然科学基金（52175288）和重庆市自然科学基金（cstc2019jcyj-msxmX0175，cstc2020jcyj-msxmX0552，cstc2020jcyj-msxmX0564）资助项目。

Experiment and Numerical Simulation of Shear Creep of Cu/SAC305/Cu Microscale Solder Joints

YIN Limeng¹, SU Zilong¹, ZUO Cunguo¹, ZHANG Zhongwen¹, YAO Zongxiang¹, WANG Gang¹, WANG Shanlin², CHEN Yuhua²

1. School of Metallurgy and Materials Engineering, Chongqing University of Science & Technology, Chongqing 401331;
2. School of Aviation Manufacturing Engineering, Nanchang Hangkong University, Nanchang 330063

Received:2021-03-30 Revised:2021-06-07 Online:2022-01-20 Published:2022-03-19

摘要/Abstract

摘要： 采用基于动态力学分析仪（DMA Q800，TA-Instruments）的精密蠕变试验，针对直径400 μm、高250 μm的Cu/Sn-3.0Ag-0.5Cu/Cu无铅微尺度焊点，研究了其在10 MPa恒定应力和不同温度（100℃、110℃、120℃）以及100℃恒定温度和不同应力（8 MPa、10 MPa、12 MPa）条件下的剪切蠕变。同时，借助有限元分析软件ABAQUS进行了焊点的剪切蠕变数值模拟。试验结果表明，在10 MPa下剪切蠕变激活能Q为114.5 kJ/mol，100℃下微焊点剪切蠕变应力指数n为6.12。模拟结果显示，在10 MPa下剪切蠕变激活能Q为105.49 kJ/mol，100℃下微焊点剪切蠕变应力指数n为6.67。结合试验和模拟所得的蠕变激活能、应力指数认为，焊点剪切蠕变机制以晶格扩散机制为主。焊点断口形貌显示，剪切蠕变断裂路径穿过钎料基体并靠近SAC305钎料/IMC界面区域，表现为典型韧性断裂。

关键词: 电子封装, 微尺度焊点, 蠕变, 数值模拟, 剪切应力

Abstract: Based on the dynamic mechanical analyzer (DMA Q800, TA-Instruments), the shear creep of Cu/Sn-3.0Ag-0.5Cu/Cu lead-free microscale solder joints with a diameter of 400 μm and a height of 250 μm was studied under constant stress (10 MPa) and different temperatures (100℃, 110℃, 120℃), and a constant temperature (100℃) under different stresses (8 MPa, 10 MPa, 12 MPa). Then, the finite element analysis software ABAQUS was adopted to simulate the shear creep under the same conditions as the experiment. The experiment results show that the activation energy (Q) of SAC305 solder joint is 114.5 kJ/mol under the shear stress of 10 MPa, and the shear creep stress index n is 6.12 at 100℃. The simulation results show that the activation energy is 105.49 kJ/mol under 10 MPa, and the shear creep stress index is 6.67 at 100℃.According to the creep activation energy and creep stress index, the shear creep mechanism is mainly the lattice diffusion mechanism. In addition, the shear creep fracture pass through the solder matrix and close to the SAC305 solder/IMC interface region, and the fracture is typical ductile fracture.

Key words: electronic packaging, microscale solder join, creep, numerical simulation, shear stress

中图分类号:

TG113

尹立孟, 苏子龙, 左存果, 张中文, 姚宗湘, 王刚, 王善林, 陈玉华. Cu/SAC305/Cu微焊点的剪切蠕变试验及数值模拟[J]. 机械工程学报, 2022, 58(2): 300-306.

YIN Limeng, SU Zilong, ZUO Cunguo, ZHANG Zhongwen, YAO Zongxiang, WANG Gang, WANG Shanlin, CHEN Yuhua. Experiment and Numerical Simulation of Shear Creep of Cu/SAC305/Cu Microscale Solder Joints[J]. Journal of Mechanical Engineering, 2022, 58(2): 300-306.

