Development Status and Perspective Trend of Thermal Diodes and Its Thermal Control Functional Structure Manufacture

doi:10.3901/JME.2024.20.271

Abstract

Abstract: With the advancement of technology, there is a growing need for effective thermal control of high-power density devices like 5G chips and IGBT. Not only the temperature of the heat source needs to be controlled accurately to avoid being too high, but also the path of heat transfer should be controlled to prevent the devices from damaging due to heat countercurrent. While traditional phase change thermal control devices such as heat pipes have impressive thermal conductivity, they are limited by their isotropic heat transfer property. In contrast, thermal diodes can transmit heat in one direction with significant differences in thermal conductivity between the positive and negative directions. This unique ability makes them well-suited for electronic equipment thermal control, energy storage, building heat dissipation, and other applications. A comprehensive review of different types of thermal diodes across various fields was presented in this work, including their principles, advantages, disadvantages, and applications. Quantitative research was used to compare different types of thermal diodes, highlighting the advantages of phase change thermal diodes for superior heat transfer performance. The functional surface structure manufacturing processing and packaging processes of phase change thermal diodes were also discussed. The existing problems and development trends in related fields were identified and the research trend and development of the phase change thermal diode were prospected.

Key words: thermal diodes, phase change heat transfer, surface functional structure, heat control, heat management

CLC Number:

TK124

SHAO Changkun, TANG Yong, CHEN Gong, YU Shudong, YAN Caiman, DING Xinrui, YUAN Wei, ZHANG Shiwei. Development Status and Perspective Trend of Thermal Diodes and Its Thermal Control Functional Structure Manufacture[J]. Journal of Mechanical Engineering, 2024, 60(20): 271-288.

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