Design and Thermal Performance Investigation of Thermal Diode Based on the Asymmetric Flow Resistance

doi:10.3901/JME.2024.18.208

Abstract

Abstract: The heat transfer direction of traditional heat pipe depends on the temperature gradient. When the temperature of condenser is higher than that of the evaporator, heat will be transferred from the original condenser to the original evaporator, leading to the overheating of electronic component. To solve this problem, a novel thermal diode based on asymmetric wetting microstructure, which can realize the unidirectional heat transfer with a long distance due to the unidirectional fluid transport induced by the asymmetric flow resistance, is proposed. The asymmetric wetting microstructure is fabricated by the laser etching method. The asymmetric flow resistance is calculated and the heat transfer mechanism along the forward and reversed directions is analyzed. The effect of heating power, filling ratio and inclined angle on the thermal performance of thermal diode is experimental investigated. Results show that when the filling ratio is 16.7% and the heating power is in the range of 3W -5W, the unidirectional heat transfer performance is relative good. When the heating power is 4W, the reversed thermal resistance of proposed thermal diode can reach 4 times as the forward thermal resistance. This contribution designs a thermal diode based on the asymmetric flow resistance, which can provide a new strategy for the study of unidirectional heat transfer/dissipation devices.

Key words: thermal diode, bionic design, asymmetric microstructure, thermal performance

CLC Number:

TK172

HUANG Jiale, LI Ping, DENG Liangming, CHEN Zhipeng, ZHOU Wei, XIANG Jianhua. Design and Thermal Performance Investigation of Thermal Diode Based on the Asymmetric Flow Resistance[J]. Journal of Mechanical Engineering, 2024, 60(18): 208-217.

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