双面研磨技术研究现状与发展趋势

doi:10.3901/JME.2024.07.266

摘要/Abstract

摘要： 近年来，随着半导体、光学制造等领域的飞速发展，对晶圆、光学窗口及密封环等薄平板件的需求越来越大，加工质量要求越来越高。双面研磨具有加工应力小、效率高等优点，被广泛用于薄平板件的加工。为梳理双面研磨技术发展现状，重点综述了双面研磨的机理、工艺、应用及装备的最新研究进展；分析了双面研磨理论模型对工艺的优化效果，总结了双面研磨工艺的应用现状。此外，全面比较了行业内代表性厂家双面研磨装备的技术水平，并指出了国内与国外的差距。在此基础上，对双面研磨技术的发展趋势进行了展望，为后续相关研究提供了参考。

关键词: 双面研磨技术, 材料去除, 工艺优化, 双面研磨装备

Abstract: In recent years, semiconductor and optical manufacturing fields have experienced rapid development, leading to a heightened demand for thin flat components, such as wafers, optical windows, and sealing rings. Consequently, the quality requirements for their processing have become increasingly rigorous. Double-sided lapping is a widely used method for processing thin flat components, due to its low processing stress and high efficiency. To provide a comprehensive review of the current status of double-sided lapping, this study focuses on examining the mechanisms, processes, applications, and recent research developments in equipment. Additionally, the optimization effects of theoretical models on the double-sided lapping process are analyzed, and the current application status is summarized. Moreover, this study thoroughly compares the advantages and disadvantages of representative double-sided lapping equipment from various manufacturers in the industry, highlighting the gap between domestic and international equipment. The findings of this analysis offer a valuable reference for future research in the field and present a projection of the development trends of double-sided lapping technology.

Key words: double-sided lapping process, material removal, process optimization, double-sided lapping equipment

中图分类号:

TH166

郭江, 潘博, 连佳乐, 杨哲, 刘欢, 高菲, 康仁科. 双面研磨技术研究现状与发展趋势[J]. 机械工程学报, 2024, 60(7): 266-288.

GUO Jiang, PAN Bo, LIAN Jiale, YANG Zhe, LIU Huan, GAO Fei, KANG Renke. Recent Development and Prospective of Double-sided Lapping Technology[J]. Journal of Mechanical Engineering, 2024, 60(7): 266-288.

参考文献

[1] 曹连科,吴志宝. 单晶锗双面抛光工艺[J]. 光学技术, 1985(2):7-8. CAO Lianke,WU Zhibao. Double sided polishing process of single crystal germanium[J]. Optical Technology,1985(2):7-8.
[2] 贾宇龙,赵丽敏,郭卫. 单晶太阳能电池双面抛光工艺研究[J]. 能源技术与管理,2017,42(1):145-147. JIA Yulong,ZHAO Limin,GUO Wei. Study on double-sided polishing process of single crystal solar cells[J]. Energy Technology and Management,2017,42(1):145-147.
[3] 刘玉岭,张国华. 硅片双面研磨加工技术研究[J]. 电子工业专用设备,2008,37(12):27-29. LIU Yuling,ZHANG Guohua. Research on double side lapping technology of silicon wafer[J]. Special Equipment for Electronic Industry,2008,37(12):27-29.
[4] 刘成. 双面精磨与双面抛光新工艺[J]. 光学仪器. 1981(1):39-46. LIU Cheng. New process of double-sided fine grinding and double-sided polishing[J]. Optical Instruments,1981(1):39-46.
[5] 孙海林. 硅片的双面研磨法[J]. 磨料磨具与磨削,1989(2):24-28. SUN Hailin. Double sided grinding of silicon wafer[J] Abrasive Tools and Grinding,1989(2):24-28.
[6] 袁巨龙,袁哲俊,庞滔,等. 石英基片双面抛光加工的研究[J]. 磨料磨具与磨削,1987(6):3-7. YUAN Julong,YUAN Zhejun,PANG Tao,et al. Study on double-sided polishing of quartz substrate[J] Abrasive Tools and Grinding,1987(6):3-7.
