Application Challenges and Research Progress of Copper Sintering for Power Module Packaging

doi:10.3901/JME.260041

Abstract

Abstract: Benefit by its excellent performance and higher theoretical operating temperature, the third-generation semiconductor has been widely used in power devices, and the chip connection layer materials have also put forward strict requirements such as high temperature service and high reliability, and traditional packaging materials have been difficult to meet the needs of use. Because of its excellent electrical and thermal conductivity and good service reliability of its sintered joints, nano-copper is considered to be one of the potential options for packaging materials in the future, but it faces many problems and challenges in application, such as immature particle preparation technology, unstable storage of copper paste, and easy oxidation during sintering and service. The existing solutions to the application challenges currently faced by nano-copper sintering has been reviewed from three aspects:the preparation of nano-copper particles and the selection of organic substances in sintering-type copper pastes, the design of particle structure and the selection of sintering atmosphere. It discusses the effects, mechanisms, limitations and future application prospects of different strategies in avoiding oxidation during copper sintering. It focuses on analyzing the roles, advantages and limitations of three anti-oxidation methods in each stage of copper sintering application, as well as their synergistic effects in the entire copper sintering process. The aim is to promote the copper sintering technology to meet the challenges of oxidation and accelerate its application in the packaging of high-performance and high-power modules such as SiC chips.

Key words: the third generation semiconductor, sintered copper, anti-oxidation, high-temperature reliability

CLC Number:

TG44

ZHU Ruikang, JIA Qiang, WANG Yishu, ZHANG Hongqiang, MA Limin, ZOU Guisheng, GUO Fu. Application Challenges and Research Progress of Copper Sintering for Power Module Packaging[J]. Journal of Mechanical Engineering, 2026, 62(2): 115-130.

References

[1] BILIR B,YILMAZ M. Determination of power transfer capability by a bisection-like algorithm via power-flow solutions[C] //2019 IEEE Texas Power and Energy Conference(TPEC). IEEE,2019:1-6.
[2] MAHESH M,KUMAR K V,ABEBE M,et al. A review on enabling technologies for high power density power electronic applications[J]. Mater. Today. Proc.,2021,46:3888-3892.
[3] 刘强.面向第三代半导体的新型原位铜膏制备及互连工艺研究[D].广州:广东工业大学,2022.LIU Qiang. Study on the preparation and interconnect technology of a new in situ copper paste for the third generation semiconductor[D]. Guangzhou:Guangdong University of Technology,2022.
[4] KOVACIC I,BRENNAN M J,WATERS T P. A study of a nonlinear vibration isolator with a quasi-zero stiffness characteristic[J]. Journal of Sound and Vibration,2008,315(3):700-711.
[5] PHAN H P,DAO D V,NAKAMURA K,et al.The piezoresistive effect of Si C for MEMS sensors at high temperatures:A review[J]. Journal of Microelectromechanical Systems, 2015, 24(6):1663-1677.
[6] 麦玉冰,谢欣荣.第三代半导体材料碳化硅(Si C)研究进展[J].广东化工,2021,48(9):151-152.MAI Yubing,XIE Xinrong. Research progress of silicon carbide(SiC),a third-generation semiconductor material[J]. Guangdong Chem. Ind.,2021,48(9):151-152.
[7] BUTTAY C,PLANSON D,ALLARD B,et al. State of the art of high temperature power electronics[J].Materials Science and Engineering:B,2011,176(4):283-288.
[8] GUO X,XUN Q,LI Z,et al. Silicon carbide converters and MEMS devices for high-temperature power electronics:A critical review[J]. Micromachines,2019,10(6):1-26.
[9] NAVARRO L A,PERPINA X,GODIGNON P,et al.Thermomechanical assessment of die-attach materials for wide bandgap semiconductor devices and harsh environment applications[J]. IEEE Transactions on Power Electronics,2014,29(5):2261-2271.
[10] 徐永哲.无压烧结焊膏电化学迁移机理研究[D].哈尔滨:哈尔滨理工大学,2023.XU Yongzhe. Study on electrochemical migration mechanism of non-pressure sintering solder paste[D].Harbin:Harbin University of Science and Technology,2023.
