电子器件高精高效制造的若干关键技术研究进展

doi:10.3901/JME.2023.19.164

摘要/Abstract

摘要： 后摩尔时代，多芯片高密度互连是电子器件制造的重要发展方向。针对高密度电子器件的高精高效加工制造难题，凝练了两大类共性技术挑战，包括互连基板等难加工材料海量微结构阵列的高精高效加工技术、执行机构高速高精操作的结构动态优化设计方法等；结合课题组近年来的研究实践，重点对四个细分方向的研究进展进行综述与讨论，包括多芯片高密度互连的海量微纳结构创成新机理、高精高效加工过程的形性协同调控方法与技术、高速机构柔性多体动力学建模与运动优化控制、高速精密运动平台设计与定位精度实时补偿理论与技术等；在此基础上，对相关技术的发展趋势进行分析与展望，将为高密度电子器件加工制造理论与技术体系的不断发展与完善提供重要参考。

关键词: 微电子器件, 高密度互连, 微结构阵列加工, 结构动态优化, 精密运动定位

Abstract: In the post-Moore era, high-density multi-chip interconnection is an important development direction for electronic device manufacturing. For the high-precision and high-efficiency processing and manufacturing of high-density electronic devices, two major types of common technical challenges are summarized, including the high-precision and high-efficiency processing technology of massive microstructure arrays of difficult-to-process materials such as interconnect substrates, and the structure dynamic optimization design methods for high-speed and high-precision operation of actuation mechanisms, etc. Combined with the group's research practice in recent years, the research progress in the four sub-directions is reviewed and discussed, including the new mechanism of massive microstructure creation for high-density multichip interconnection, the morphology and physical property adjustment and control in the high-precision and high-efficient manufacturing, the modeling and motion optimization control of flexible multibody dynamics of high-speed mechanisms, and the theory and technique in positioning and real-time compensation of high-speed precision motion stages, etc. Based on this, the development trend of the relevant technology is analyzed and the outlook is given. It will provide an important reference for the continuous development and improvement of the theory and technology of high-density electronic device processing and manufacturing.

Key words: microelectronic device, high-density interconnection, microstructure array processing, structure dynamic optimization, precision motion and positioning

中图分类号:

TG156

陈新, 陈云, 杨志军, 高健, 陈桪. 电子器件高精高效制造的若干关键技术研究进展[J]. 机械工程学报, 2023, 59(19): 164-175.

CHEN Xin, CHEN Yun, YANG Zhijun, GAO Jian, CHEN Xun. Research Advances in Several Key Technologies for High Precision and High Efficiency Manufacturing of Electronic Devices[J]. Journal of Mechanical Engineering, 2023, 59(19): 164-175.

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