芯片互连用粒径双峰分布纳米铜膏的低温无压烧结纳连接机理和接头可靠性

doi:10.3901/JME.2022.02.058

机械工程学报 ›› 2022, Vol. 58 ›› Issue (2): 58-65.doi: 10.3901/JME.2022.02.058

扫码分享

芯片互连用粒径双峰分布纳米铜膏的低温无压烧结纳连接机理和接头可靠性

黄海军^1,2, 周敏波^1,2, 吴雪^1,2, 张新平^1,2

1. 华南理工大学材料科学与工程学院广州 510640;
2. 华南理工大学广东省电子封装材料与可靠性工程技术研究中心广州 510640

收稿日期:2021-05-20 修回日期:2021-09-12 出版日期:2022-01-20 发布日期:2022-03-19
通讯作者: 张新平(通信作者),男,1965年出生,博士,教授,博士研究生导师。主要研究方向为电子封装与可靠性、柔性与印刷电子材料及器件、机敏材料、材料计算及材料加工模拟与仿真。E-mail:mexzhang@scut.edu.cn
作者简介:黄海军,男,1994年出生,博士研究生。主要研究方向为功率器件封装材料、柔性与印刷电子材料及封装可靠性。E-mail:mshjhuang@mail.scut.edu.cn;周敏波,男,1981年出生,博士,讲师,硕士研究生导师。主要研究方向为先进电子封装材料与结构可靠性。E-mail:msmbzhou@scut.edu.cn
基金资助:
国家自然科学基金（51775195）和广州市科技计划（201807010028）资助项目。

Nano-joining Mechanisms and Joint Reliability of Die Attachment Using Bimodal-sized Cu Nanoparticle Paste Capable of Low-temperature Pressureless Sintering

HUANG Haijun^1,2, ZHOU Minbo^1,2, WU Xue^1,2, ZHANG Xinping^1,2

1. School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640;
2. Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability, South China University of Technology, Guangzhou 510640

Received:2021-05-20 Revised:2021-09-12 Online:2022-01-20 Published:2022-03-19

摘要/Abstract

摘要： 利用一步化学还原法合成具有粒径双峰分布的铜纳米颗粒，并制备可在低温无压条件下烧结的纳米铜膏。铜纳米颗粒由平均粒径160 nm的大颗粒及其被平均粒径9 nm小颗粒包围的团聚体构成；采用乳酸基复合包覆剂不仅能有效防止铜颗粒氧化，还对纳米颗粒烧结过程有促进作用。280℃下无压烧结后的铜膏烧结接头剪切强度高达65 MPa，究其原因主要是烧结过程中形成的大尺寸块体铜颗粒的强化作用，以及铜膏烧结基体与上、下基板界面间形成了致密无缺陷的牢固冶金互连。铜膏烧结接头的形成主要由"颗粒-颗粒"间纳连接及"颗粒-基板"界面的纳连接而实现，前者以表面活性能高的小尺寸铜纳米颗粒为"桥梁"将大尺寸铜颗粒连接成致密块体铜，而后者借助乳酸铜高温下分解得到的铜纳米颗粒与基板间的互扩散和自扩散最终在界面形成连续且致密的纳连接层。烧结接头在空气中250℃时效1 000 h后，铜膏烧结基体与界面处虽出现空洞，但仍具有高强度（大于56 MPa），表明铜膏烧结接头有较好的抗高温热氧化性能。

关键词: 纳米铜膏, 双峰分布, 无压烧结, 纳连接, 可靠性

Abstract: Bimodal-sized Cu nanoparticles (NPs) with a conformation of NPs (~9 nm) capping on large ones (~160 nm) are synthesized through a one-step chemical reduction method, which are then used to prepare the Cu paste capable of pressureless sintering at low temperature. The lactic acid based capping agents show both effective oxidation protection and sintering enhancing effects for Cu NPs. Cu paste joints after pressureless sintering at 280℃ have high shear strength up to 65 MPa, which is underpinned by the strengthening effect of bulk Cu particles and the formation of nearly defect-free and dense interfaces joined metallurgically between sintered Cu paste matrix and substrates. The sintered Cu paste joint is formed by means of two nano-joining processes, i.e., nano-joining between Cu NPs and Cu NPs via bridging under the driving force from their high specific surface energy, as well as nano-joining between Cu NPs and substrates through formation of continuous yet dense diffusion layers at interfaces of sintered particles and substrates due to the enhanced self- and inter-diffusion of Cu NPs produced from decomposition of Cu lactate. Despite formation of some voids at the interface of sintered Cu paste/Cu substrate after high temperature storage at 250℃ for 1 000 h, Cu paste joints still show relatively high strength (>56 MPa).