[11] 杨静,徐瑶.浅谈电子电气产品--Ro HS发展历程[J].数字通信世界,2021,10:17.YANG Jing,XU Yao. Introduction to electrical and electronic products-RoHS development history[J]. Digital Communication World,2021,10:17.
[12] KOBAYASHI T,MITSUI K,SHOHJI I. Effects of Ni addition to Sn–5Sbhigh-temperature lead-free solder on its microstructure and mechanical properties[J]. Materials Transactions,2019,60(6):888-894.
[13] MURATA A,KUME Y,HASHIMOTO F. Application of catastrophe theory to forced vibration of a diaphragm air spring[J]. Journal of Sound and Vibration,1987,112(1):31-44.
[14] WU C M L,YU D Q,LAW C M T,et al. Properties of lead-free solder alloys with rare earth element additions[J]. Materials Science&Engineering R Reports,2004,44(1):1-44.
[15] MCCLUSKEY F P,WANG Z,DASH M,et al. Reliability of high temperature lead-free solder alternative[C] //20061st Electronic Systemintegration Technology Conference.IEEE,2006,1:444-447.
[16] IVEY D G. Microstructural characterization of Au/Sn solder for packaging in optoelectronic Applications[J].Micron,1998,29(4):281-287.
[17] HSIAO C H,KUNG W T,SONG J M,et al. Development of Cu-Ag pastes for high temperature sustainable bonding[J]. Materials Science and Engineering:A,2017,684:500-509.
[18] MANIKAM V R,CHEONG K Y. Die attach materials for high temperature applications:A review[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology,2011,1(4):457-478.
[19] CUI Z,JIA Q,ZHANG H,et al. Review on shear strength and reliability of nanoparticle sintered joints for power electronics packaging[J]. Journal of Electronic Materials,2024,53(6):2703-2726.
[20] LI Y,WONG C P. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging:Materials, processing, reliability and applications[J]. Materials Science and Engineering:R:Reports,2006,51(1-3):1-35.
[21] BAI J G,LU G Q. Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly[J]. IEEE Transactions on Device and Materials Reliability,2006,6(3):436-441.
[22] MA L M, WANG Y C, JIA Q, et al.Low-temperature-sintered nano-Ag film for power electronics packaging[J]. Journal of Electronic Materials,2024,53:228-237.
[23] 梅云辉.低温烧结纳米银焊膏电迁移和粘接热弯曲性能研究[D].天津:天津大学,2010.MEI Yunhui. Study on electromigration and bonding thermal bending properties of low temperature sintered nano silver solder paste[D]. Tianjin:Tianjin University,2010.
[24] ZHANG H,BAI H,JIA Q,et al. Stabilizing the sintered nanopore bondline by residual organics for high temperature electronics[J]. Microelectronics Reliability,2020,111:113727.
[25] PAKNEJAD S A, DUMAS G, WEST G, et al.Microstructure evolution during 300℃storage of sintered Ag nanoparticles on Ag and Au substrates[J]. J.Journal of Alloys and Compounds,2014,617:994-1001.
[26] ZHANG H,HE S,QU G,et al. Improved thermal conductivity and reliability through graphene reinforced nanopaste for power devices in new energy vehicles[J].IEEE Transactions on Components, Packaging and Manufacturing Technology,2023,14(1):52-60.
[27] YIN C,WUNAERAILI K,ZHANG Y,et al. Novel Ag-Cu foam sheet with multi-layer composite structure for high performance joining of SiC power chips[J].Materials Characterization,2024,209:113696.
[28] ZHANG H,ZHANG H,JIA Q,et al. Novel SiC-based power device bonding materials of nano foam sheet and its characteristic and properties[J]. IEEE Transactions on Components,Packaging and Manufacturing Technology,2023,13(6):897-905.
[29] QU G,DENG Z,GUO W,et al. The heat-dissipation sintered interface of power chip and heat sink and its high-temperature thermal analysis[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology,2023,13(6):816-822.
