The Localization and Roughness Analysis of Pulsed Jet Electrochemical Machining on Copper Surface

doi:10.3901/JME.2022.07.258

Abstract

Abstract: Jet electrochemical machining (Jet-ECM) is a ultra-precision machining method that is widely used in microstructure processing. However, the localization and surface roughness of Jet-ECM may not meet the needs of the high-precision machining process. Appropriate electrolyte and pulse power parameters can improve the localization and surface roughness of Jet-ECM processing. However, it is very difficult to obtain the appropriate parameters based on trial and error. According to the mechanism of electrochemical reactions and electric double-layer (EDL), the Jet-ECM system is equivalent to the RC circuit which can be used to guide the selection of processing parameters. The results show that pulsed Jet-ECM has a higher localization than Jet-ECM with direct current (DC) power. When the pulse power parameters are 6.5 V, 10 kHz, 50% duty ratio, the localization increased 36% compared with the DC power. Reducing the voltage and duty ratio can effectively improve the machining localization. The surface quality is opposite to the localization, reducing the voltage and duty ratio are not conducive to the formation of the viscous film on the workpiece surface. The lack of the viscous film causes the surface roughness deterioration. This study helps to understand the mechanism in Jet-ECM of Cu, and guides the further use of Jet-ECM in industry.

Key words: jet electrochemical machining, pulse power, electric double-layer, localization, surface roughness

CLC Number:

TG156

WANG Ke, ZHOU Ping, YAN Ying, ZHANG Chao, GUO Dongming. The Localization and Roughness Analysis of Pulsed Jet Electrochemical Machining on Copper Surface[J]. Journal of Mechanical Engineering, 2022, 58(7): 258-266.

