Abstract:

In order to improve the isothermal performance of isothermal chamber, the influence of the distribution of thin copper wire on the heat conduction enhancement from the wall to internal based on topological methods is studied. The heat conduction model is established, and the temperature fields and the center temperature are calculated under the condition that the copper wire is stuffed uniformly. Under the circumstance that the temperature of the container wall, the initial temperature in the center and the average stuffed density of thin copper wire are certain, taking the maximum of the center temperature as the optimization objective after 15 s heat conduction, the linear variable density filling method and the adaptive growth method are used respectively to optimize the distribution of copper wire. Compared with the uniformly filled, the results of the center temperature are increased 0.6 ℃ and 2.62 ℃ respectively, moreover the corresponding copper wire porosity distribution curves are obtained. The copper wire in the isothermal chamber is layered filled based on the optimized results and the verification experiments are carried out. From the experiment results, it is verified that changing the distribution of copper wire could enhance the heat conduction from the wall to internal and the filling scheme could improve the isothermal performance of isothermal isothermal.

Key words: heat transfer enhancement, isothermal performance, porous media, isothermal chamber