• CN:11-2187/TH
  • ISSN:0577-6686

机械工程学报 ›› 2024, Vol. 60 ›› Issue (21): 397-406.doi: 10.3901/JME.2024.21.397

• 制造工艺与装备 • 上一篇    

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激光-微铣削复合加工氧化铝共烧基板基础研究

王子鸣1, 侯清健1, 许立讲1, 王越飞1, 肖何2, 陈妮2, 李亮2   

  1. 1. 南京电子技术研究所 南京 210039;
    2. 南京航空航天大学机电学院 南京 210016
  • 收稿日期:2023-12-04 修回日期:2024-06-02 发布日期:2024-12-24
  • 通讯作者: 陈妮,女,1990年出生,博士,副教授,硕士研究生导师。主要研究方向为微细刀具设计与制造技术、微细加工、切削加工状态及刀具寿命智能监控技术。E-mail:ni.chen@nuaa.edu.cn
  • 作者简介:王子鸣,男,1993年出生,工程师。主要研究方向为刀具设计与制造技术。E-mail:wangziming1@cetc.com.cn
  • 基金资助:
    国家科技部创新方法工作专项“端端驱动、融合赋能”创新方法新系统研究与应用示范(2019IM020200);NSFC—河南联合基金重点项目子课题、上海市科技计划(20040501300)和工业和信息化部2017年“能制造综合标准化与新模式应用(2017ZNZX02)资助项目。

Fundamental Research on Laser-micro Milling Hybrid Processing of Alumina Co-fired Substrate

WANG Ziming1, HOU Qingjian1, XU Lijiang1, WANG Yuefei1, XIAO He2, CHEN Ni2, LI Liang2   

  1. 1. Nanjing Research Institute of Electronics Technology, Nanjing 210039;
    2. College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016
  • Received:2023-12-04 Revised:2024-06-02 Published:2024-12-24

摘要: 基于氧化铝共烧基板难加工问题,提出激光辅助微铣削的复合加工方法。研究了纳秒激光加工氧化铝共烧基板的形貌、尺寸以及残留变质层机械特性之后进行铣削试验。结果表明,紧密结合的氧化铝颗粒在激光的作形成疏松的变质层附在基体表面。槽的刻蚀深度随激光功率的增加和扫描速度、填充间距的减小分别在170~537 µm、167~493 µm和170~ 303 µm有着不同程度的增加,而刻蚀宽度在515~643 µm内变化。激光改性后基板残留变质层的整体硬度降低82%~96.2%,最小可达53.9 HV。与纯铣削相比,激光-微铣削后刀具使役性能提高,切削刃和刀具轮廓基本完整,且加工后表面粗糙度降低60%~65%,最小达0.204 μm。

关键词: 氧化铝基板, 激光加工, 微铣削, 复合加工

Abstract: Based on the difficult processing problem of Al2O3 HTCC, a hybrid processing method of laser-micro milling is proposed. The morphology, dimensions and mechanical properties of the residual metamorphic layer of nanosecond laser-machined aluminum oxide co-fired substrates are investigated followed by milling tests. The results show that the tightly bound alumina particles form a loose metamorphic layer attached to the substrate surface under laser action. The etching depth of the grooves increases with the increase of laser power and the decrease of scanning speed and filling spacing in different degrees between 170-537 µm, 167-493 µm and 170-303 µm, respectively, while the etching width varies between 515-643 µm. The overall hardness of the residual metamorphic layer of the substrate after laser modification was reduced by 82%-96.2% down to 53.9 HV. Compared to pure milling, the laser-micro-milling resulted in improved tool serviceability, largely intact cutting edges and tool profiles, and a reduction in the post-processing surface roughness by 60%-65% down to 0.204 µm.

Key words: Al2O3HTCC, laser processing, micro milling, hybrid processing

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