• CN:11-2187/TH
  • ISSN:0577-6686

›› 2004, Vol. 40 ›› Issue (9): 95-99.

• 论文 • 上一篇    下一篇

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基于组合拍卖的半导体生产线短期调度技术研究

翟文彬;褚学宁;张洁;马登哲;金烨;严隽琪   

  1. 上海交通大学计算机集成制造研究所
  • 发布日期:2004-09-15

RESEARCH OF COMBINATION AUCTION BASED ON SHORT-TERM SCHEDULING TECHNOLOGY OF SEMICONDUCTOR FABRICATION LINE

Zhai Wenbin;Chu Xuening;Zhang Jie;Ma Dengzhe;Jin Ye;Yan Juanqi   

  1. Institute of Computer Integrated Manufacturing, Shanghai Jiaotong University
  • Published:2004-09-15

摘要: 针对缺乏半导体生产线调度与控制分布协同机制的研究现状,建立了半导体生产线短期全局调度多代理模型,提出了基于组合拍卖的多目标短期调度协同机制,以上海某半导体制造企业152 mm晶圆生产线为实例,验证了多代理模型和协同机制的有效性。

关键词: 半导体生产线, 短期调度, 组合拍卖, 表征手段, 冲击磨损, 冲蚀磨损, 试验设备, 硬质涂层

Abstract: There is a lack of distributed coordination mechanism for semiconductor fabrication line scheduling and control status in quo. To resolve this problem, a multi-agent model for short-term global scheduling of semiconductor fabrication line is proposed, and a combination auction based coordination mechanism for multi-object short-term scheduling is given. An illustrative example of a 152 mm semiconductor fabrication line in shanghai demonstrates effectiveness of the approach.

Key words: Combination auction, Semiconductor fabrication line, Short term scheduling, Characterization method, Erosion, Hard coatings, Impact wear, Test device

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