[7] 张硕. 中大口径光学元件双面抛光控制技术研究[D]. 长春:长春理工大学,2019. ZHANG Shuo. Research on double-sided polishing control technology for medium and large aperture optical elements[D]. Changchun:Changchun University of Technology,2019.
[8] CAI G Q,LU Y S,CAI R,et al. Analysis on lapping and polishing pressure distribution[J]. CIRP Annals Manufacturing Technology,1998,47(1):235-238.
[9] REN L L,ZHANG F H,LIAO D F,et al. On-line measurement of contact pressure and friction force at the workpiece/lap interface during continuous polishing[J]. Journal of Manufacturing Processes,2020,52(A):1001-1006.
[10] 何曼泽,王琳,周佩,等. 3 mm厚大口径超薄元件双面抛光工艺[J]. 强激光与粒子束,2013,25(12):3315-3317. HE Manze,WANG Lin,ZHOU Pei,et al. Double sided polishing process for 3 mm thick large caliber ultra-thin components[J]. Intense Laser and Particle Beam,2013,25(12):3315-3317.
[11] 付海洋. 双面研磨中残余应力对纯铜构件变形影响研究[D]. 大连:大连理工大学,2020. FU Haiyang. Study on the influence of residual stress on the deformation of pure copper components in double-sided grinding[D]. Dalian:Dalian University of Technology,2020.
[12] 王斌. 基于初始残余应力的双面研磨加工变形预测研究[D]. 大连:大连理工大学,2021. WANG Bin. Research on deformation prediction of double side lapping based on initial residual stress[D]. Dalian:Dalian University of Technology,2021.
[13] 路玮琳,张爱民,王新宇. CBN砂轮在双面研磨抛光机上的应用[J]. 轴承,2015(9):19-20. LU Weilin,ZHANG Aimin,WANG Xinyu. Application of CBN grinding wheel in double-sided grinding and polishing machine[J]. Bearing,2015(9):19-20.
[14] 邵铭剑,胡中伟,张志斌,等. 双面研磨蓝宝石衬底面形及表面粗糙度变化过程的实验研究[J]. 现代制造工程,2017(9):8-12. SHAO Mingjian,HU Zhongwei,ZHANG Zhibin,etc. Experimental study on the change process of surface shape and surface roughness of sapphire substrate by double-sided grinding[J] Modern Manufacturing Engineering,2017(9):8-12.
[15] 张志斌. 蓝宝石衬底片双面研磨加工的面形精度及损伤控制的研究[D]. 厦门:华侨大学,2016. ZHANG Zhibin. Research on surface shape accuracy and damage control of double-sided grinding of sapphire substrate[D]. Xiamen:Huaqiao University,2016.
[16] YIN T,DOI T,KUROKAWA S,et al. The effects of strong oxidizing slurry and processing atmosphere on double-sided CMP of SiC wafer[J]. Advanced Materials Research. 2012,591-593:1131-1134.
[17] 范俞杰. 超精密双面抛光加工过程平稳性的研究[D]. 杭州:浙江工业大学,2012. FAN Yujie. Study on the stability of ultra precision double-sided polishing process[D]. Hangzhou:Zhejiang University of Technology,2012.
[18] 王永涛. 双面抛光去除非均匀性研究[D]. 北京:北京有色金属研究院总院,2012. WANG Yongtao. Study on removal of non-uniformity by double-sided polishing[D]. Beijing:General Institute of Beijing Nonferrous Metals Research Institute,2012.
[19] WANG L,HU Z,YU Y,et al. Evaluation of double-sided planetary grinding using diamond wheels for sapphire substrates[J]. Crystals. 2018,8(7):262.
[20] LIN S,WU M. A study of the effects of polishing parameters on material removal rate and non-uniformity[J]. International Journal of Machine Tools & Manufacture. 2002,42(1):99-103.
[21] ZHANG P,YANG J,LI L. Trajectory uniformity of the double-sided mechanical polishing of SiC single crystal substrate[J]. Materials Science in Semiconductor Processing,2020,107:104814.
