残余应力对混合组装BGA热循环可靠性影响

›› 2014, Vol. 50 ›› Issue (2): 86-91.

残余应力对混合组装BGA热循环可靠性影响

田艳红;贺晓斌;杭春进

哈尔滨工业大学先进焊接与连接国家重点实验室;哈尔滨工业大学微系统与微结构制造教育部重点实验室

发布日期:2014-01-20

Influence of the Hybrid BGA Residual Stress after Reflow on the Thermal Cycling Reliability

TIAN Yanhong;HE Xiaobin;HANG Chunjin

State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology Key Laboratory of Micro-systems and Micro-structures Manufacturing of Ministry of Education, Harbin Institute of Technology

Published:2014-01-20

摘要/Abstract

摘要： 研究混装球栅阵列(Ball grid array, BGA)回流焊后产生的残余应力对热循环寿命产生影响。根据Sn63Pb37/Sn3.0Ag0.5Cu均匀混装BGA封装实体，建立有铅和混装BGA封装体ANSYS有限元模型。通过加载不同峰值温度(220～265 ℃)和不同降温速度(1～6 ℃/s)的回流温度曲线后，得到BGA封装体焊点残余应力、应变。随后选取峰值温度243 ℃、降温速度3 ℃/s条件下的回流焊后BGA封装体模型施加热循环载荷，根据修正Coffin-Manson方程预测焊点寿命。研究结果表明：回流焊中降温速度对焊后应力占主导因素，应力降温速度的增加逐渐由27.9 MPa增加到32.5 MPa，而峰值温度对焊后应变影响明显；热循环分析中BGA焊球左上角区域始终处于高应力应变状态，均匀混装BGA寿命稍低于SnPb焊点BGA；回流焊工艺后进行热循环加载结果表明残余应力对Sn63Pb37/Sn3.0Ag0.5C均匀混装BGA寿命影响不大。

关键词: 混装球栅阵列;ANSYS;可靠性;残余应力;热疲劳寿命

Abstract: Thermal cycle reliability in Sn3.0Ag0.5Cu lead-free solder joints of ball grid array(BGA) package assembled with eutectic SnPb paste is investigated under the residual stress induced by reflow soldering. According to the mixed BGA package, the finite element model of lead-free and mixed BGA package is established. The residual stress and strain of BGA solder bumps are obtained after loading the different reflow profiles. The peak temperature ranges from 220 ℃ to 265 ℃, while the cooling rate is from 1 ℃/s to 6 ℃/s. The thermal cycling loads are applied on the BGA package model with the 243 ℃ peak temperature and 3 ℃/s cooling rate. The solder joint lifetime is calculated based on the equation of Coffin-Manson. In the reflow analysis, the cooling rate has a greater influence to the residual stress which increases from 27.9 MPa to 32.5 MPa with the cooling rate adding, while the highest temperature in the reflow curve has obvious impact on the residual strain. In the thermal recycle analysis, the most dangerous locationis is the upper-left corner of the BGA ball as the high stress and strain. The prediction life of the hybrid BGA could be compatible to the SnPb solder joints. Compared to the reflow curve load the life prediction among them has almost no difference.

Key words: mixed BGA;ANSYS;reliability;residual stress;thermal fatigue life

中图分类号:

TG425

田艳红;贺晓斌;杭春进. 残余应力对混合组装BGA热循环可靠性影响[J]. , 2014, 50(2): 86-91.

TIAN Yanhong;HE Xiaobin;HANG Chunjin. Influence of the Hybrid BGA Residual Stress after Reflow on the Thermal Cycling Reliability[J]. , 2014, 50(2): 86-91.

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