Through-glass Via Metallization Based on Electric-field-driven Jet Microscale 3D Printing Technology

doi:10.3901/JME.260294

Abstract

Abstract: Through-glass via (TGV) technology is an important approach for three-dimensional heterogeneous integration in the development of integrated circuit. However, the procedures are complex and the cost is high in the traditional TGV metallization processes, which cannot satisfy the low-cost and fast production in the new product design stage. Especially, when the via diameters on a substrate are varied or the depth-to-width ratio is high, it is difficult to realize TGV metallization. A new approach based on electric field-driven (EFD) jet micro-3D printing is proposed for the TGV metallization. Nano-silver paste with high-solid-content (90wt%) is used as printing material. The filling process is started from the bottom until the via is completely filled. The printing and pre-curing parameters are optimized combined with three nozzle lifting patterns. Finally, TGV metallization with varying diameters on a substrate and a high depth-to-width ratio is achieved. Microstructure, conductivity and reliability are studied. The filled vias exhibit dense microstructure, good conductivity and reliability. It is demonstrated that the new approach can realize TGV metallization with high performance, which provides a low-cost and rapid solution for the new product design and small-batch production of TGV substrates.

Key words: 3D packaging, micro-scale 3D printing, additive manufacturing, through-glass via, metallization

CLC Number:

TN405.97

HUANG Junjie, WU Na, XU Quan, ZHU Xiaoyang, WANG Yongqiang, LI Hongke, LAN Hongbo. Through-glass Via Metallization Based on Electric-field-driven Jet Microscale 3D Printing Technology[J]. Journal of Mechanical Engineering, 2026, 62(13): 418-433.

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URL: http://www.cjmenet.com.cn/EN/10.3901/JME.260294

http://www.cjmenet.com.cn/EN/Y2026/V62/I13/418

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