先进电子封装中焊点可靠性的研究进展

doi:10.3901/JME.2022.02.185

摘要/Abstract

摘要： 在先进封装中器件小型化的趋势下，焊点所处的服役环境越加苛刻，这对焊点材料提出了更高的可靠性要求。为保证微小尺寸焊点的可靠性，具有较强扩散阻挡能力的铁镍、铁镍磷和镍钴磷等合金作为新型凸点下金属层（Under bump metallization，UBM）应用。同时，微量元素对焊料合金力学性能、润湿性及界面化合物生长的调节作用也被广泛研究，以指导新型焊料的制备。与此同时，可靠性分析技术发展迅速。高精度的三维X射线显微镜（Three dimensional X-ray microscopy，3D-XRM）和超声波扫描显微镜（Scanning acoustic microscopy，SAM）等先进无损分析技术在界面表征、缺陷快速定位上的得到广泛应用；透射电镜（Transmission electron microscopy，TEM）、电子探针（Electron probe micro-analysis，EPMA）和背散射电子衍射（Electron back-scattered diffraction，EBSD）等前沿技术填补了纳米尺度表征以及未知物相鉴定等技术空白。随着可靠性分析能力的提高，材料在高温、温度循环、机械应力、电流等常见的单场应力下的失效行为和机理研究日趋成熟。由于多物理场耦合的形式更接近小尺寸焊点实际的工作应力状态，其失效行为机理以及寿命模型逐渐成为研究热点。

关键词: 先进封装, 焊点, 可靠性, 寿命评估

Abstract: Under the trend of miniaturization of microelectronic devices, the serving environment of solder joints becomes severer, which requires a higher reliability of materials. To ensure the reliability of micro-size solder joint, materials including Fe-Ni, Fe-Ni-P, and Ni-Co-P alloy which have strong diffusion barrier ability are introduced as novel under bump metallizations (UBMs). On the other hand, the effect of minor element on mechanical properties, wettability and interfacial IMC growth of solder material are widely researched in order to develop novel solder materials. At the same time, the analytical techniques for reliability research develop rapidly. Non-destructive techniques like three dimensional X-ray microscopy (3D-XRM) and Scanning acoustic microscopy (SAM) are widely used to characterize interface and locate the failures. Transmission electron microscopy (TEM), electron probe micro-analysis (EPMA) and electron back-scattered diffraction (EBSD) technology are used in the nano-scale characterization and phase identification. With the development of analytical ability, the failure behaviour and lifetime model under single field of high temperature, thermal cycling, mechanical stress and current are studied thoroughly. Further, since the condition of multi-field is more close to the real working condition, the failure behaviour and failure mechanisms of multi-field reliability are highly concerned.

Key words: advanced packaging, solder joint, reliability, lifetime evaluation

中图分类号:

TG156

高丽茵, 李财富, 刘志权, 孙蓉. 先进电子封装中焊点可靠性的研究进展[J]. 机械工程学报, 2022, 58(2): 185-202.

GAO Liyin, LI Caifu, LIU Zhiquan, SUN Rong. Research Progress on the Reliability of Solder Joint for Advanced Microelectronic Packaging[J]. Journal of Mechanical Engineering, 2022, 58(2): 185-202.

