• CN:11-2187/TH
  • ISSN:0577-6686

›› 2005, Vol. 41 ›› Issue (7): 152-157.

• 论文 • 上一篇    下一篇

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SiCp/ZL101A复合材料非真空振动液相扩散焊下微观孔洞闭合及氧化膜行为

许惠斌;闫久春;杨士勤   

  1. 哈尔滨工业大学现代焊接生产技术国家重点试验室
  • 发布日期:2005-07-15

BEHAVIOR OF OXIDE FILM AND ELIMINATION OF MICROVOID DURING VACUUM-FREE VIBRATION LIQUID PHASE DIFFUSION BONDING OF SiCp/ZL101A COMPOSITES

Xu Huibin;Yan Jiuchun;Yang Shiqin   

  1. National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology
  • Published:2005-07-15

摘要: 以SiCp/ZL101A复合材料为研究对象,研究在非真空振动液相扩散连接下被焊表面的孔洞的闭合和氧化膜破碎行为。结果表明振动对孔洞闭合及氧化膜破碎效果明显,并且共晶液相的存在促进了孔洞的闭合和氧化膜的破碎。并在试验的基础上,先后建立了振动条件下固态孔洞闭合和氧化膜破碎模型和固液共存状态下孔洞闭合和氧化膜破碎模型。

关键词: 非真空, 连接, 铝基复合材料, 氧化膜, 振动

Abstract: The elimination of void and oxide film removal mechanism is researched in vacuum-free vibration liquid phase diffusion bonding of SiCp/ZL101A composites. Experimental results show that effect of elimination of void and oxide film removal is remarkable in the condition of vibration. Moreover, elimination of void and oxide film removal is accelerated under existence of liquid state eutectic interlayer. The elimination of void and oxide film removing model under solid state and the one under the coexistence solid and liquid phase are successively developed on basis of the above results.

Key words: Aluminum matrix composites, Bonding, Oxide film, Vacuum-free, Vibration

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