[22] 陈毓,胡晓珍,李伟. 高精度大尺寸硅晶片的双面研磨抛光机改进设计[J]. 浙江海洋学院学报,2010,29(6):586-590. CHEN Yu,HU Xiaozhen,LI Wei. Improved design of double-sided grinding and polishing machine for high-precision large-size silicon wafer[J]. Journal of Zhejiang Ocean University,2010,29(6):586-590.
[23] 陈智刚,陈谨青,袁建新. 双面研磨抛光机齿轮传动系统齿轮啮合接触疲劳分析[J]. 景德镇学院学报. 2015,30(6):17-20. CHEN Zhigang,CHEN Jinqing,YUAN jianxin. Gear meshing contact fatigue analysis of gear transmission system of double-sided grinding and polishing machine[J]. Journal of Jingdezhen University,2015,30(6):17-20.
[24] 温思炜. 超精密双面抛光机动态仿真及工艺参数优化研究[D]. 杭州:浙江工业大学,2007. WEN Siwei. Research on dynamic simulation and process parameter optimization of ultra precision double-sided polishing machine[D]. Hanghzou:Zhejiang University of Technology,2007.
[25] 李强,王三文,姚胜利,等. 自聚焦透镜高效批量加工的双面研磨抛光法研究[J]. 光子学报,2006,35(9):1305-1308. LI Qiang,WANG Sanwen,YAO Shengli,et al. Study on double-sided grinding and polishing method for efficient batch processing of self focusing lens[J]. Acta Photonica Sinica,2006,35(9):1305-1308.
[26] 文东辉,洪滔,张克华,等. 蓝宝石晶体的双面研磨加工[J]. 光学精密工程,2009,17(10):2493-2498. WEN Donghui,HONG Tao,ZHANG Kehua,et al. Double sided grinding of sapphire crystal[J]. Optical Precision Engineering,2009,17(10):2493-2498.
[27] 张克华,文东辉,鲁聪达,等. 蓝宝石衬底双面研磨的材料去除机理研究[J]. 中国机械工程,2008,19(23):2863-2866. ZHANG Kehua,WEN Donghui,LU Congda,et al. Study on material removal mechanism of double-sided grinding of sapphire substrate[J]. China Mechanical Engineering,2008,19(23):2863-2866.
[28] 刘道标,徐晓明,周海,等. 蓝宝石衬底双面研磨亚表面损伤分布研究[J]. 中国机械工程,2014,25(19):2568-2572. LIU Daobiao,XU Xiaoming,ZHOU Hai,et al. Study on the subsurface damage distribution of sapphire substrate by double side lapping[J]. China Mechanical Engineering,2014,25(19):2568-2572.
[29] KLAMECKI B E. Comparison of material removal rate models and experimental results for the double-sided polishing process[J]. Journal of Materials Processing Technology,2001,109(3):248-253.
[30] PIETSCH G J,KERSTAN M. Understanding simultaneous double-disk grinding:Operation principle and material removal kinematics in silicon wafer planarization[J]. Precision Engineering. 2005,29(2):189-196.
[31] MOON D,YERRIBOINA N P,CHO S,et al. Removal mechanisms of glass and sapphire materials by slurry free lapping[C]. Chandler,AZ,USA:American Vacuum Society,2015.
[32] WANG L,HU Z,CHEN Y,et al. Material removal mechanism of sapphire substrates with four crystal orientations by double-sided planetary grinding[J]. Ceramics International,2020,46(6):7813-7822.
[33] CHO B,KIM H,MANIVANNAN R,et al. On the mechanism of material removal by fixed abrasive lapping of various glass substrates[J]. Wear,2013,302(1-2):1334-1339.
[34] HASHIMOTO Y,OZAKI R,FURUMOTO T,et al. A calculation method for workpiece profile variation during double-sided lapping by considering workpiece elastic deformation[J]. Precision Engineering,2022,73:457-469.
[35] 魏红波,谭援强,张浩,等. 双面抛光工艺的流场压力分布[J]. 应用力学学报,2010,27(3):500-504. WEI Hongbo,TAN Yuanqiang,ZHANG Hao,et al. Flow field and pressure distribution of double-sided polishing process[J]. Journal of Applied Mechanics,2010,27(3):500-504.
