电迁移过程中BGA焊点动态电阻变化及其组织演化的尺寸效应研究

doi:10.3901/JME.260111

机械工程学报 ›› 2026, Vol. 62 ›› Issue (4): 126-134.doi: 10.3901/JME.260111

• 材料科学与工程 • 上一篇

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电迁移过程中BGA焊点动态电阻变化及其组织演化的尺寸效应研究

王玮¹, 冯佳运^1,2, 王帅¹, 王韬涵¹, 田茹玉^1,2, 田艳红^1,2

1. 哈尔滨工业大学材料结构精密焊接与连接全国重点实验室哈尔滨 150001;
2. 哈尔滨工业大学郑州研究院郑州 450041

收稿日期:2025-02-07 修回日期:2025-09-03 发布日期:2026-04-02
作者简介:王玮,女,1999年出生,博士研究生。主要研究方向为电子封装技术与可靠性。E-mail:23b909143@stu.hit.edu.cn
田艳红(通信作者),女,1975年出生,博士,教授,博士研究生导师。主要研究方向为电子封装技术与可靠性,柔性可穿戴传感器。E-mail:tianyh@hit.edu.cn
基金资助:
国家自然科学基金资助项目(U2241223)。

Study of Size Effects on the Dynamic Resistance Variation and Microstructure Evolution of BGA Solder Joints During Electromigration

WANG Wei¹, FENG Jiayun^1,2, WANG Shuai¹, WANG Taohan¹, TIAN Ruyu^1,2, TIAN Yanhong^1,2

1. State Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001;
2. Zhengzhou Research Institute, Harbin Institute of Technology, Zhengzhou 450041

Received:2025-02-07 Revised:2025-09-03 Published:2026-04-02

摘要/Abstract

摘要： 随着电子信息技术的发展，焊点的尺寸效应现象日益凸显，而微尺度焊点在电迁移作用下的电学性能演变规律及其微观机制的研究仍很匮乏。针对不同尺寸的球栅阵列结构(Ball grid array, BGA)焊点在电迁移过程中的界面金属间化合物(Intermetallic compound, IMC)生长行为及其尺寸效应展开研究，对焊点电阻进行动态实时监测。在电迁移过程中，焊点阳极处IMC厚度始终大于阴极处IMC厚度，且大尺寸焊点更易在界面处生成更多的IMC。焊点的电阻随着电迁移试验的进行呈锯齿状或三角形状波动上升，其中，电阻的升高是由于孔洞及裂纹的扩展、焊点内部及界面处大量IMC的生长。而电迁移过程中焊点内部的孔洞及裂纹愈合现象，则会降低焊点电阻。随着电迁移试验的进行，大尺寸焊点内部更容易产生裂纹、孔洞等缺陷并扩展，IMC的生长也更剧烈，导致大尺寸焊点产生更高的电阻。结果表明，在电迁移过程中BGA焊点存在尺寸效应，并揭示了BGA焊点的电阻变化与组织演变之间的关系。

关键词: 动态电阻监测, 尺寸效应, 电迁移, BGA焊点

Abstract: With the advancement of electronic information technology, the size effect in solder joints has become increasingly prominent. However, research on the evolution of electrical properties and microscopic mechanisms in microscale solder joints under electromigration remains notably insufficient. The growth behavior of interfacial intermetallic compound(IMC) and its size effect during the electromigration process of ball grid array(BGA) solder joints with different sizes are systematically examined.. The resistance of solder joints is dynamically and real-time monitored.. During the electromigration process, the IMC thickness at the anode of the solder joint is always greater than that at the cathode, and the larger size of the solder joint is easier to generate more IMC at the interface. The resistance of the solder joint rises and fluctuates in a zigzag or triangular shape during the electromigration. The increase of resistance is due to the expansion of holes and cracks, as well as the growth of a large number of IMCs inside the solder joint. Holes and cracks in the solder joint are found to heal during the electromigration, which reduces the resistance of solder joint. During the electromigration process, the defects inside the solder joints with larger size, such as cracks and holes, are more easily generated and expanded, and the growth of IMC is more intense, resulting in a higher resistance value. The results show that a distinct size effect is observed in BGA solder joints during electromigration, and the relationship between the resistance variation and microstructure evolution of solder joints is revealed.

Key words: dynamic resistance monitoring, size effects, electromigration, BGA solder joints

中图分类号:

TG156

王玮, 冯佳运, 王帅, 王韬涵, 田茹玉, 田艳红. 电迁移过程中BGA焊点动态电阻变化及其组织演化的尺寸效应研究[J]. 机械工程学报, 2026, 62(4): 126-134.

WANG Wei, FENG Jiayun, WANG Shuai, WANG Taohan, TIAN Ruyu, TIAN Yanhong. Study of Size Effects on the Dynamic Resistance Variation and Microstructure Evolution of BGA Solder Joints During Electromigration[J]. Journal of Mechanical Engineering, 2026, 62(4): 126-134.

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电迁移过程中BGA焊点动态电阻变化及其组织演化的尺寸效应研究

Study of Size Effects on the Dynamic Resistance Variation and Microstructure Evolution of BGA Solder Joints During Electromigration

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