Key words: Cu nanoparticle paste, bimodal distribution, pressureless sintering, nano-joining, reliability

中图分类号:

TG156

黄海军, 周敏波, 吴雪, 张新平. 芯片互连用粒径双峰分布纳米铜膏的低温无压烧结纳连接机理和接头可靠性[J]. 机械工程学报, 2022, 58(2): 58-65.

HUANG Haijun, ZHOU Minbo, WU Xue, ZHANG Xinping. Nano-joining Mechanisms and Joint Reliability of Die Attachment Using Bimodal-sized Cu Nanoparticle Paste Capable of Low-temperature Pressureless Sintering[J]. Journal of Mechanical Engineering, 2022, 58(2): 58-65.

参考文献

[1] MILLAN J,GODIGNON P,PERPINA X,et al. A survey of wide bandgap power semiconductor devices[J]. IEEE Transactions on Power Electronics,2014,29(5):2155-2163.
[2] SIOW K S,LIN Y T. Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study[J]. Journal of Electronic Packaging,2016,138(2):020804.
[3] KOBAYASHI Y,YASUDA Y,MORITA T. Recent advances in the synthesis of copper-based nanoparticles for metal-metal bonding processes[J]. Journal of Science:Advanced Materials and Devices,2016,1(4):413-430.
[4] YAMAKAWA T,TAKEMOTO T,SHIMODA M,et al. Influence of joining conditions on bonding strength of joints:Efficacy of low-temperature bonding using Cu nanoparticle paste[J]. Journal of Electronic Materials,2013,42(6):1260-1267.
[5] DEL CARRO L,ZINN A A,RUCH P,et al. Oxide-free copper pastes for the attachment of large-area power devices[J]. Journal of Electronic Materials,2019,48(10):6823-6834.
[6] LIU Xiangdong,NISHIKAWA H. Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging[J]. Scripta Materialia,2016,120:80-84.
[7] KAHLER J,HEUCK N,WAGNER A,et al. Sintering of copper particles for die attach[J]. IEEE Transactions on Components,Packaging and Manufacturing Technology,2012,2(10):1587-1591.
[8] LIU Jingdong,CHEN Hongtao,JI Hongjun,et al. Highly conductive Cu-Cu joint formation by low-temperature sintering of formic acid-treated cu nanoparticles[J]. ACS Applied Materials & Interfaces,2016,8(48):33289-33298.
[9] GAO Yue,LI Wanli,CHEN Chuantong,et al. Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere[J]. Materials & Design,2018,160:1265-1272.
[10] MOU Yun,CHENG Hao,PENG Yang,et al. Fabrication of reliable Cu-Cu joints by low temperature bonding isopropanol stabilized Cu nanoparticles in air[J]. Materials Letters,2018,229:353-356.
[11] NAKAKO H,NATORI M,ISHIKAWA D,et al. Superior bonding reliability of sintered Cu bonding at power cycle test[C]//International Exhibition and Conference for Power Electronics,Intelligent Motion,Renewable Energy and Energy Management. July 2020,Germany. IEEE,2020:1-4.
[12] 周敏波,黄海军,张新平,等. 一种芯片无压烧结互连用纳米铜浆及其制备方法与应用:中国,202010696203.4[P]. 2020-11-24. Zhou Minbo,Huang Haijun,Zhang Xinping,et al. Preparation method and application of nano copper paste for chip pressureless sintering interconnection:China,202010696203.4[P]. 2020-11-24.
[13] HWANG H,KIM A,ZHONG Zhaoyang,et al. Reducible-shell-derived pure-copper-nanowire network and its application to transparent conducting electrodes[J]. Advanced Functional Materials,2016,26(36):6545-6554.
[14] HUANG Haijun,WU Xue,ZHOU Minbo,et al. Superior strength and strengthening mechanism of die attachment joints by using bimodal-sized Cu nanoparticle paste capable of low-temperature pressureless sintering[J]. Journal of Materials Science:Materials in Electronics,2021,32(3):3391-3401.

