[1] |
LIANG Yu, LU Guoquan, MEI Yunhui.
Thermo-oxygen/Hygrothermal Aging of SiC/Epoxy Resin Composite as an Insulating Coating with Nonlinear Conductivity
[J]. Journal of Mechanical Engineering, 2024, 60(6): 207-217.
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[2] |
WANG Meiyu, ZHANG Haobo, HU Weibo, MEI Yunhui.
Review on the through Silicon Via Technology in the 3D-system in Package (3D-SiP)
[J]. Journal of Mechanical Engineering, 2024, 60(19): 261-276.
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[3] |
YAO Dan, ZHANG Jie, WANG Ruiqian, XIAO Xinbiao.
Analysis of the Influence of Damping Treatment on Sound Insulation Characteristics of Aluminum Extruded Structures
[J]. Journal of Mechanical Engineering, 2024, 60(18): 299-309.
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[4] |
CHEN Xuejun, FANG Yanan, NIE Wenpeng, LIU Kai, CAI Guoqiang, GAO Bo, GAO Guoqiang, WU Guangning.
Study on Thermal Aging and Simulation of Oil-paper Insulation for Traction Transformers
[J]. Journal of Electrical Engineering, 2023, 18(3): 109-116.
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[5] |
LIN Yibin, CHEN She, JIN Yuxiao, ZHONG Lipeng, SUN Qiuqin, WANG Feng.
Simulation Research of Cable Insulation Defect Detection Based on Electrical Capacitance Tomography
[J]. Journal of Electrical Engineering, 2023, 18(3): 54-62.
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[6] |
ZHANG Shuye, DUAN Xiaokang, LUO Keyu, XU Sunwu, ZHANG Zhihao, CHEN Jieshi, HE Peng.
Current Status of Electronic Packaging Materials Using Machine Learning
[J]. Journal of Mechanical Engineering, 2023, 59(22): 222-233.
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[7] |
XIAO Yong, WANG Yang, ZHAO Honggang, YU Dianlong, WEN Jihong.
Research Progress of Acoustic Metamaterials for Vibration and Noise Reduction Applications
[J]. Journal of Mechanical Engineering, 2023, 59(19): 277-298.
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[8] |
WANG Shuaixing, XIAO Yong, TANG Yanning, WU Jian, TENG Wanxiu, WEN Jihong.
Sound Insulation Mechanisms and Behavior of Lightweight Metamaterial Plate
[J]. Journal of Mechanical Engineering, 2023, 59(15): 94-109.
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[9] |
Caroline Krause, Stephan Frei.
Frequency-selective Optimization of Periodic Gate Control Signals in DC/DC Converters for EMI-reduction
[J]. Chinese Journal of Electrical Engineering, 2022, 8(4): 11-18.
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[10] |
JIA Qiang, ZOU Guisheng, ZHANG Hongqiang, WANG Wengan, DENG Zhongyang, REN Hui, LIU Lei, PENG Peng, GUO Wei.
Research Progress in Sintering-bonding with Nanoparticle Materials as Interlayer and Its Packaging Application
[J]. Journal of Mechanical Engineering, 2022, 58(2): 2-16.
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[11] |
ZHANG Wenwu, PAN Hao, MA Qiuchen, LI Mingyu, JI Hongjun.
Review of Power Ultrasonic Micro-nano Joining Technology for Electronic Manufacturing
[J]. Journal of Mechanical Engineering, 2022, 58(2): 100-121.
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[12] |
WU Yongchao, WANG Shuaiqi, GUO Wei, LIU Lei, ZOU Guisheng, PENG Peng.
Patterning Deposition of Nano-sliver Micro Bumps Array by Ultrafast Laser and Its Chip Packaging Research
[J]. Journal of Mechanical Engineering, 2022, 58(2): 166-175.
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[13] |
GAO Liyin, LI Caifu, LIU Zhiquan, SUN Rong.
Research Progress on the Reliability of Solder Joint for Advanced Microelectronic Packaging
[J]. Journal of Mechanical Engineering, 2022, 58(2): 185-202.
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[14] |
LIU Zhibin, QIAO Yuanyuan, ZHAO Ning.
Effect of Zn Content on Interfacial Reactions of Cu/Sn/Cu-xZn Micro Solder Joints
[J]. Journal of Mechanical Engineering, 2022, 58(2): 269-275.
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[15] |
YIN Limeng, SU Zilong, ZUO Cunguo, ZHANG Zhongwen, YAO Zongxiang, WANG Gang, WANG Shanlin, CHEN Yuhua.
Experiment and Numerical Simulation of Shear Creep of Cu/SAC305/Cu Microscale Solder Joints
[J]. Journal of Mechanical Engineering, 2022, 58(2): 300-306.
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