参考文献

[1] ABTEW M,SELVADURAY G. Lead-free solders in microelectronics[J]. Materials Science & Engineering R-Reports,2000,27(5-6):95-141.
[2] TUMMALA R,RYMASZEWSKI E J,KLOPFENSTEIN A G. Microelectronics packaging handbook[M]. Boston:Springer,1997.
[3] ROBERTAZZI R,SCHEURMAN M,WORDEMAN M,et al. Analytical test of 3D integrated circuits[C]//IEEE International Test Conference (ITC),2017,Fort Worth,Texas:IEEE,2017:1-10.
[4] GERBER M,BEDDINGFIELD C,O' CONNOR S,et al. Next generation fine pitch Cu pillar technology:Enabling next generation silicon nodes[C]//Electronic Components and Technology Conference (ECTC),2011,Lake Buena Vista,Florida:IEEE,2011:612-618.
[5] CHENG S,HUANG C,PECHT M. A review of lead-free solders for electronics applications[J]. Microelectronics Reliability,2017,75:77-95.
[6] TU K N,LIU Y X,LI M L. Effect of Joule heating and current crowding on electromigration in mobile technology[J]. Applied Physics Reviews,2017,4(1):24.
[7] LIU Y X,CHU Y C,TU K N. Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 mu m diameter[J]. Acta Materialia,2016,117:146-152.
[8] TU K N,LIU Y X. Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology[J]. Materials Science & Engineering R-Reports,2019, 136:1-12.
[9] LAI Y S,CHIU Y T,CHEN J. Electromigration reliability and morphologies of Cu pillar flip-chip solder joints with Cu substrate pad metallization[J]. Journal of Electronic Materials,2008,37(10):1624-1630.
[10] CHEN H,SHIH D,WEI C,et al. Generic rules to achieve bump electromigration immortality for 3D IC integration[C]//63rd Electronic Components and Technology Conference,2013,Las Vegas,Nevada:IEEE,2013:49-57.
[11] GAO L Y,LI C F,WAN P,et al. The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage[J]. Journal of Alloys and Compounds,2018,739:632-642.
[12] GAO L Y,LI C F,WAN P,et al. A superior interfacial reliability of Fe-Ni UBM during high temperature storage[J]. Journal of Materials Science:Materials in Electronics,2017,28(12):8537-8545.
[13] ZHOU H,GUO J,ZHU Q,et al. Application of electroless Fe-42Ni(P) film for under-bump metallization on solder joint[J]. Journal of Materials Science & Technology,2013,29(1):7-12.
[14] CHENG J X,HU X W,LI S. Effects of the surface roughness on wetting properties and interfacial reactions between SAC305 solder and Cu substrate with Ni-W-P coating[J]. Journal of Materials Science-Materials In Electronics,2020,31(18):15086-15096.
[15] YANG Y,BALARAJU J N,HUANG Y Z,et al. Interface reaction between an electroless Ni-Co-P metallization and Sn-3.5Ag lead-free solder with improved joint reliability[J]. Acta Materialia,2014,71:69-79.
[16] LEE H K,JEON J M,LEE M H,et al. Effects of Co content on the Cu diffusion barrier property of electroless NiCoP film[J]. Metals and Materials International,2013,19(1):119-122.
[17] KUMAR A,KUMAR M,KUMAR D. Deposition and characterization of electroless Ni-Co-P alloy for diffusion barrier applications[J]. Microelectronic Engineering,2010,87(3):387-390.
[18] ZHOU H,GUO J,SHANG J. Electroless deposition of highly solderable Fe-Ni films[J]. Journal of the Electrochemical Society,2013,160(6):D233-D239.
[19] ZHOU H,GUO J,SHANG J K. Microstructural study of interfacial reactions between liquid Sn and electroless Fe-Ni alloys[J]. Journal of Electronic Materials,2012,41(11):3161-3168.
[20] YANG Y,BALARAJU J N,HUANG Y,et al. Interface reaction between an electroless Ni-Co-P metallization and Sn-3.5Ag lead-free solder with improved joint reliability[J]. Acta Materialia,2014,71:69-79.
[21] GAO L Y,WAN P,LIU Z Q. Gradient growth of fcc and bcc phase within FexNi1-x(50<x<75) films during direct-current wafer electroplating[J]. Journal of Magnetism and Magnetic Materials,2020,498:166131.
[22] GAO L Y,ZHANG H,LI C F,et al. Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package[J]. Journal of Materials Science & Technology,2018,34(8):1305-1314.
[23] GAO L Y,LIU Z Q,LI C F. Failure mechanisms of SAC/Fe-Ni solder joints during thermal cycling[J]. Journal of Electronic Materials,2017,46(8):5338-5348.
[24] XIONG M Y,ZHANG L. Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging[J]. Journal of Materials Science,2019,54(2):1741-1768.
