• CN:11-2187/TH
  • ISSN:0577-6686

›› 2013, Vol. 49 ›› Issue (13): 164-173.

• 论文 • 上一篇    下一篇

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面向元器件重用的废弃线路板拆解关键技术研究

向东;张永凯;李冬;龙旦风;牟鹏;杨继平   

  1. 清华大学摩擦学国家重点实验室;四川长虹股份有限公司;中冶赛迪集团有限公司
  • 发布日期:2013-07-05

Key Technology of Disassembling Waste Printed Circuit Board Assembly for Components Reuse

XIANG Dong;ZHANG Yongkai;LI Dong;LONG Danfeng;MOU Peng;YANG Jiping   

  1. The State Key Laboratory of Tribology, Tsinghua University Sichuan Changhong Electroic Co. Ltd CISDI Group Co. Ltd
  • Published:2013-07-05

摘要: 废弃线路板(Printed circuit board assembly, PCBA)上装配有大量高价值和有毒有害的元器件,一直是废旧电器电子产品(Waste electric and electronic equipment, WEEE)资源化关注的焦点。目前废弃线路板的资源化以材料循环利用为主,但研究发现线路板废弃时其上的元器件仍然具有良好的性能。为了实现废弃线路板上元器件的重用,在分析线路板组装与结构特点的基础上,针对解焊工艺,定量分析以贴片元器件(Surface mount devices, SMD)为主的线路板上的元器件的温度分布,确定了不同类型的线路板的加热工艺。针对线路板与元器件的连接方式,建立元器件的拆解加速度、分离位移和拆解能模型,提出面向元器件重用的废弃线路板拆解工艺,并分别针对以贴片元器件为主的线路板和以插装元器件为主的线路板开发相应的拆解设备。为了保证所拆解元器件的性能,初步探讨元器件可重用性的性能检测方法与流程。以线路板的拆解率和重用率为目标,优化面向元器件重用的线路板拆解工艺参数。

关键词: 拆解, 废旧电子电器, 废旧线路板, 元器件重用

Abstract: Waste printed circuit board assembly (PCBA), which has lots of high-value components and toxic substances, is a key unit in the disposal of waste electric and electronic equipment (WEEE). Up to now material recycling is still the main disposal method of waste PCBA. Studies show that the components still keep good condition when PCBA retired. In order to guarantee the reusability of the disassembled components, the components reuse-oriented disassembly technology is studied, in which the key technologies of heating and disassembly are discussed in detail. The key heating technology is researched for the different joint type of PCBA,the temperature distribution of surface mount devices (SMD) major PCBA is studied quantitatively. For getting the suitable disassembly mode of PCBA, the disassembly acceleration and separating displacement of components on PCB are defined and the disassembly energy models for different kinds of components are set up. On the basis of the heating and disassembly technology, two kinds of disassembly apparatus are developed for through-hole devices (THD) major PCBA and SMD major PCBA respectively. Also, the performance testing technology of certain kinds of disassembled components, such as SMD, THD, resistor and capacitance, is proposed. In the end the disassembly parameters are optimized to achieve high the separation ratio and reuse ration of components with orthogonal experiment.

Key words: Component Reuse, Disassembly, Waste electric and electronic equipment, Waste printed circuit board assembly

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