绝缘封装用碳化硅颗粒掺杂的非线性电导复合材料设计要素研究

doi:10.3901/JME.2025.02.097

摘要/Abstract

摘要： 随着宽禁带(Wide band gap, WBG)功率半导体器件的不断发展，目前高电压功率器件的电压等级已经可以达到20 kV，这给高电压功率器件封装的电气可靠性带来了新的挑战。高电压功率器件封装内部“三相点”处极易发生电场集中从而引起局部放电导致器件封装绝缘失效。非线性电导涂层(Field-dependent conductivity, FDC)材料被认为是解决这一问题的关键。虽然非线性电导涂层材料已经成为高电压封装的重要解决方案，但是非线性电导涂层材料的制备方案对其性能的影响尚不明确。为了制备并设计出性能更为优异的非线性电导涂层材料，通过有限元仿真和试验，分析了非线性电导涂层材料制备的三大必备要素基体材料、掺杂颗粒、涂层厚度对非线性电导涂层材料成型性、耐温性、绝缘耐压性、涂层结合强度以及其热-机械应力等性能的影响。通过分析非线性涂层材料制备方案对材料几个重要性能的影响规律，本研究可为优异和高可靠性的非线性电导涂层材料的设计和制备提供指导和方案。

关键词: 电力电子, 高电压, 功率器件, 绝缘, 封装

Abstract: With the continuous development of wide band gap(WBG) power semiconductor devices, the current voltage levels of high-voltage power devices have exceeded 20 kV, which brings new challenges to the insulation reliability of high-voltage power device packages. High-voltage power devices are susceptible to electric field concentration at the triple points, which can cause partial discharge leading to device insulation failure. Field-dependent conductivity(FDC) materials are considered to be the key to solve this problem. Although nonlinear conductive coatings have become an important solution for high-voltage packaging, the effect of the preparation method of nonlinear conductive coatings on their performance is not clear. In order to prepare and design nonlinear conductive coating materials with more excellent performance，in this paper, the effects of three main elements of non-linear conductive coating material design：matrix material, doping particles, and coating thickness on the properties of non-linear conductive coating material such as formability, temperature resistance, insulation and voltage resistance, coating bond strength, and its thermo-mechanical stress are briefly analyzed by finite element simulation and experimental comparison. By analyzing the laws of nonlinear coating material preparation schemes on several important properties of the materials，this study can provide guidance and solutions for the design and preparation of excellent and highly reliable nonlinear electroconductive coating materials.

Key words: power electronics, high voltage, power device, insulation, packaging

中图分类号:

TM215

孙凯兵, 李欣, 梅云辉. 绝缘封装用碳化硅颗粒掺杂的非线性电导复合材料设计要素研究[J]. 机械工程学报, 2025, 61(2): 97-105.

SUN Kaibing, LI Xin, MEI Yunhui. Design Features of Silicon Carbide-doped Nonlinear Conductive Composites for Insulating Packages[J]. Journal of Mechanical Engineering, 2025, 61(2): 97-105.

