• CN:11-2187/TH
  • ISSN:0577-6686

›› 2000, Vol. 36 ›› Issue (3): 107-110.

• 论文 • 上一篇    

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硅的准分子激光直写刻蚀微细加工特性研究

苑伟政;马炳和;李晓莹;李铁军;王丽戈;刘晶儒   

  1. 西北工业大学微机械与微细加工技术研究室;西北核技术研究所
  • 发布日期:2000-03-15

ON THE CHARACTERISTICS OF Si MICRO-FABRICATION BY DIRECT ETCHING OF EXCIMER LASER

Yuan Weizheng;Ma Binghe;Li Xiaoying;Li Tiejun;Wang Lige;Liu Jingru   

  1. Northwestern Polytechnical University Northwest Institute of Nuclear Technology
  • Published:2000-03-15

摘要: 针对微机械三维机构对准分子激光直写微细加工的要求,在试验研究基础上,讨论了硅已加工表面形貌、加工热与热影响区等特性,得出了加工脉冲数、能量与刻蚀深度间的相互关系。

关键词: 硅微细加工, 直写刻蚀加工, 准分子激光

Abstract: The characteristics of Si micro-fabrication for MEMS by direct etching of DrF excimer laser, such as the machined topography, heat situation and thermal affecting zone are studied based on experiment. The duality empirical formula which can refled the relationship between etching depth and number of pulses, laser energy is obtained and then analyzed.

Key words: Directetching, Excimer laser, Si micro-fabrication

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