[25] AL-EZZI A,AL-BAWEE A,DAWOOD F,et al. Effect of bismuth addition on physical properties of Sn-Zn lead-free solder alloy[J]. Journal of Electronic Materials,2019,48(12):8089-8095.
[26] LIN P,LIU W S,MA Y Z,et al. Effect mechanism of Ag and Bi elements on the corrosion process in Sn-9Zn-1Ag and Sn-9Zn-3Bi solders[J]. Materials Research Express,2019,6(11):11.
[27] DEPIVER J A,MALLIK S,AMALU E H. Effective solder for improved thermo-mechanical reliability of solder joints in a ball grid array (BGA) soldered on printed circuit board (PCB)[J]. Journal of Electronic Materials,2021,50(1):263-282.
[28] CHEN Y,MENG Z C,GAO L Y,et al. Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints[J]. Journal of Materials Science-Materials In Electronics,2021,32(2):2172-2186.
[29] LIU Y,TU K N. Low melting point solders based on Sn,Bi,and In elements[J]. Materials Today Advances,2020,8:100115.
[30] KANG H,RAJENDRAN S H,JUNG J P. Low melting temperature Sn-Bi solder:Effect of alloying and nanoparticle addition on the microstructural,thermal,interfacial bonding,and mechanical characteristics[J]. Metals,2021,11(2):364.
[31] CUI J,ZHANG K,ZHAO D,et al. Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu 0.1RExNi/Cu solder joints under thermal cycling[J]. Scientific Reports,2021,11(1):6297.
[32] NOOR E E M,SINGH A. Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys[J]. Soldering & Surface Mount Technology,2014,26(3):147-161.
[33] GAO H,WEI F,SUI Y,et al. Effect of nickel (Ni) on the growth rate of Cu6Sn5 intermetallic compounds between Sn-Cu-Bi solder and Cu substrate[J]. Journal of Materials Science-Materials In Electronics,2019,30(3):2186-2191.
[34] GANCARZ T,BOBROWSKI P,PSTRUS J,et al. Thermal and mechanical properties of lead-free SnZn-xNa casting alloys,and interfacial chemistry on Cu substrates during the soldering process[J]. Journal of Alloys and Compounds,2016,679:442-453.
[35] GAIN A K,ZHANG L. Microstructure,thermal analysis and damping properties of Ag and Ni nano-particles doped Sn-8Zn-3Bi solder on OSP-Cu substrate[J]. Journal of Alloys and Compounds,2014,617:779-786.
[36] FIMA P,PSTRUS J,GANCARZ T. Wetting and interfacial chemistry of SnZnCu alloys with Cu and Al substrates[J]. Journal of Materials Engineering and Performance,2014,23(5):1530-1535.
[37] FIMA P,GANCARZ T,PSTRUS J,et al. Wetting of Sn-Zn-xIn (x=0.5,1.0,1.5 wt%) alloys on Cu and Ni substrates[J]. Journal of Materials Engineering and Performance,2012,21(5):595-598.
[38] DING Z Y,ZHANG N F,YU L,et al. Recent progress in metallurgical bonding mechanisms at the liquid/solid interface of dissimilar metals investigated via in situ X-ray imaging technologies[J]. Acta Metallurgica Sinica-English Letters,2021,34(2):145-168.
[39] SU L,YU X N,LI K,et al. Defect inspection of flip chip solder joints based on non-destructive methods:A review[J]. Microelectronics Reliability,2020,110:10.
[40] LAGAR J H,SIA R A,GRANCAPAL M C,et al. Non- destructive techniques for internal solder bump inspection of chip scale package-ball grid array package[C]//21st International Symposium on the Physical and Failure Analysis of Integrated Circuits,2014,Marina Bay Sands,Singapore IEEE,2017:362-365.
[41] LEE J C,CHEN C C,LEE D,et al. Moisture effect on physical failure of plastic molded SiP module[C]//70th Electronic Components and Technology Conference,2020,Orlando,Florida:IEEE,2020:2124-2132.
[42] KOZIC E,HAMMER R,ROSC J,et al. Metallization defect detection in 3D integrated components using scanning acoustic microscopy and acoustic simulations[J]. Microelectronics Reliability,2018,88-90:262-266.
[43] KELLY M B,ANTONISWAMY A,MAHAJAN R,et al. Effect of trace addition of In on Sn-Cu solder joint microstructure under electromigration[J]. Journal of Electronic Materials,2021,50(3):893-902.
[44] 高丽茵,李财富,曹丽华,等. 热电耦合作用下功率器件引脚开裂的机理研究[J]. 科学通报,2020,65(20):2169-2177. GAO Liyin,LI Caifu,CAO Lihua,et al. The open-pin failure of power device under the combined effect of thermo-migration and electro-migration[J]. Chinese Science Bulliten,2020,65(20):2169-2177.