[36] 库黎明,李耀东,周旗钢,等. 双面抛光工艺中压力对300 mm硅片表面形貌的影响[J]. 稀有金属,2006(2):134-137. KU Liming,LI Yaodong,ZHOU Qigang,et al. Effect of pressure on surface morphology of 300 mm silicon wafer in double-sided polishing process[J]. Rare Metals,2006(2):134-137.
[37] LI W,HU X,JIN Y,et al. A study of double sided polishing process for ultra-smooth surface of silicon wafer[J]. Materials Science Forum,2006,532-533:472-475.
[38] LI W,JIN C,HU X Z. A Study on Pressure Stability in Double-Sided Polishing Process[J]. Advanced Materials Research,2010,126-128:64-69.
[39] PAN B,KANG R,ZHANG J,et al. Why parallelism of workpieces becomes convergent during double-sided lapping?[J]. Journal of Manufacturing Science and Engineering,2023,145(7):074501.
[40] WANG L,HU Z,FANG C,et al. Study on the double-sided grinding of sapphire substrates with the trajectory method[J]. Precision Engineering,2018,51:308-318.
[41] LAI Z,HU Z,FANG C,et al. Research on factors affecting wear uniformity of the wheels in the double-sided lapping[J]. Journal of Manufacturing Processes,2020,50:653-662.
[42] LAI Z,HU Z,FANG C,et al. Study on the wear characteristics of a lapping wheel in double-sided lapping based on the trajectory distribution[J]. IEEE Transactions on Semiconductor Manufacturing,2019,32(3):352-358.
[43] KASAI T. A kinematic analysis of disk motion in a double sided polisher for chemical mechanical planarization (CMP)[J]. Tribology International,2008,41(2):111-118.
[44] MAHAMAD S A R,SAAD N H,RASHID A A,et al. Effect of double sided process parameters in lapping silicon wafer[J]. Applied Mechanics and Materials,2013,393:259-265.
[45] SATAKE U,ENOMOTO T,FUJII K,et al. Optimization method for double-sided polishing process based on kinematical analysis[J]. Procedia CIRP,2016,41:870-874.
[46] 白立刚,周海,王鹏,等. 基于UG的蓝宝石衬底基片双面研磨轨迹研究[J]. 机械设计与制造,2012(2):14-16. BAI Ligang,ZHOU Hai,WANG Peng,et al. Research on dual side lapping trajectory of sapphire substrate based on UG[J]. Mechanical Design and Manufacturing,2012(2):14-16.
[47] LI W,YU T M,HU X Z,et al. Research on stock removal uniformity for double sided polishing process[J]. Advanced Materials Research,2007,24-25:223-227.
[48] 黄军辉,周旗钢,万关良,等. 300 mm硅片双面抛光运动轨迹模拟和优化[J]. 稀有金属,2007(6):737-741. HUANG Junhui,ZHOU Qigang,WAN GuanLiang,et al. Simulation and optimization of double-sided polishing trajectory of 300 mm silicon wafer[J]. Rare Metals,2007(6):737-741.
[49] 刘建河,杨建东. 用图形变换法研究行星机构双面研磨轨迹[J]. 长春理工大学学报,2002(2):40-42. LIU Jianhe,YANG Jiandong. Study on double-sided grinding path of planetary mechanism by graphic transformation method[J]. Journal of Changchun University of Technology,2002(2):40-42.
[50] 张洋,黄永刚,刘辉,等. 微通道板双面抛光过程材料去除特性研究[J]. 红外技术,2014,36(4):336-342. ZHANG Yang,HUANG Yonggang,LIU Hui,et al. Study on material removal characteristics during double-sided polishing of microchannel plates[J]. Infrared Technology,2014,36(4):336-342.
[51] HIROSE K,ENOMOTO T. Achievement of high flatness of large diameter silicon wafer in double-sided polishing[C]//Proceedings of the ASME 2009 International Manufacturing Science and Engineering Conference MSEC2009,West Lafayette,Indiana,USA:2009.
