State-of-the-art and Prospectives of Ultra-precision Grinding Technology for Semiconductor Substrates

doi:10.3901/JME.2023.19.299

Abstract

Abstract: Semiconductor substrates such as monocrystalline silicon, silicon carbide, gallium oxide, and gallium nitride are widely used in the manufacture of semiconductor devices, including integrated circuits, power devices, and microsensors. Ultra-precision grinding is the critical technology for flattening and thinning semiconductor substrates, exerting a significant influence on the machining efficiency and quality of semiconductor devices. To fulfill the requirements of semiconductor devices, there is an increasing variety of semiconductor materials, and the machining demands for semiconductor substrates are continuously advancing. As a result, it consistently present new challenges to the ultra-precision grinding technology utilized in semiconductor substrate manufacturing. In order to realize high-efficiency and high-quality in the grinding of semiconductor substrates, it is imperative to acquire a comprehensive and in-depth understanding of ultra-precision grinding theory, machining process, grinding wheel and equipment. A comprehensive discussion and summarization of the research status of material removal mechanism, surface quality and its control methods are presented, which delves into the realm of high-efficiency low-damage grinding process and ultra-precision grinding equipment used for semiconductor substrates. Offering insights into upcoming research directions for semiconductor substrate ultra-precision grinding technology is made possible through a comprehensive examination of present obstacles and prospective development patterns.

Key words: semiconductor substrate, grinding, mechanism, machining process, grinding wheel, grinding equipment

CLC Number:

TG156

GUO Dongming, KANG Renke. State-of-the-art and Prospectives of Ultra-precision Grinding Technology for Semiconductor Substrates[J]. Journal of Mechanical Engineering, 2023, 59(19): 299-329.

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