[30] LI J,LIANG Q,SHI T,et al. Design of Cu nano aggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding[J]. J. Alloy. Compd.,2019,772:793-800.
[31] ZUO Y,SHEN J,XIE J,et al. Influence of Cu micro/nano-particles mixture and surface roughness on the shear strength of Cu-Cu joints[J]. Journal of Materials Processing Technology,2018,257:250-256.
[32] 牛雨萌,赖奕坚,赵斌元,等.微纳米铜粉的制备工艺与应用特性[J].功能材料,2018,49(5):5041-5048.NIU Yumeng,LAI Yijian,ZHAO Binyuan,et al.Preparation process and application characteristics of micro and nano copper powders[J]. Journal of Functional Materials,2018,49(5):5041-5048.
[33] 赖韬.面向半导体封装互连纳米铜粉的可控制备及低温烧结[D].广州:广东工业大学,2019.LAI Tao. Controlled preparation and low-temperature sintering of copper nanopowders for semiconductor package interconnects[D]. Guangzhou:Guangdong University of Technology,2019.
[34] KE X,XIE B,ZHAO C,et al. Study on the resistivity and porosity of nano copper powder under low-temperature sintering without pressure[C] //202320th China International Forum on Solid State Lighting&20239th International Forum on Wide Bandgap Semiconductors(SSLCHINA:IFWS). IEEE,2023:139-143.
[35] YU W, XIE H, CHEN L, et al. Synthesis and characterization of monodispersed copper colloids in polar solvents[J]. Nanoscale Research Letters,2009,4(5):465-470.
[36] YU W,XIE H,CHEN L,et al. Investigation on the thermal transport properties of ethylene glycol-based nanofluids containing copper nanoparticles[J]. Powder Technology,2010,197(3):218-221.
[37] ZONG Y,HE X,ZHU D,et al. Sequential two-step reduction of high-purity nano copper with glucose and ascorbic acid for the synthesis of nano silver-coated copper[J]. Transactions of the Indian Institute of Metals,2024,77(4):955-963.
[38] CHEN L,ZHANG D,CHEN J,et al. The use of CTAB to control the size of copper nanoparticles and the concentration of alkylthiols on their surfaces[J]. Materials Science and Engineering:A,2006,415(1-2):156-161.
[39] HUANG H J,WU X,ZHOU M B,et al. Superior strength and strengthening mechanism of die attachment joints by using bimodal-sized Cu nanoparticle paste capable of low-temperature pressureless sintering[J]. Journal of Materials Science:Materials in Electronics,2021,32:3391-3401.
[40] KAMIKORIYAMA Y,IMAMURA H,MURAMATSU A,et al. Ambient aqueous-phase synthesis of copper nanoparticles and nanopastes with low-temperature sintering and ultra-high bonding abilities[J]. Scientific Reports,2019,9(1):899.
[41] SUGIYAMA T,KANZAKI M,ARAKAWA R,et al.Low-temperature sintering of metallacyclic stabilized copper nanoparticles and adhesion enhancement of conductive copper film to a polyimide substrate[J].Journal of Materials Science:Materials in Electronics,2016,27:7540-7547.
[42] IMAMURA H,KAMIKORIYAMA Y,MURAMATSU A,et al. A mild aqueous synthesis of ligand-free copper nanoparticles for low temperature sintering nanopastes with nickel salt assistance[J]. Scientific Reports,2021,11(1):24268.
[43] KE X,XIE B,ZHANG J,et al. Study on the preparation of ascorbic acid reduced ultrafine copper powders in the presence of different protectants and the properties of copper powders based on methionine protection[J].Nanoscale Advances,2024,6(4):1135-1144.
[44] GAO Y,LIW,CHEN C,et al. Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere[J]. Materials&Design, 2018, 160:1265-1272.
[45] XIAO N,LIU Y,LI K,et al. High strength die attaching structure fabricated via in situ reduction-sintering of micron copper paste[C] //202320th China International Forum on Solid State Lighting&20239th International Forum on Wide Bandgap Semiconductors(SSLCHINA:IFWS). IEEE,2023:136-138.