[52] 金杨福,李伟,胡刚翔,等. 双面抛光加工运动过程分析与数学模型的建立[J]. 南京航空航天大学学报,2005(S1):86-89. JIN Yangfu,LI Wei,HU Gangxiang,et al. Analysis of double-sided polishing process and establishment of mathematical model[J]. Journal of Nanjing University of Aeronautics and Astronautics,2005(S1):86-89.
[53] HASHIMOTO Y,OZAKI R,FURUMOTO T,et al. A novel measurement method for the torque acting on the upper platen in a three-way double-sided lapping/polishing machine[J]. Precision Engineering,2021,72:891-898.
[54] HASHIMOTO Y,SANO T,FURUMOTO T,et al. Development an identification method of friction coefficient between wafer and carrier in double-sided lapping[J]. Precision Engineering,2019,56:364-369.
[55] PAN B,KANG R,ZHU X,et al. Theoretical and experimental investigation on the formation of concave and convex surface shapes in double-sided lapping[J]. Journal of Material Processing Technology,2022,309,117749.
[56] FU G,CHANDRA A. The relationship between wafer surface pressure and wafer backside loading in Chemical Mechanical Polishing[J]. Thin Solid Films,2005,474:217-221.
[57] SRINIVASA-MURTHY C,WANG D,BEAUDOINA S P,et al. Stress distribution in chemical mechanical polishing[J]. Thin Solid Films,1997,308-309:533-537.
[58] MIYAKE T,ENOMOTO T. Achieving high flatness of workpiece edge shape by considering polishing pressure[J]. Key Engineering Materials,2010,447-448:71-75.
[59] MIYAKE T,HIROSE K. The edge roll off generation mechanism in polishing by considering the viscoelasticity of polishing pads[C]//Proceedings of the ASME 2009 International Manufacturing Science and Engineering Conference,USA:2009.
[60] 张鹏,冯显英,杨静芳. 3英寸SiC衬底无架行星式双面抛光运动学分析[J]. 功能材料,2015,46(18):18105-18111. ZHANG Peng,FENG Xianying,YANG Jingfang. Kinematic analysis of rack less planetary double-sided polishing of 3-inch SiC substrate[J]. Functional Materials,2015,46(18):18105-18111.
[61] LI W,HU G X,HU X D,et al. The performance and optimization of slurry on the double sided polishing process of silicon wafer[J]. Key Engineering Materials,2007,359-360:324-328.
[62] 胡晓珍,李伟,王志伟. 行星式双面抛光均匀性研究[J]. 机械工程师,2008(3):47-49. HU Xiaozhen,LI Wei,WANG Zhiwei. Study on the uniformity of planetary double-sided polishing[J]. Mechanical Engineer,2008(3):47-49.
[63] 李穆朗. 抛光转速对砷化镓双面抛光片表面平整度的影响[J]. 天津科技,2018,45(4):44-46. LI Mulang. Influence of polishing speed on the flatness of gallium arsenide double-faced surface[J]. Tianjin Science & Technology,2018,45(4):44-46.
[64] 祁小苑,李大琪,陈勇,等. 光学镜片平面行星式研磨加工关键技术研究[J]. 应用光学,2014,35(4):681-685. QI Xiaoyuan,LI Daqi,CHEN Yong,et al. Research on Key Technologies of plane planetary grinding of optical lens[J]. Applied Optics,2014,35(4):681-685.
[65] SATAKE U,ENOMOTO T. Polishing pad design for uniform removal distributions in double-sided polishing[J]. CIRP Annals,2023,72(1):289-292.
[66] 王朝钦. 微晶玻璃基板晶化与双面研磨加工技术[D]. 长春:长春理工大学,2003. WANG Chaoqin. Crystallization and double side grinding technology of glass ceramics substrate[D]. Changchun:Changchun University of Technology,2003.
[67] 贾军朋,白欣娇,李晓波,等. 双面机械抛光对SiC衬底TTV及材料去除率的影响[J]. 微纳电子技术,2021,58(9):840-844. JIA Junpeng,BAI Xinjiao,LI Xiaobo,et al. Effect of double-sided mechanical polishing on TTV and material removal rate of SiC substrate[J]. Micro Nano Electronic Technology,2021,58(9):840-844.
