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CN: 11-2187/TH
ISSN: 0577-6686
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Application Challenges and Research Progress of Copper Sintering for Power Module Packaging
ZHU Ruikang, JIA Qiang, WANG Yishu, ZHANG Hongqiang, MA Limin, ZOU Guisheng, GUO Fu
Journal of Mechanical Engineering . 2026, (
2
): 115 -130 . DOI: 10.3901/JME.260041
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