• CN：11-2187/TH
  • ISSN：0577-6686
机械工程学报

›› 1992, Vol. 28 ›› Issue (5): 88-92，1.

• 论文 • 上一篇    下一篇

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SMT软钎焊接头热循环力学行为研究

黄继华;姜以宏;钱乙余;王其隆   

  1. 北京科技大学;哈尔滨工业大学
  • 发布日期:1992-09-01

A STUDY ON MECHANICLA BEHAVIOUR OF SMT SOLDERED JOINTS UNDER THERML CYCLES

Hung Jihua;Jiang Yihong;Qian Yiyu;Wang Qilong   

  1. University of Science and Technology Beijing Harbin Institute of Technology
  • Published:1992-09-01

摘要： 应用粘背景性理论分析研究了SMT软钎焊接头热循环力学行为，并用热膨胀模拟加载试样进行了试验验证。研究结果表明：SMT软钎焊接头在热循环过程中的应力由全部热循环的温度历史决定，时间效应（变温速率、保温时间等）对软钎焊接头在热循环中的力学行为具有显著影响。随热循环温度升高和保温时间延长，钎焊接头内将发生显著的应力松弛。

关键词: 钎焊接头, 热疲劳, 软钎焊

Abstract: In this paper, the mechanical behaviour of Surface Mount Technology (SMT) solder joints under thermal cycles has been analyzed in the viscoelastic theory , and this has been verified by experiments on the simulated specimen. The results show that the stress of SMT solder joints under thermal cycles depends on the temperature history of thermal cycle, and there is a strong influence of the time effect, variating temperature rate and dwell time on the mechanical behavienr of SMT soldered joints under thermal cycles. With a rise in cycle temperature and the increase of dwell time, a notable stress relaxation will take place in SMT soldered joints.

Key words: 钎焊接头, 热疲劳, 软钎焊

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