References

[1] HOLMES S,KLUGMAN A,KRAATZ P. Copper mirror surfaces for high power infrared lasers[J]. Applied optics,1973,12(8):1743-1745.
[2] WANG K,YAN Y,ZHOU P,et al. Preparation of flat and smooth copper surface by jet electrochemical machining and electrochemical polishing[J]. Journal of the Electrochemical Society,2020,167(16):163501.
[3] 刘敏,杨自鹏,张丽娜,等. 铜及铜合金真空扩散焊接工艺优化及接头组织性能分析[J]. 航天制造技术,2018(2):49-51,56. LIU Min,YANG Zipeng,ZHANG Lina,et al. Vacuum diffusion welding technology optimization and microstructure analysis of copper and copper-alloy[J]. Aerospace Manufacturing Technology. 2018(2):49-51,56.
[4] 张朝阳,秦昌亮,冯钦玉,等. 脉冲激光电化学复合的定域性研究及三维微细刻蚀加工[J]. 机械工程学报, 2014,50(23):200-206. ZHANG Zhaoyang,QIN Changliang,FENG Qinyu,et al. Investigation on localization and three-dimensional micro-etching based on pulse laser electrochemical machining[J]. Journal of Mechanical Engineering,2014,50(23):200-206.
[5] 严广和,姜晨,张勇斌,等. 50μm级D形硬质合金微铣刀铣削纯铜试验研究[J]. 电子科技,2021,34(01):36-42. YAN Guanghe,JIANG Chen,ZHANG Yongbin,et al. Experimental study on milling pure copper with 50μm D-shaped cemented carbide micro-milling cutter[J]. Electronic Science and Technology,2021,34(01):36-42.
[6] LIU Y,QU N S. Obtaining high surface quality in electrolyte jet machining TB6 titanium alloy via enhanced product transport[J]. Journal of Materials Processing Technology,2020,276:116381.
[7] MING P M,LI X,ZHANG X,et al. Study on kerosene submerged jet electrolytic micromachining[J]. Procedia CIRP,2018,68:432-437.
[8] KOZAK J,RAJURKAR K P,BALKRISHNA R. Study of electrochemical jet machining process[J]. Journal of Manufacturing Science and Engineering-Transactions of the ASME,1996,118:490-498.
[9] LIU W,LUO Z,KUNIEDA M. Electrolyte jet machining of Ti1023 titanium alloy using NaCl ethylene glycol-based electrolyte[J]. Journal of materials Processing Technology,2020,283:116731.
[10] MITCHELL-SMITH J,SPEIDEL A,CLARE A T. Transitory electrochemical masking for precision jet processing techniques[J]. Journal of Manufacturing Processes,2018,31:273-285.
[11] CHEN X L,DONG B Y,FAN G C,et al. Investigation on modified jet electrochemical machining of micro-channel[J]. International Journal of Advanced Manufacturing Technology,2019,104(9-12):4433-4443.
[12] LIU W D,LUO Z,LI Y,et al. Investigation on parametric effects on groove profile generated on Ti1023 titanium alloy by jet electrochemical machining[J]. International Journal of Advanced Manufacturing Technology,2019,100(9-12):2357-2370.
[13] SAXENA K K,QIAN J,REYNAERTS D. A tool-based hybrid laser-electrochemical micromachining process :Experimental investigations and synergistic effects[J]. International Journal of Machine Tools and Manufacture,2020,155:103569.
[14] CHEN X L,DONG B Y,ZHANG C Y,et al. Jet electrochemical machining of micro dimples with conductive mask[J]. Journal of Materials Processing Technology,2018,257:101-111.
[15] WU M,LIU J W,HE J F,et al. Fabrication of surface microstructures by mask electrolyte jet machining[J]. International Journal of Machine Tools and Manufacture,2020,148:103471.
[16] 孙雅洲,梁迎春,程凯. 微米和中间尺度机械制造[J].机械工程学报,2004,40(5):1-6. SUN Yazhou,LIANG Yingchun,CHENG Kai. Micro-scale and meso-scale mechanical manufacturing[J]. Journal of Mechanical Engineering,2004,40(5):1-6.
[17] HUNG J C,LIU J H,FAN Z W. Fabrication of microscale concave and grooves through mixed-gas electrochemical jet machining[J]. Precision Engineering,2019,55:310-321.
[18] LIU G,ZHANG Y,NATSU W. Influence of electrolyte flow mode on characteristics of electrochemical machining with electrolyte suction tool[J]. International Journal of Machine Tools and Manufacture,2019,142:66-75.
[19] KAWANAKA T,KUNIEDA M. Mirror-like finishing by electrolyte jet machining[J]. CIRP Annals,2015,64(1):237-240.
[20] GLARUM S H,MARSHALL J H. The anodic dissolution of copper into phosphoric acid:II. impedance behavior[J]. Journal of the Electrochemical Society,1985,132(12):2878-2885.
[21] PAZ-GARCIA J M,JOHANNESSON B,OTTOSEN L M,et al. Modeling of electric double-layers including chemical reaction effects[J]. Electrochimica Acta,2014,150:263-268.
[22] SCHUSTER R,KIRCHNER V,ALLONGUE P,et al. Electrochemical micromachining[J]. Science,2000,289(5476):98-101.
[23] KIM B H,NA C W,LEE Y S,et al. Micro electrochemical machining of 3D micro structure using dilute sulfuric acid[J]. CIRP Annals,2005,54(1):191-194.
[24] ZHANG Z Y,ZHU D,QU N S,et al. Theoretical and experimental investigation on electrochemical micromachining[J]. Microsystem Technologies,2007,13(7):607-612.
[25] HULETT L D,YOUNG F W. Ledge formation on the (111) surface of copper[J]. Journal of the Electrochemical Society,1966,113(5):410.
[26] WU Y F,TSAI T H,LIN J Y. Some aspects of mechanism of electropolishing of copper in phosphoric acid[J]. International Journal of Electrochemical Science,2019,14:11035-11047.
[27] FANG J L,WU N J. Determination of the composition of viscous liquid film on electropolishing copper surface by XPS and AES[J]. Journal of the Electrochemical Society,1989,136:3800-3803.
[28] 王维,朱荻,曲宁松,等. 管电极电解加工工艺过程稳定性研究[J]. 机械工程学报,2010,46(11):179-184. WANG Wei,ZHU Di,QU Ningsong,et al. Investigation on the process stability of electrochemical drilling[J]. Journal of Mechanical Engineering,2010,46(11):179-184.