[68] ZHANG P,YANG J,LI L. Trajectory uniformity of the double-sided mechanical polishing of SiC single crystal substrate[J]. Materials Science in Semiconductor Processing,2020,107:104814.
[69] LI Z,DENG Z,HU Y. Effects of polishing parameters on surface quality in sapphire double-sided CMP[J]. Ceramics International,2020,46(9):13356-13364.
[70] 王晨宇. 单晶蓝宝石基片双面研磨工艺研究[D]. 大连:大连理工大学,2016. Wang Chenyu. Study on double side lapping process of single crystal sapphire substrate[D]. Dalian:Dalian University of Technology,2016.
[71] LI Z,DENG Z,GE J,et al. Experimental and theoretical analysis of single-sided and double-sided chemical mechanical polishing of sapphire wafers[J]. The International Journal of Advanced Manufacturing Technology,2022,119(7-8):5095-5106.
[72] XIE X,BONING D. CMP at the Wafer Edge-Modeling the interaction between wafer edge geometry and polish performance[C]//MRS Proceedings,2011,867.
[73] PAN B,KANG R,GUO X,et al. Edge roll-off suppression method in double-sided lapping with fixed abrasives[J]. Applied Optics,2022,61(1):279-286.
[74] 胡永亮,袁巨龙,邓乾发. 双面研磨抛光中工件表面"塌边现象"的研究[J]. 新技术新工艺,2010(2):75-77. HU Yongliang,YUAN Julong,DENG Qianfa. Study on "edge collapse" of workpiece surface in double-sided grinding and polishing[J]. New Technology and Process,2010(2):75-77.
[75] 董瑞. 双面研磨/抛光机结构设计及磨削轨迹研究[D]. 哈尔滨:哈尔滨理工大学,2016. DONG Rui. Research on structure design and grinding path of double-sided grinding/polishing machine[D]. Harbin:Harbin University of Technology,2016.
[76] 乔海红,卿德友,杨静,等. 红外锗窗片的双面磨抛工艺[J]. 新技术新工艺,2009(10):111-113. QIAO Haihong,QING Deyou,YANG Jing,et al. Double sided grinding and polishing process of infrared germanium window[J]. New Technology and Process,2009(10):111-113.
[77] 李国明,阎秋生,潘继生. 钛酸钡陶瓷基片的双面研抛加工研究[J]. 金刚石与磨料磨具工程,2015,35(1):11-16. LI Guoming,YAN Qiusheng,PAN Jisheng. Study on double side lapping and polishing of barium titanate ceramic substrate[J]. Diamond and Abrasive Tools Engineering,2015,35(1):11-16.
[78] 张文斌,王海明,葛劢翀. 碲锌镉晶片双面机械化学磨抛分析[J]. 电子工业专用设备,2020,49(6):7-9. ZHANG Wenbin,WANG Haiming,GE Maizhen. Analysis of double-sided mechanochemical polishing of CdZnTe wafer[J]. Special Equipment for Electronic Industry,2020,49(6):7-9.
[79] DEJA M,LICHTSCHLAG L,UHLMANN E. Thermal and technological aspects of double face grinding of C45 carbon steel[J]. Journal of Manufacturing Processes,2021,64:1036-1046.
[80] FENG M,YAO W F,ZHOU W H,et al. Experimental research on double-side lapping of cylindrical roller by taguchi methods[J]. Key Engineering Materials,2013,589-590:485-490
[81] PAN B,KANG R,GUO J,et al. Precision fabrication of thin copper substrate by double-sided lapping and chemical mechanical polishing[J]. Journal of Manufacturing Processes,2019,44:47-54.
[82] YU Y,HU Z,WANG W,et al. The double-side lapping of SiC wafers with semifixed abrasives and resin-combined plates[J]. The International Journal of Advanced Manufacturing Technology,2020,108:997-1006.
[83] LI J,HUANG J,HUA C,et al. Design of surface grooves on a polishing pad based on slurry uniform flow[J]. The International Journal of Advanced Manufacturing Technology,2019,103:4795-4803.