[46] NAMGOONG D,SIOW K S,LEE J H. Improvement of bondability by addition of carboxylic acid to the sinter-bonding paste containing bimodal-sized Cu particles and rapid bonding in air[J]. Metals and Materials International,2023,29(2):457-466.
[47] NAMGOONG D,KIM Y,SIOW K S,et al. Superior sinterability of copper oxalate-coated Cu particles in a double reductant system and rapid compression sinter-bonding characteristics between Cu finishes[J].Journal of Materials Research and Technology,2023,24:2332-2345.
[48] KIM M I,LEE J H. Die sinter bonding in air using Cu@Ag particulate preform and rapid formation of near-full density bondline[J]. Journal of Materials Research and Technology,2021,14:1724-1738.
[49] WANG X,ZHANG Z,FENG Y,et al. Anti-oxidative copper nanoparticle paste for Cu–Cu bonding at low temperature in air[J]. Journal of Materials Science:Materials in Electronics,2022,33(2):817-827.
[50] MOU Y,PENG Y,ZHANG Y,et al. Cu-Cu bonding enhancement at low temperature by using carboxylic acid surface-modified Cu nanoparticles[J]. Materials Letters,2018,227:179-183.
[50] MOU Y,LIU J,CHENG H,et al. Facile preparation of self-reducible Cu nanoparticle paste for low temperature Cu-Cu bonding[J]. JOM,2019,71:3076-3083.
[51] 王彦桥,刘晓阳,朱敏.叠层式3D封装技术发展现状[J].电子元件与材料,2013,32(10):67-70.WANG Yanqiao,LIU Xiaoyang,ZHU Min. Stacked 3D packaging technology development status[J]. Electronic Components and Materials,2013,32(10):67-70.
[52] HONG S,KIM N. Synthesis of 3D printable Cu-Ag core–shell materials:kinetics of CuO film removal[J].Journal of Electronic Materials,2015,44:823-830.
[53] KANG H Y,PENG C Y,WANG H P,et al. Preparation of Ag nanospheres filled with Cu[J]. Journal of Experimental Nanoscience,2015,10(12):937-946.
[54] ZHAO J,ZHANG D,ZHANG X. Preparation and characterization of copper/silver bimetallic nanowires with core-shell structure[J]. Surface and Interface Analysis,2015,47(4):529-534.
[55] KIM C K,LEE G J,LEE M K,et al. A novel method to prepare Cu@Ag core–shell nanoparticles for printed flexible electronics[J]. Powder Technol.,2014,263:1-6.
[56] TAN K S,CHEONG K Y. Mechanical properties of sintered Ag–Cu die-attach nanopaste for application on SiC device[J]. Materials&Design,2014,64:166-176.
[57] YAN J,ZOU G,ZHANG Y,et al. Metal-metal bonding process using Cu+Ag mixed nanoparticles[J]. Materials Transactions,2013,54(6):879-883.
[58] LIU J,MOU Y,PENG Y,et al. Facile preparation of Cu-Ag micro-nano composite paste for high power device packaging[C] //2020 IEEE 70th Electronic Components and Technology Conference(ECTC). IEEE, 2020:755-761.
[59] 寿奉粮,赵芳霞,杨博,等.电镀废液回收铜粉的化学镀银工艺及其电磁屏蔽性能[J].电子元件与材料,2012,31(11):71-74.SHOU Fengliang,ZHAO Fangxia,YANG Bo,et al.Chemical silver plating process of copper powder recovered from electroplating waste solution and its electromagnetic shielding performance[J]. Electronic Components and Materials,2012,31(11):71-74.
[60] 于雪艳,陈正涛,刘鹏,等.电磁屏蔽涂料的制备及性能评价[J].材料导报,2014,28(1):203-207.YU Xueyan, CHEN Zhengtao, LIU Peng, et al.Preparation and performance evaluation of electromagnetic shielding coatings[J]. Materials Reports,2014,28(1):203-207.
[61] PENG Y,YANG C,CHEN K,et al. Study on synthesis of ultrafine Cu-Ag core-shell powders with high electrical conductivity[J]. Applied Surface Science,2012,263:38-44.
