βSn组织和晶粒取向对焊锡接头可靠性影响机理研究进展

doi:10.3901/JME.2022.02.203

机械工程学报 ›› 2022, Vol. 58 ›› Issue (2): 203-222.doi: 10.3901/JME.2022.02.203

• 微纳连接界面与可靠性 • 上一篇下一篇

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βSn组织和晶粒取向对焊锡接头可靠性影响机理研究进展

李策^1,2, 王冰光^1,2, 畅旭峰^1,2, 马兆龙^1,2, 程兴旺^1,2

1. 北京理工大学材料学院北京 100081;
2. 北京理工大学冲击环境材料技术国家级重点实验室北京 100081

收稿日期:2021-09-30 修回日期:2021-11-12 出版日期:2022-01-20 发布日期:2022-03-19
通讯作者: 马兆龙(通信作者),男,1987年出生,博士,副教授,博士研究生导师。主要研究方向为电子封装、高熵合金及EBSD的应用。E-mail:z.l.ma@bit.edu.cn
作者简介:李策,男,1995年出生,博士研究生。主要研究方向为焊锡接头电迁移可靠性。E-mail:3120215542@bit.edu.cn;王冰光,男,1996年出生,硕士研究生。主要研究方向为焊锡接头热机疲劳可靠性。E-mail:3220191067@bit.edu.cn;畅旭峰,男,1997年出生,硕士研究生。主要研究方向为焊锡接头失效模拟仿真。E-mail:997374266@qq.com;程兴旺,男,1976年出生,博士,教授,博士研究生导师。主要研究方向为特种金属材料。E-mail:chengxw@bit.edu.cn
基金资助:
国家自然科学基金资助项目（51804032）。

Research Progress on the Influence Mechanisms of βSn Structure and Grain Orientation on the Reliabilities of Solder Joints

LI Ce^1,2, WANG Bingguang^1,2, CHANG Xufeng^1,2, MA Zhaolong^1,2, CHENG Xingwang^1,2

1. School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081;
2. National Key Laboratory of Science and Technology on Materials under Shock and Impact, Beijing Institute of Technology, Beijing 100081

Received:2021-09-30 Revised:2021-11-12 Online:2022-01-20 Published:2022-03-19

摘要/Abstract

摘要： 焊锡接头是集成电路中整合连接不同电子元器件的关键部位，在高电流密度、高低温循环、机械加载等恶劣服役条件下，会发生电迁移、热循环和机械疲劳等失效。由于单个焊锡接头仅包含少数取向随机的βSn晶粒且βSn具有严重的各向异性，焊锡接头的三类主要失效均受到βSn组织和晶粒取向的强烈影响。本文基于βSn的各向异性物理特性，深入分析了焊锡接头的电迁移、热循环及机械剪切疲劳失效机理，总结了βSn组织和晶粒取向影响各类失效的规律，明确了当βSn晶粒的c轴平行于电流方向时，焊锡接头的抗电迁移性能最差，而抗热循环性能最佳；但部分研究表明当βSn晶粒c轴垂直于基板时，焊锡接头的抗热循环性能较差；βSn组织和晶粒取向对焊锡接头抗机械剪切疲劳性能影响的研究较少，但已有的研究也表明两者之间存在较强关联。鉴于βSn组织和晶粒取向对焊锡接头可靠性的强烈影响，本文还梳理了近年来在焊锡接头βSn组织和晶粒取向调控方面的研究进展，包括利用异质形核剂、多晶及单晶Co基板、磁场及温度梯度等多种调控方法。最后，本文讨论了未来进一步提高焊锡接头可靠性的研究方向。

关键词: βSn, 晶粒取向, 可靠性, 金属间化合物, 位向关系

Abstract: Electronic solder joints that interconnect different components are the key parts in integrated circuits. Since solder joints service with high current density, thermal cycling, and mechanical loading, they commonly suffer from electromigration, thermomechanical fatigue, and mechanical fatigue. A typical solder joint usually contains few βSn grains with random orientations, which causes that the three main reliabilities of solder joints are heavily influenced by βSn structure and grain orientation, considering βSn is physically anisotropic. This paper bases on the key physical properties of βSn, analyzes the failure mechanisms of electromigration, thermomechanical fatigue, and mechanical fatigue of solder joints, summarizes the effects of βSn structure and grain orientation on these failures, confirms that when the c-axis of βSn is parallel to the current direction, the solder joints have the worst resistance to electromigration but the best thermal cycling performance;however, some studies have shown that when βSn c-axis is perpendicular to the substrate, the solder joints exhibit poor thermomechanical performance; there are few studies on the influence of βSn structure and grain orientations on the mechanical shear fatigue resistance of solder joints, but some published studies indicated that there is a strong correlation between them. In view of the strong influence of βSn structure and grain orientations on the reliabilities of solder joints, this paper also outlines the research progresses on controlling βSn structure and grain orientations, including using heterogeneous nucleating agents, polycrystalline and single-crystal Cobalt substrates, magnetic fields, and temperature gradients. Finally, this paper discusses the required future researches for improving the reliabilities of solder joints.

Key words: βSn, grain orientation, reliability, intermetallics, orientation relationship

中图分类号:

TG454

李策, 王冰光, 畅旭峰, 马兆龙, 程兴旺. βSn组织和晶粒取向对焊锡接头可靠性影响机理研究进展[J]. 机械工程学报, 2022, 58(2): 203-222.

LI Ce, WANG Bingguang, CHANG Xufeng, MA Zhaolong, CHENG Xingwang. Research Progress on the Influence Mechanisms of βSn Structure and Grain Orientation on the Reliabilities of Solder Joints[J]. Journal of Mechanical Engineering, 2022, 58(2): 203-222.

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βSn组织和晶粒取向对焊锡接头可靠性影响机理研究进展

Research Progress on the Influence Mechanisms of βSn Structure and Grain Orientation on the Reliabilities of Solder Joints

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