[84] 唐咏凯. 固结磨料研磨垫磨损特性研究[D]. 南京:南京航空航天大学,2017. TANG Yongkai. Research on wear characteristic of fixed abrasive pad[D]. Nanjing:Nanjing University of Aeronautics and Astronautics,2017.
[85] ZHENG F,ZHU N,ZHU Y,et al. Self-conditioning performance of hydrophilic fixed abrasive pad[J]. The International Journal of Advanced Manufacturing Technology,2017,90:2217-2222.
[86] LI J,TANG Y,HUA C,et al. Effect of process parameters on fixed abrasive pad self-conditioning in micro/nano machining[J]. Integrated Ferroelectrics,2017,182:53-64.
[87] KIM H,MANIVANNAN R,MOON D,et al. Evaluation of double sided lapping using a fixed abrasive pad for sapphire substrates[J]. Wear,2013,302(1-2):1340-1344.
[88] 帖俊平,张军妮,王悟非,等. 称重传感器和电磁比例阀在双面研磨抛光机中的应用[J]. 机械工程师,2016(10):211-212. TIE Junping,ZHANG Junni,WANG Wufei,et al. Application of load cell and electromagnetic proportional valve in double-sided grinding and polishing machine[J]. Mechanical Engineer,2016(10):211-212.
[89] 许君,许世雄. YT2M-4826双面研磨抛光机气动控制系统的设计[J]. 精密制造与自动化,2014(3):31-34. XU Jun,XU Shixiong. Design of pneumatic control system for yt2m-4826 double side grinding and polishing machine[J]. Precision Manufacturing and Automation,2014(3):31-34.
[90] 贾云刚,张春魁,张家远. 16B双面研磨机的气动控制系统[J]. 流体传动与控制, 2007(1):2. JIA Yungang,ZHANG Chunkui,ZHANG Jiayuan. A pneumatic control system for 16B two- sided grinder[J]. Fluid Power Transmission and Control,2007,20(1):37-38.
[91] ZHANG S,SHI H,WANG C,et al. Research on pneumatic control technology of medium and large diameter double-sided polishing machine[C]//SPIE,2019.
[92] XING T,ZHENG H H,LI W. The modeling and simulation of pneumatic loading system of double-sided polishing machine[J]. Key Engineering Materials,2009,416:154-158.
[93] HU G X,HU X D,JIN Y F,et al. The development of the precise double sided polishing machine[J]. Key Engineering Materials,2006,315-316:375-379.
[94] QIAN N,RUAN J,LI W. Study of pneumatic servo loading system in double-sided polishing[J]. Journal of Physics,2006,48(1):1238-1242.
[95] 茅小海,李伟,黄洁. 双面抛光机气动加载的建模与仿真[J]. 新技术新工艺,2011(4):55-57. MAO Xiaohai,LI Wei,HUANG Jie. Modeling and Simulation of pneumatic loading of double-sided polishing machine[J]. New Technology and Process,2011(4):55-57.
[96] 胡晓珍,胡晓东,李伟. 超精密双面抛光机控制系统的研究[J]. 机电工程,2005(11):58-62. HU Xiaozhen,HU Xiaodong,LI Wei. Research on control system of ultra precision double-sided polishing machine[J]. Mechanical and Electrical Engineering,2005(11):58-62.
[97] 高峰,王媛,李艳,等. 固着磨料双面研磨压力模糊自整定PID控制方法研究[J]. 中国机械工程,2015,26(2):162-166. GAO Feng,WANG Yuan,LI Yan,et al. Study on fuzzy self-tuning PID control method for double side grinding pressure of fixed abrasive[J]. China Mechanical Engineering,2015,26(2):162-166.
[98] YANG J S,ZHU X L,DONG Z G,et al. Design of double-sided polishing machine for functional crystal substrate[J]. Advanced Materials Research,2014,1017:580-585.
[99] 郭东明. 高性能制造[J]. 机械工程学报,2022,58(21):225-242. GUO Dongming. High performance manufacturing[J]. Journal of Mechanical Engineering,2022,58(21):225-242.