• CN:11-2187/TH
  • ISSN:0577-6686

机械工程学报 ›› 2025, Vol. 61 ›› Issue (5): 108-116.doi: 10.3901/JME.2025.05.108

• 特邀专栏:高性能静压轴承 • 上一篇    

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硅片磨床用空气静压主轴动态特性研究

徐嘉慧, 康仁科, 朱祥龙, 董志刚, 李猛   

  1. 大连理工大学高性能精密制造全国实验室 大连 116024
  • 收稿日期:2024-03-25 修回日期:2024-10-09 发布日期:2025-04-15
  • 作者简介:徐嘉慧,女,1996年出生,博士研究生。主要研究方向为半导体磨削技术与装备。E-mail:xjh1639360785@163.com;朱祥龙(通信作者),男,1981年出生,教授,博士研究生导师。主要研究方向为难加工材料超精密加工、测量、监控一体化技术与装备(单晶硅、碳化硅、蓝宝石等硬脆材料,超高强度钢)。E-mail:zhuxianglong@163.com
  • 基金资助:
    国家重点研发计划(2020YFB2007600)和国家自然科学基金(51991372)资助项目。

Research on Dynamic Characteristics of Air Static Pressure Spindle for Silicon Wafer Grinding Machine

XU Jiahui, KANG Renke, ZHU Xianglong, DONG Zhigang, LI Meng   

  1. National Laboratory of High Performance Precision Manufacturing, Dalian University of Technology, Dalian 116024
  • Received:2024-03-25 Revised:2024-10-09 Published:2025-04-15

摘要: 空气静压主轴是硅片超精密磨床的关键部件,其刚度是影响硅片磨削后表面磨纹生成的重要因素。首先基于功率谱密度分析方法,分析了硅片磨削后磨纹的频率组成;接着建立了考虑结合面刚度和磨削力的主轴转子动力学模型,分析了轴向刚度和径向刚度对转子频率的影响,推导出转子频率与轴向刚度和径向刚度之间的关系方程。仿真计算结果表明,与轴向刚度相比,径向刚度对磨纹的影响更加敏感;最后,为了降低硅片磨纹的幅值,确定了硅片磨床用空气静压主轴刚度的最优设计指标:轴向刚度为800~1 000 N/μm,径向刚度为90~110 N/μm时,转子频率处于300~410 Hz之间。并设计了一种改进的主轴转子结构方案,该方案下磨纹幅值可以减小20 nm,为硅片磨床用空气静压主轴设计提供参考。

关键词: 硅片磨床, 空气静压主轴, 轴向刚度, 径向刚度

Abstract: The air-bearing spindle is a critical component of the ultra-precision grinding machine for silicon wafers, and its stiffness significantly influences the formation of surface grinding marks on the wafer. First, based on the power spectral density analysis method, the frequency composition of the grinding marks on silicon wafers after grinding is analyzed. Subsequently, a rotor dynamics model of the spindle considering the stiffness of the contact surfaces and grinding forces is established to analyze the impact of axial and radial stiffness on the rotor frequencies. The relationship equation between the rotor frequency and the axial and radial stiffness is derived. Simulation results indicate that compared to axial stiffness, radial stiffness has a more sensitive effect on the grinding marks. Finally, to reduce the amplitude of the silicon wafer grinding marks, the optimal design criteria for the stiffness of the air-bearing spindle used in silicon wafer grinders are determined: an axial stiffness of 800 to 1 000 N/μm and a radial stiffness of 90 to 110 N/μm, resulting in rotor frequencies between 300 and 410 Hz. An improved spindle rotor structure is designed under which the amplitude of the grinding marks can be reduced by 20 nm. It provides a reference for the design of air-bearing spindles for silicon wafer grinders.

Key words: silicon wafer grinding machine, air static pressure spindle, axial stiffness, radial stiffness

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