[62] DAI X,XU W,ZHANG T,et al. Room temperature sintering of Cu-Ag core-shell nanoparticles conductive inks for printed electronics[J]. Chemical Engineering Journal,2019,364:310-319.
[63] LEE C,KIM N R,KOO J,et al. Cu-Ag core-shell nanoparticles with enhanced oxidation stability for printed electronics[J]. Nanotechnology,2015,26(45):455601.
[64] GROUCHKO M,KAMYSHNY A,MAGDASSI S.Formation of air-stable copper–silver core–shell nanoparticles for inkjet printing[J]. Journal of Materials Chemistry,2009,19(19):3057-3062.
[65] JIN X,MAO A,DING M,et al. A simple route to synthesize Cu@Ag Core–shell bimetallic nanoparticles and their surface-enhanced Raman scattering properties[J]. Applied Spectroscopy,2016,70(10):1692-1699.
[66] WANG K,WEN J,FENG J,et al. A novel Cu@Ag nano paste with low porosity for rapidly sintering in air condition[J]. Materials Characterization,2024,209:113762.
[67] 常英,刘彦军.片状镀银铜粉的制备及性能表征[J].化工新型材料,2005,33(4):56-58.CHANG Ying,LIU Yanjun. Preparation and performance characterization of silver-plated copper powder in flake form[J]. New Chemical Materials,2005,33(4):56-58.
[68] 廖辉伟,李翔,彭汝芳,等.包覆型纳米铜-银双金属粉研究[J].无机化学学报,2003,19(12):1327-1330.LIAO Huiwei,LI Xiang,PENG Rufang,et al. Study of coated nano copper-silver bimetallic powders[J]. Chinese Journal of Inorganic Chemistry,2003,19(12):1327-1330.
[69] 娄萃,蔡晓兰.银铜粉的研制及性能的研究[J].南方金属,2006(6):18-20.LOU Cui,CAI Xiaolan. Research on the development and properties of silver and copper powders[J]. Southern Metals,2006(6):18-20.
[70] 梅冰,乔学亮,王洪水,等.微米级铜粉化学镀银及抗氧化性分析[J].材料保护,2006,39(9):28-30.MEI Bing,QIAO Xueliang,WANG Hongshui,et al.Analysis of chemical silver plating and oxidation resistance of micron-size copper powder[J]. Materials Protection,2006,39(9):28-30.
[71] WILLIAMS P L,MISHIN Y,HAMILTON J C. An embedded-atom potential for the Cu-Ag system[J].Modelling and Simulation in Materials Science and Engineering,2006,14(5):817-833.
[72] GRAMMATIKOPOULOS P,KIOSEOGLOU J,GALEA A,et al. Kinetic trapping through coalescence and the formation of patterned Ag-Cu nanoparticles[J].Nanoscale,2016,8(18):9780-9790.
[73] TIAN Y,JIANG Z,WANG C,et al. Sintering mechanism of the Cu–Ag core–shell nanoparticle paste at low temperature in ambient air[J]. RSC Advances,2016,6(94):91783-91790.
[74] WON M,KIM D,YANG H,et al. Low-temperature sinterable Cu@Ag paste with superior strength driven by pre-heating process[J]. Energies,2023,16(14):5419.
[75] JI H,ZHOU J,LIANG M,et al. Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging[J]. Ultrasonics Sonochemistry,2018,41:375-381.
[76] 黄圆,杭春进,田艳红,等.纳米铜银核壳焊膏脉冲电流快速烧结连接铜基板研究[J].机械工程学报,2019,55(24):51-56.HUANG Yuan,HANG Chunjin,TIAN Yanhong,et al. A study of rapid sintering of copper substrates connected by pulsed-current nano-copper-silver core-shell solder paste[J]. Journal of Mechanical Engineering,2019,55(24):51-56.
[77] 吴卓寰,刘威,温志成,等.微米铜银复合结构与纳米银混合连接材料制备与高频感应快速烧结方法研究[J].机械工程学报,2022,58(2):26-33.WU Zhuohuan, LIU Wei, WEN Zhicheng, et al.Preparation of micrometer copper-silver composite structures with nanosilver hybrid connecting materials and high-frequency induction rapid sintering methodology research[J]. Journal of Mechanical Engineering,2022,58(2):26-33.
