Laser Micromachining of Heterogeneous Multi-layer Composite Materials:A Review

doi:10.3901/JME.2025.01.305

Abstract

Abstract: High-end printed circuit board is the typical heterogeneous multilayer composite material. The quality of microstructures such as holes, slots, circuits, and patterns directly determine the operational performance of electronic devices in semiconductors, aerospace, 5G/6G communications, and supercomputing. With the increasing complexity of printed circuit board materials and processing quality evaluation systems, the miniaturization of processing scales, and the high requirements for processing quality such as consistency and reliability, laser processing of high-end PCB is confronted with great challenges. This article provides a comprehensive review of the research progress in laser micromachining technology for heterogeneous multilayer composite materials. It systematically analyzes the technological changes brought about by new materials and extreme-scale structures in laser micromachining processes and identifies the technical challenges and future development directions. The aim is to provide guidance and reference for the manufacture of microstructures in high-end printed circuit boards through laser processing.

Key words: printed circuit board, heterogeneous, composite material, microstructure, laser

CLC Number:

TG156

ZHENG Lijuan, SUN Yong, XU Xiangqian, YU Juman, WANG Jun, WANG Chengyong. Laser Micromachining of Heterogeneous Multi-layer Composite Materials:A Review[J]. Journal of Mechanical Engineering, 2025, 61(1): 305-325.

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