[1] |
LIANG Fengshuang, WU Mingyang, LIU Lifei.
Research on Mechanism and Subsurface Damage Characteristics of SiC Ultrasonic Grinding Based on Material Impact Characteristics
[J]. Journal of Mechanical Engineering, 2024, 60(9): 75-85.
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[2] |
HAO Mingwu, YAO Peng, ZHOU Jiabin, LI Yueming, LIANG Shitong, CHU Dongkai, HUANG Chuanzhen.
The Influencing Factors of Tangential Dressing of Bronze-bond Diamond Grinding Wheel by Picosecond Pulsed Laser
[J]. Journal of Mechanical Engineering, 2024, 60(9): 229-240.
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[3] |
DING Wenfeng, ZHAO Junshuai, ZHANG Honggang, ZHAO Biao, SI Wenyuan, SONG Qiang, HUANG Qingfei.
Advances in High Efficiency Precision Grinding and Surface Integrity Control Technology for Gears
[J]. Journal of Mechanical Engineering, 2024, 60(7): 350-373.
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[4] |
ZHANG Bonan, HUANG Hui, WU Min.
Experimental Study on Friction-induced Chemical-mechanical Composite Machining (FCMM) of 4H-SiC Single Crystal
[J]. Journal of Mechanical Engineering, 2024, 60(7): 401-410.
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[5] |
HUA Dongpeng, ZHOU Qing, WANG Wan, LI Shuo, WANG Zhijun, WANG Haifeng.
A Molecular Dynamics Simulation on the Subsurface Damage Mechanism in the Nano-polishing Process of Silicon Carbide
[J]. Journal of Mechanical Engineering, 2024, 60(5): 231-240.
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[6] |
ZHANG Yu, KANG Renke, GAO Shang, HUANG Jinxing, ZHU Xianglong.
Development and Evaluation of Soft Abrasive Grinding Wheel for Silicon Wafer in Wet Mechanical Chemical Grinding
[J]. Journal of Mechanical Engineering, 2023, 59(3): 328-336.
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[7] |
XIONG Wanli, ZENG Xu, ZHANG Hanqian, LI Yuanyuan, YUAN Shuai, JIN Zhixin.
Grinding Rounding Law and Roundness Limit Prediction of Fully Hydrostatic Supported Grinding System
[J]. Journal of Mechanical Engineering, 2023, 59(21): 85-98.
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[8] |
HUANG Jiajun, HE Quanpeng, XIE Jin, YANG Hao.
Diamond Grain Truncating Technology Coupled with Discharge Thermal and Alternating Cutting Force
[J]. Journal of Mechanical Engineering, 2022, 58(15): 144-151.
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[9] |
CHEN Mingjun, WANG Huiyao, CHENG Jian, ZHAO Linjie, YANG Hao, LIU Qi, TAN Chao, YIN Zhaoyang, YANG Zican, DING Wenyu.
Progress in Detection and Suppression Techniques for Processing-induced Sub-surface Defects of Fused Silica Optical Elements
[J]. Journal of Mechanical Engineering, 2021, 57(20): 1-19.
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[10] |
ZHAO Linjie, CHENG Jian, CHEN Mingjun, YUAN Xiaodong, LIAO Wei, YANG Hao, LIU Qi, WANG Haijun.
New Progress of CO2 Laser Processing Techniquesfor Fused Silica Optics
[J]. Journal of Mechanical Engineering, 2020, 56(11): 202-218.
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[11] |
GAO Shang, GENG Zongchao, WU Yueqin, WANG Ziguang, KANG Renke.
Surface Integrity of Quartz Glass Induced by Ultra-precision Grinding
[J]. Journal of Mechanical Engineering, 2019, 55(5): 186-195.
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[12] |
YAO Peng, WANG Wei, HUANG Chuanzhen, ZHU Hongtao.
Analytical Model for the Elastic Stress Field during Scratching and Controllable Precision Grinding Mechanisms of Fused Silica
[J]. Journal of Mechanical Engineering, 2018, 54(21): 191-204.
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[13] |
YIN Shaohui, GONG Sheng, HE Bowen, CHEN Fengjun, YIN Ziqiang, CAO Chengguo.
Development on Synergistic Process and Machine Tools Integrated Inclined Axis Grinding and Magnetorheological Polishing for Small Aspheric Surface
[J]. Journal of Mechanical Engineering, 2018, 54(21): 205-211.
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[14] |
WANG Ningchang, JIANG Feng, HUANG Hui, XU Xipeng.
Review on Brittle Material Subsurface Damage Detection Technology
[J]. Journal of Mechanical Engineering, 2017, 53(9): 170-179.
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[15] |
GAO Shang, ZHU Lianglong, KANG Renke, GUO Dongming, WANG Ziguang, ZHANG Bi.
Surface/Subsurface Damage and Material Removal Mechanism of Glass-ceramics Induced by Ultra-precision Grinding
[J]. Journal of Mechanical Engineering, 2017, 53(7): 180-188.
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