[78] BOCHICCHIO D, FERRANDO R. Morphological instability of core-shell metallic nanoparticles[J]. Physical Review B-Condensed Matter and Materials Physics,2013,87(16):165435.
[79] MUZIKANSKY A,NANIKASHVILY P,GRINBLAT J,et al. Ag dewetting in Cu@Ag monodisperse core–shell nanoparticles[J]. The Journal of Physical Chemistry C,2013,117(6):3093-3100.
[80] HAI H T,TAKAMURA H,KOIKE J. Oxidation behavior of Cu–Ag core–shell particles for solar cell applications[J].Journal of Alloys and Compounds,2013,564:71-77.
[81] CHOI E B,LEE J H. Dewetting behavior of Ag in Ag-coated Cu particle with thick Ag shell[J]. Applied Surface Science,2019,480:839-845.
[82] KIM Y,CHOI E B,LEE J H. Surface modification of Ag-coated Cu particles using dicarboxylic acids to enhance the electrical conductivity of sintered films by suppressing dewetting in Ag shells[J]. Applied Surface Science,2023,640:158326.
[83] WU R,ZHAO X,LIU Y. Atomic insights of Cu nanoparticles melting and sintering behavior in CuCu direct bonding[J]. Materials&Design,2021,197:109240.
[84] JEONG S,WOO K,KIM D,et al. Controlling the thickness of the surface oxide layer on Cu nanoparticles for the fabrication of conductive structures by ink-jet printing[J]. Advanced Functional Materials,2008,18(5):679-686.
[85] YAN J F,ZOU G S,HU A M,et al. Preparation of PVP coated Cu NPs and the application for low-temperature bonding[J]. Journal of Materials Chemistry,2011,21(40):15981-15986.
[86] 闫剑锋.纳米金属颗粒焊膏合成及其低温烧结连接研究[D].北京:清华大学,2013.YAN Jianfeng. Synthesis of metal nanoparticle solder paste and its low-temperature sintering connection study[D]. Beijing:Tsinghua University,2013.
[87] 钱靖.基于纳米铜封装工艺的器件性能及可靠性研究[D].桂林:桂林电子科技大学,2020.QIAN Jing. Device performance and reliability study based on nano-copper encapsulation process[D]. Guilin:Guilin University of Electronic Science and Technology,2020.
[88] WOO K,KIM D,KIM J S,et al. Ink-Jet printing of CuAg-based highly conductive tracks on a transparent substrate[J]. Langmuir,2009,25(1):429-433.
[89] PARK B K,KIM D,JEONG S,et al. Direct writing of copper conductive patterns by ink-jet printing[J]. Thin Solid Films,2007,515(19):7706-7711.
[90] YAMAKAWA T,TAKEMOTO T,SHIMODA M,et al.Influence of joining conditions on bonding strength of joints:efficacy of low-temperature bonding using Cu nanoparticle paste[J]. Journal of Electronic Materials,2013,42:1260-1267.
[91] GAO Y, ZHANG H, LI W, et al. Die bonding performance using bimodal Cu particle paste under different sintering atmospheres[J]. Journal of Electronic Materials,2017,46:4575-4581.
[92] 闫海东.甲酸辅助烧结纳米银无压连接IGBT芯片方法及可靠性[D].天津:天津大学,2017.YAN Haidong. Formic acid-assisted sintering of nanosilver pressureless connected IGBT chip method and reliability[D]. Tianjin:Tianjin University,2017.
[93] NISHIKAWA H,HIRANO T,TAKEMOTO T,et al.Effects of joining conditions on joint strength of Cu/Cu joint using Cu nanoparticle paste[J]. The Open Surface Science Journal,2011,3(1):60-64.
[94] GAO Y,LI W,CHEN C,et al. Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere[J]. Materials&Design,2018,160:1265-1272.
[95] MOU Y,LIU J,CHENG H,et al. Facile preparation of self-reducible Cu nanoparticle paste for low temperature Cu-Cu bonding[J]. JOM,2019,71:3076-3083.
