• CN：11-2187/TH
  • ISSN：0577-6686
机械工程学报

›› 1993, Vol. 29 ›› Issue (2): 52-57.

• 论文 • 上一篇    下一篇

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SMT激光软钎焊微接合部母材向液态钎料中溶解的动态行为

王春青;钱乙余;姜以宏   

  1. 哈尔滨工业大学
  • 发布日期:1993-03-01

DYNAMIC DISOLUTION OF THE BASE METAL INTO THE MOTEN SOLDER IN SMT LASER MICROSOLDERING

Wang Chunqing;Qian Yiyu;Jiang Yihong   

  1. Harbin Institute of Technology
  • Published:1993-03-01

摘要： 本文研究了非稳态温度场条件下SMT软钎焊接合部母材向钎料中溶解行为，建立了动态溶解量的计算模型；提出了确定溶解速度系数的实验方法。实验结果证明了模型的正确性。

关键词: 激光, 溶解, 软钎焊

Abstract: In this paper, the dynamic dissolution of the base metal into the moten solder has been studied, and a numerical simulation model of disclution velue has been developed. A method for measuring the solution speed ratio was build. The numerical simulation results have been borne out by the tests.

Key words: Dissolution, Laser, Soldering

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