参考文献

[1] NING P，HUI X，KANG Y，et al. Review of hybrid packaging methods for power modules[J]. Chinese Journal of Electrical Engineering，2023，9(4)：23-40.
[2] MILLAN J，GODIGNON P，PERPINA X，et al. A survey of wide bandgap power semiconductor devices[J]. IEEE Transactions on Power Electronics，2014，29(5)：2155-2163.
[3] MIGUEL H，ADERINTO O. High voltage，step-down converter design using 20-kV silicon carbide IGBTs[C]//2016 IEEE International Power Modulator and High Voltage Conference (IPMHVC)，July 6-9，2016，San Francisco，CA，USA，2016：520-524.
[4] WANG N Y，COTTON I，ROBERTSON J，et al. Partial discharge control in a power electronic module using high permittivity non-linear dielectrics[J]. IEEE Transactions on Dielectrics and Electrical Insulation，2010，17(4)：1319-1326.
[5] Tousi M M，Ghassemi M. Nonlinear resistive electric field grading in high-voltage，high-power wide bandgap power module packaging[C]//2019 IEEE Energy Conversion Congress and Exposition (ECCE)，Sept. 29-Oct. 3，2019，Baltimore，MD，USA，2019：7124-7129.
[6] LI R，WANG Y F，ZHANG C，et al. Non-linear conductivity epoxy/SiC composites for emerging power module packaging：Fabrication，characterization and application[J]. Materials，2020，13(15)：3278.
[7] 韩宝忠，郭文敏，李忠华. 碳化硅/硅橡胶复合材料的非线性电导特性[J]. 功能材料，2008(9)：1490-1493. HAN Baozhong，GUO Wenmin，LI Zhonghua. Nonlinear conductivity properties of silicon carbind/silicon rubber composites[J]. Functional Materials，2008(9)：1490-1493.
[8] DU B X，YANG Z R，LI Z L，et al. Temperature-dependent nonlinear conductivity and carrier mobility of silicone rubber/SiC composites[J]. IEEE Transactions on Dielectrics and Electrical Insulation，2018，25(3)：1080-1087.
[9] 邢天成. 双面柔性覆铜板用热塑性聚酰亚胺(TPI)的研究[D]. 广州：华南理工大学，2018. XING Tiancheng. Study of thermoplastic polyimide (TPI) for double-sided flexible copper-clad laminates[D]. Guangzhou：South China University of Technology，2018.
[10] 李俊杰，梅云辉，梁玉，等. 功率器件高电压封装用复合电介质灌封材料研究[J]. 电工技术学报，2022，37(3)：786-792. LI Junjie，MEI Yunhui，LIANG Yu，et al. Study on composite dielectric encapsulation materials for high voltage power device packaging[J]. Transactions of China Electrotechnical Society，2022，37(3)：786-792.
[11] 张文卿，尹亮，李桂洋，等. 环氧树脂低粘度增韧技术的研究进展[J]. 热固性树脂，2021，36(4)：61-69. ZHANG Wenqin，YIN Liang，LI Guiyang，et al. Research progress of low viscosity toughening technology for epoxy resin matrix[J]. Thermosetting Resin，2021，36(4)：61-69.
[12] SU X L，ZHANG S Y，ZHAO F P，et al. Experimental study on the effect of thermal aging on epoxy composites used for UHV dry bushing[C]//201812th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)，May 20-24，2018，Xi’an，China，2018：598-601.
[13] XUE W X，LU Y，GAO Y F，et al. Detection and characterization of thermal degradation of HTV silicone rubber used in high voltage composite insulator taking into account abnormal temperature heating[C]//2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE)，Sept. 6-10，2020，Beijing，China，2020：1-4.
[14] OGBONNA V E，POPOOLA A P I，POPOOLA O M，et al. A review on polyimide reinforced nanocomposites for mechanical，thermal，and electrical insulation application：challenges and recommendations for future improvement[J]. Polymer Bulletin，2022，79(1)：663-695.
[15] LIANG Y，ZHU G J，LU G Q，et al. Reliable epoxy/SiC composite insulation coating for high-voltage power packaging[J]. Journal of Materials Science：Materials in Electronics，2022，33(26)：20508-20517.
[16] LI J J，LIANG Y，MEI Y H，et al. Packaging design of 15 kV SiC power devices with high-voltage encapsulation[J]. IEEE Transactions on Dielectrics and Electrical Insulation，2022，29(1)：47-53.
[17] 陈锋，王淑霞，翟军明，等. 乙烯基酯树脂增韧改性双酚A型环氧树脂研究[J]. 复合材料科学与工程，2020，323(12)：92-99. CHEN Feng，WANG Shuxia，ZHAI Junming，et al. Study on toughening modified bisphenol an epoxy resin by vinylester resin[J]. Composites Science and Engineering，2020，323(12)：92-99.
[18] 魏志龙，岳红，陈国飞，等. 新型易加工热塑性聚酰亚胺的合成及性能研究[J]. 绝缘材料，2015(5)：10-14，20. WEI Zhilong，YUE Hong，CHEN Guofei，et al. Synthesis and properties of novel thermoplastic polyimide[J]. Insulation Materials，2015(5)：10-14，20.
[19] LIU Chenyang，ZHENG Xiaoquan，PENG Ping. The nonlinear conductivity experiment and mechanism analysis of modified polyimide (PI) composite materials with inorganic filler[J]. IEEE Transactions on Plasma Science，2015，43(10)：3727-3733.
[20] LI Z L，HUANG R J，DU B X，et al. Electric-field- and temperature-dependent nonlinear conductivity of SiC/epoxy resin composites at cryogenic temperature[J]. IEEE Transactions on Applied Superconductivity，2020，30(8)：1-6.
[21] 杨朔. 掺杂改性锆酸钆粉末制备及其涂层性能[D]. 沈阳：沈阳工业大学，2022. YANG Shuo. Preparation of doped modified gadolinium zirconate powder and its coating properties[D]. Shenyang：Shenyang University of Technology，2022.
[22] 王水兵，李春红，程南璞，等. 界面特征对颗粒增强金属基复合材料弹性模量和界面阻尼的影响[J]. 西南大学学报(自然科学版)，2008，30(7)：172-178. WANG Shuibin，LI Chunhong，CHENG Nanpu，et al. Influence of interfacial features on Young’s modulus and interfacial damping of particle-reinforced metal matrix composites[J]. Journal of Southwest University. Natural Science Edition，2008，30(7)：172-178.
[23] 施芹，苏岩，裘安萍，等. 硅微机械陀螺仪封装应力研究[J]. 电子器件，2007，30(6)：2294-2296. SHI Qin，SU Yan，QIU Anping，et al. Study on stress of silicon micromachined gyroscope[J]. Chinese Journal of Electron Devices，2007，30(6)：2294-2296.
[24] BAYER C F，BAER E，WALTRICH U，et al. Simulation of the electric field strength in the vicinity of metallization edges on dielectric substrates[J]. IEEE Transactions on Dielectrics and Electrical Insulation，2015，22(1)：257-265.
[25] 柯超，王国栋，张泽东，等. 涂层厚度对涂层热力性能的影响[J]. 真空，2016，53(2)：4-8. KE Chao，WANG Guodong，ZHANG Zedong，et al. The influence of thermal performance by coating thickness[J]. Vacuum，2016，53(2)：4-8.