• CN：11-2187/TH
  • ISSN：0577-6686
机械工程学报

›› 2010, Vol. 46 ›› Issue (3): 172-178.

• 论文 • 上一篇    下一篇

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电解转印法加工凹坑阵列结构试验研究

杜海涛;曲宁松;李寒松;钱双庆   

  1. 南京航空航天大学机电工程学院;南京航空航天大学江苏省精密与微细制造技术重点实验室
  • 发布日期:2010-02-05

Experiment Study on Machining Array Micro-pits in Electrochemical Machining Method with a Mask onto the Cathode

DU Haitao;QU Ningsong;LI Hansong;QIAN Shuangqing   

  1. College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics Jiangsu Key Laboratory of Precision and Micro-Manufacturing Technology, Nanjing University of Aeronautics and Astronautics
  • Published:2010-02-05

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摘要： 为得到降低摩擦副表面磨损所需的微小凹坑阵列结构，提出电解转印法加工凹坑阵列的工艺方法。对电解转印法加工过程进行有限元仿真，分析光刻胶膜厚度对凹坑尺寸和形状的影响。用光刻的方法制作尺寸均一，单个孔径为100 μm的阴极平板。进行微细电解加工试验，试验分析脉冲电源频率和脉冲占空比对加工结果的影响。结果表明，采用电解转印法加工微小凹坑阵列结构，可以获得平均直径为200 μm，深度10 μm的凹坑阵列。

关键词: 凹坑阵列, 光刻, 微细电解加工

Abstract: To obtain micro-pits array which can reduce friction and wear of friction pairs, an electrochemical machining method with a mask onto the cathode is proposed to produce the micro-pit array patterns. Finite element simulation of the method is carried out to analyze the effect of the photoresist thickness on the pit size and shape. The experiments of micro-ECM are done to analyze the effect of frequency and duty cycle on the diameter of micro-pits, in which the cathode plate with the hole diameter of 100 μm is produced by using lithography method. The experimenter’s result reveals that the micro-pits with the diameter of 200 μm and the depth of 10 μm can be obtained in electrochemical machining method with a mask onto the cathode.

Key words: Array micro-pits, Micro-ECM, Photoresist

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