[1]	俞水, 吴晓, 郭鹏, 王志华. 基于首次穿越PDF自适应估计的时变可靠性分析方法[J]. 机械工程学报, 2024, 60(5): 264-275.
[2]	李莹, 张嘉方, 张钊墉, 王鑫丞, 张晋, 孔祥东. 斜盘式轴向柱塞泵柱塞颈部最小直径设计[J]. 机械工程学报, 2024, 60(4): 430-437.
[3]	钱萍, 刘鑫雨, 陈文华, 王哲, 郭明达. 电连接器用聚氨酯胶密封件贮存可靠性建模[J]. 机械工程学报, 2024, 60(20): 361-371.
[4]	韦新鹏, 姚中洋, 宝文礼, 张哲, 姜潮. 一种基于主动学习克里金模型的证据理论可靠性分析方法[J]. 机械工程学报, 2024, 60(2): 356-368.
[5]	王文林, 张子波, 李英子, 吴永明, 王起新, 梁若霜. 液压缸可靠性试验与数据分析研究平台[J]. 机械工程学报, 2024, 60(18): 385-393.
[6]	杨旭锋, 程鑫, 刘泽清. 一种融合交叉熵自适应抽样与ALK模型的可靠性分析方法[J]. 机械工程学报, 2024, 60(16): 73-82.
[7]	胡俊宇, 韩旭, 陶友瑞, 李珊瑚, 张建宁. 一种考虑跟随误差的S形轨迹残余振动抑制可靠性分析方法[J]. 机械工程学报, 2024, 60(16): 390-399.
[8]	胡伟飞, 廖家乐, 郭云飞, 鄢继铨, 李光, 岳海峰, 谭建荣. 基于物理信息神经网络的时变可靠性分析方法[J]. 机械工程学报, 2024, 60(13): 141-153.
[9]	张显程, 谷行行, 刘宇, 王润梓, 宋鲁凯, 谢里阳, 赵丙峰, 夏侯唐凡, 李勇, 孙莉, 温建锋, 涂善东. 基于工程损伤理论的高温装备可靠性评估与运维管理[J]. 机械工程学报, 2024, 60(13): 154-172.
[10]	常琦, 周长聪, 刘付超, 张浩, 岳珠峰. 考虑铰接间隙区间不确定性的飞机舱门锁机构可靠性分析[J]. 机械工程学报, 2023, 59(8): 264-272.
[11]	范小宁, 王凯, 余畅. 基于约束边界抽样的起重机金属结构可靠性优化[J]. 机械工程学报, 2023, 59(8): 288-298.
[12]	宋守许, 庞少聪, 周丹, 田永廷. 考虑可靠性与回收再利用性的直流充电桩设计过程关键部件识别方法[J]. 机械工程学报, 2023, 59(7): 18-28.
[13]	杨强, 孙本奇, 李树军, 戴建生. 面向构态切换稳定性的约束变胞机构可靠性优化设计方法[J]. 机械工程学报, 2023, 59(3): 22-37.
[14]	葛雪峰, 姜佳宝, 赵耀. 金属化膜电容器电热仿真分析^*[J]. 电气工程学报, 2023, 18(3): 224-231.
[15]	张涵寓, 宋周洲, 刘钊, 朱平. 碳纤维复合材料与铝合金胶铆混合连接力学性能可靠性研究[J]. 机械工程学报, 2023, 59(24): 334-343.

芯片互连用粒径双峰分布纳米铜膏的低温无压烧结纳连接机理和接头可靠性

Nano-joining Mechanisms and Joint Reliability of Die Attachment Using Bimodal-sized Cu Nanoparticle Paste Capable of Low-temperature Pressureless Sintering

PDF

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 15

编辑推荐

Metrics

本文评价