[96] PENG Y,MOU Y,LIU J,et al. Fabrication of high-strength Cu–Cu joint by low-temperature sintering micron–nano Cu composite paste[J]. Journal of Materials Science:Materials in Electronics,2020,31:8456-8463.
[97] HERRING C. Diffusional viscosity of a polycrystalline solid[J]. Journal of Applied Physics,1950,21(5):437-445.
[98] BHOGARAJU S K,CONTI F,KOTADIA H R,et al.Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging[J]. Journal of Alloys and Compounds,2020,844:156043.
[99] ZUO Y,CARTER-SEARJEANT S,GREEN M,et al.High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles[J]. Materials Letters,2020,276:128260.
[100] MOU Y,PENG Y,ZHANG Y,et al. Cu-Cu bonding enhancement at low temperature by using carboxylic acid surface-modified Cu nanoparticles[J]. Materials Letters,2018,227:179-183.
[101] JEONG S,LEE S H,JO Y,et al. Air-stable,surface-oxide free Cu nanoparticles for highly conductive Cu ink and their application to printed graphene transistors[J]. Journal of Materials Chemistry C,2013,1(15):2704-2710.
[102] KOBAYASHI Y, ABE Y, MAEDA T, et al. A metal–metal bonding process using metallic copper nanoparticles produced by reduction of copper oxide nanoparticles[J]. Journal of Materials Research and Technology,2014,3(2):114-121.
[103] CHAMPION Y,BERNARD F,GUIGUE-MILLOT N,et al. Sintering of copper nanopowders under hydrogen:an in situ X-ray diffraction analysis[J]. Materials Science and Engineering:A,2003,360(1-2):258-263.
[104] HAQUE M M,CHO D,LEE C S. Investigation of sintering behavior of octanethiol-coated copper nano ink under various atmospheres[J]. Thin Solid Films,2013,536:32-38.
[105] LI J,YU X,SHI T,et al. Low-temperature and low-pressure Cu–Cu bonding by highly sinterable Cu nanoparticle paste[J]. Nanoscale Research Letters,2017,12:255.
[106] KOBAYASHI Y,SHIROCHI T,YASUDA Y,et al.Metal–metal bonding process using metallic copper nanoparticles prepared in aqueous solution[J].International Journal of Adhesion and Adhesives,2012,33:50-55.
[107] MOU Y,CHENG H,PENG Y,et al. Fabrication of reliable Cu-Cu joints by low temperature bonding isopropanol stabilized Cu nanoparticles in air[J].Materials Letters,2018,229:353-356.
[108] MATSUDA T,YAMAGIWA D,FURUSAWA H,et al.Reduction behavior of surface oxide on submicron copper particles for pressureless sintering under reducing atmosphere[J]. Journal of Electronic Materials,2022,51:1-7.
[109] 贾强,邹贵生,张宏强,等.纳米颗粒材料作中间层的烧结连接及其封装应用研究进展[J].机械工程学报,2022,58(2):2-16.JIA Qiang,ZOU Guisheng,ZHANG Hongqiang,et al.Advances in sintered connections with nanoparticle materials as intermediate layers and their encapsulation applications[J]. Journal of Mechanical Engineering,2022,58(2):2-16.
[110] MA L,LU Z,JIA Q,et al. Sintering mechanism of bimodal-sized Cu nanoparticle paste for power electronics packaging[J]. Journal of Electronic Materials,2024,53:2988-2998.
[111] 马立民,鲁子怡,贾强,等.面向功率器件封装的纳米铜烧结连接技术研究进展[J].稀有金属材料与工程,2024,53(1):296-320.MA Limin,LU Ziyi,JIA Qiang,et al. Advances in nano-copper sintered connection technology for power device packaging[J]. Rare Metal Materials and Engineering,2024,53(1):296-320.
[112] CUI Z,JIA Q,WANG Y,et al. Enhanced shear strength and microstructure of Cu-Cu interconnection by low-temperature sintering of Cu nanoparticles[J]. Journal of Materials Science:Materials in Electronics,2024,35(11):1-13.