[45] KIM J,JUNG S B,YOON J W. Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints[J]. Applied Surface Science,2020,503:144339.
[46] GU T,TONG V S,GOURLAY C M,et al. In-situ study of creep in Sn-3Ag-0.5Cu solder[J]. Acta Materialia,2020,196:31-43.
[47] ZHOU Q,LEE T K,BIELER T R. In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction and post-mortem EBSD analysis[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2021,802:12.
[48] KELLY M B,NIVERTY S,CHAWLA N. Four dimensional(4D) microstructural evolution of Cu6Sn5 intermetallic and voids under electromigration in bi-crystal pure Sn solder joints[J]. Acta Materialia,2020,189:118-128.
[49] KIM J,BACK J H,JUNG S B,et al. Interfacial reactions and mechanical properties of Sn-3.0Ag-0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging[J]. Journal of Materials Science-Materials In Electronics,2020,31(5):4027-4039.
[50] YANG C L,REN S R,ZHANG X D,et al. Effect of Sn surface diffusion on growth behaviors of intermetallic compounds in cu/Ni/SnAg microbumps[J]. Materials Characterization,2020,159:10.
[51] CHUANG T H,LEE P I,LIN Y C. An optimized Ag-5Pd-3.5Au bonding wire for the resistance of Ag ion migration in LED packages[J]. IEEE Transactions on Components Packaging and Manufacturing Technology,2020,10(12):1989-1995.
[52] LIN Y C,CHEN C H,HE Y Z,et al. Electrolytic migration of Ag-Pd alloy wires with various Pd contents[J]. Journal of Electronic Materials,2018,47(7):3634-3638.
[53] SAMAVATIAN V,IMAN-EINI H,AVENAS Y,et al. Effects of creep failure mechanisms on thermomechanical reliability of solder joints in power semiconductors[J]. IEEE Transactions on Power Electronics,2020,35(9):8956-8964.
[54] DEPIVER J A,MALLIK S,AMALU E H. Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions[J]. Engineering Failure Analysis,2021,125:105447.
[55] MOROOKA K,KARIYA Y. Thermal fatigue life prediction of BGA solder joints using a creep constitutive equation incorporating microstructural coarsening effect[J]. Materials Transactions,2021,62(2):205-212.
[56] DALE T,SINGH Y,BERNANDER I,et al. Fatigue life of Sn3.0Ag0.5Cu solder alloy under combined cyclic shear and constant tensile/compressive loads[J]. Journal of Electronic Packaging,2020,142(4):11.
[57] JIAO H H,LIU Y,SUN F L,et al. Solder interconnects reliability subjected to thermal-vibration coupling loading[J]. Journal of Materials Science-Materials In Electronics,2019,30(12):11482-11492.
[58] ZUO Y,BIELER T R,ZHOU Q,et al. Electromigration and thermomechanical fatigue behavior of Sn0.3Ag0.7Cu solder joints[J]. Journal of Electronic Materials,2018,47(3):1881-1895.
[59] JEONG H,LEE C J,KIM J H,et al. Electromigration behavior of Cu core solder joints under high current density[J]. Electronic Materials Letters,2020,16(6):513-519.
[60] CHANG Y W,HU C C,PENG H Y,et al. A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps[J]. Scientific Reports,2018,8:10.
[61] WANG Y,WANG Y,HAN J,et al. Effects of Sn grain c-axis on electromigration in Cu reinforced composite solder joints[J]. Journal of Materials Science-Materials In Electronics,2018,29(7):5954-5960.
[62] TIAN Y,HAN J,MA L M,et al. The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints[J]. Microelectronics Reliability,2018,80:7-13.
[63] FU X,LIU M,XU K X,et al. The in-situ observation of grain rotation and microstructure evolution induced by electromigration in Sn-3.0Ag-0.5Cu solder joints[J]. Materials,2020,13(23):10.
[64] YUAN J X,ZHANG S J,WAN B,et al. Damage based PoF model of solder joints under temperature cycling and electric coupling condition[J]. Microelectronics Reliability,2020,114:7.
[65] YUAN J,ZHANG S,WAN B,et al. Damage based PoF model of solder joints under temperature cycling and electric coupling condition[J]. Microelectronics Reliability,2020,114:113814.
[66] ZHU Q S,GAO F,MA H C,et al. Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current[J]. Journal of Materials Science-Materials In Electronics,2018,29(6):5025-5033.
[67] MA H C,GUO J D,CHEN J Q,et al. Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling[J]. Journal of Materials Science-Materials In Electronics,2016,27(2):1184-1190.