参考文献

[1] GHAFFARI Y,DAUB K,NEWMAN R C,et al. Internal oxidation of Ag-xIn alloys at low homologous temperature[J]. Corrosion Science,2020,175:108869.
[2] WITHIN D. Creep behavior of Bi-containing lead-free solder alloys[J]. Journal of Electronic Materials,2012,41(2):190-203.
[3] El-REHIM A F A,ZAHRAN H Y,YASSIN A M. Microstructure evolution and tensile creep behavior of Sn-0.7Cu lead-free solder reinforced with ZnO nanoparticles[J]. Journal of Materials Science:Materials in Electronics,2019,30:2213-2223.
[4] 姜楠,张亮,刘志权,等. FCBGA器件SnAgCu焊点的热冲击可靠性分析[J]. 焊接学报,2019,40(9):45-48,168. JIANG Nan,ZHAGN Liang,LIU Zhiquan,et al. Thermal shock reliability analysis of SnAgCu solder joints of FCBGA devices[J]. Transactions of the China Welding Institution,2019,40(9):45-48,168.
[5] VAFAEENEZHAD H,SEYEDEIN S H,ABOUTALEBI M R,et al. Creep life prediction for Sn-5Sb lead-free solder alloy:Model and experiment[J]. Microelectronic Engineering,2019,207:55-65.
[6] LEE H H,KWAK J B. Realistic creep characterization for Sn3. 0Ag0. 5Cu solder joints in flip chip BGA package[J]. Journal of Electronic Materials,2019,48(10):6857-6865.
[7] SURENDAR A,SISWANTO W A,ALIJANI M,et al. High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages[J]. Microsystem Technologies,2019,25(10):4027-4034.
[8] XU Y,GU T,XIAN J,et al. Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5 Cu solder[J]. International Journal of Plasticity,2021,137:102904.
[9] SONG H,MORRIS J,HUA F. The creep properties of lead-free solder joints[J]. The Journal of the Minerals,2002,54(6):30-32.
[10] TERASHIMA S,ISHIKAWA S. Effect of dispersoids in β-Sn matrix on creep properties of chip scale packages joined by Sn-xAg-0.5mass% Cu (x=1,2,3 and 4 mass%) solder alloys[J]. Materials Transactions,2015,56(4):507-512.
[11] LANGDON T G. Creep at low stresses:An evaluation of diffusion creep and Harper-Dorn creep as viable creep mechanisms[J]. Metallurgical and Materials Transactions A,2002,33(2):249-259.
[12] ZHANG X,YIN L,YU C. Thermal creep and fracture behaviors of the lead-free Sn-Ag-Cu-Bi solder interconnections under different stress levels[J]. Journal of Materials Science:Materials in Electronics,2008,19(4):393-398.
[13] TERASHIMA S,ISHIKAWA S. Effect of dispersoids in β-Sn matrix on creep properties of chip scale packages joined by Sn-xAg-0.5mass% Cu (x=1,2,3 and 4 mass%) solder alloys[J]. Materials Transactions,2015,56(4):507-512.
[14] VILLAN J,BRUELLER O S,QASIM T. Creep behaviour of lead free and lead containing solder materials at high homologous temperatures with regard to small solder volumes[J]. Sensors and Actuators A Physical,2002,99(1-2):194-197.
[15] WIESE S,FEUSTEL F,MEUSEL E. Characterisation of constitutive behaviour of SnAg,SnAgCu and SnPb solder in flip chip joints[J]. Sensors and Actuators A Physical,2002,99(1-2):188-193.
[16] KERR M,CHAWLA N. Creep deformation behavior of Sn-3.5Ag solder at small length scales[J]. Acta Materialia,2004,52(15):4527-4535.
[17] XU C,DENG Q,WENG Z,et al. Lithium-assisted creep deformation behavior of Sn nanoparticle electrode with fracture-resistant ability[J]. Journal of Materials Research,2019,34(23):1-12.
[18] F SOMIDIN, MCDONALD S D, YE X,et al. Reducing cracking in solder joint interfacial Cu₆Sn₅ with modified reflow profile[J]. Transactions of The Japan Institute of Electronics Packaging,2020,13:E19-004-1-E19-004-11.
[19] El-TAHER A M,RAZZK A F. Controlling Ag₃Sn plate formation and its effect on the creep resistance of Sn-3.0Ag-0.7Cu lead-free solder by adding minor alloying elements Fe,Co,Te and Bi[J]. Metals and Materials International,2020:1-12.

Cu/SAC305/Cu微焊点的剪切蠕变试验及数值模拟

Experiment and Numerical Simulation of Shear Creep of Cu/SAC305/Cu Microscale Solder Joints

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