Reliability in Electronic Packaging: Past, Now and Future

doi:10.3901/JME.2021.16.248

Abstract

Abstract: Electronic packaging is the key step that make chips become functional devices. Many different types of materials are involved in this step, majority of which show non-linear mechanical behaviors with significant temperature dependency and strain rate dependency. During the processes, the interactions between loads from the environment and devices are multi-scale and multi-physics in nature. This also poses new requirements on modeling and simulation techniques in electronic packaging. As for reliability validation, typical failure modes in electronic packaging include thermal-mechanical coupling failure and electrical-thermal-mechanical coupling failure and so on. With the development of new packaging materials and technologies, new approaches are in demand in experimental methodology and modeling and co-design techniques.

Key words: electronic packaging, reliability, packaging materials, modeling, failure mechanisms, LED, power devices, integrated circuit

CLC Number:

TG156

CHEN Zhiwen, MEI Yunhui, LIU Sheng, LI Hui, LIU Li, LEI Xiang, ZHOU Ying, GAO Xiang. Reliability in Electronic Packaging: Past, Now and Future[J]. Journal of Mechanical Engineering, 2021, 57(16): 248-268.

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