添加微量Zn对Sn-58Bi/Cu焊点老化过程中界面演变以及力学性能的影响

doi:10.3901/JME.2022.02.284

机械工程学报 ›› 2022, Vol. 58 ›› Issue (2): 284-290.doi: 10.3901/JME.2022.02.284

• 微纳连接界面与可靠性 • 上一篇下一篇

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添加微量Zn对Sn-58Bi/Cu焊点老化过程中界面演变以及力学性能的影响

王凤江, 何其航

江苏科技大学材料科学与工程学院镇江 212000

收稿日期:2021-04-19 修回日期:2021-06-28 出版日期:2022-01-20 发布日期:2022-03-19
通讯作者: 王凤江(通信作者),男,1977年出生,博士,教授,硕士研究生导师。主要研究方向为微纳连接、可靠性测试与机理。E-mail:fjwang@just.edu.cn
作者简介:何其航,男,1995年出生。主要研究方向为钎料的可靠性。E-mail:574631511@qq.com
基金资助:
国家自然科学基金资助项目（51875269）。

Effect of Trace Zn Addition on Interfacial Evolution and Mechanical Properties of Sn-58Bi/Cu Solder Joints during Aging

WANG Fengjiang, HE Qihang

Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang 212000

Received:2021-04-19 Revised:2021-06-28 Online:2022-01-20 Published:2022-03-19

摘要/Abstract

摘要： 通过向Sn-58Bi焊料中加入微量Zn元素，研究了Sn-58Bi-xZn（x=0，0.2，0.5，1.0）焊点在老化过程中界面金属间化合物（Intermetallic compounds，IMCs）的生长行为以及对力学性能的影响。研究发现，加入微量Zn后，界面IMCs由Cu₆Sn₅转变为Cu₆（Sn，Zn）₅。当Zn的添加量达到1.0wt%时界面IMCs为Cu₅Zn₈。添加Zn显著抑制了界面Cu₃Sn在老化过程中的生长。Sn-58Bi-0.5Zn/Cu焊点界面处IMCs在老化过程中出现分层现象，形成Cu₆（Sn，Zn）₅/Cu₅Zn₈/Cu₆（Sn，Zn）₅结构。添加微量的Zn会降低Sn-58Bi/Cu的剪切力，但是随着老化时间的增加，Sn-58Bi-xZn/Cu焊点的剪切力高于Sn-58Bi/Cu焊点，焊点的断裂均由韧性断裂逐渐向韧脆混合断裂模式转变。微量Zn的添加有助于提高焊点的长期可靠性。

关键词: Sn-Bi焊料, 界面化合物, 老化, 可靠性, 力学性能

Abstract: The effect of trace Zn addition on the growth of interfacial IMCs and the mechanical properties of Sn-58Bi solder joints under thermal aging were investigated. The results indicated that with minor Zn addition, the interfacial IMCs changed from Cu₆Sn₅ to Cu₆(Sn, Zn)₅. When the Zn content increased to 1.0 wt%, Cu₅Zn₈ phases were formed at the interface between Sn-58Bi-1.0Zn/Cu. The addition of Zn suppressed the growth of Cu₃Sn IMCs during thermal aging. The sandwich structure of Cu₆(Sn, Zn)₅/Cu₅Zn₈/Cu₆(Sn, Zn)₅ IMCs was formed at the Sn-58Bi-0.5Zn/Cu interface after aging for 20 days. The shearing force of the solder joints decreased with the addition of Zn. However, the shearing force of Sn-58Bi-xZn solder joints were higher than that of the Sn-58Bi joints after a long time aging. The fracture mode of the solder joints changed from the ductile fracture to the mixed ductile-brittle fracture. It indicated that the long-time reliability of the solder joints was benefited from Zn addition.

Key words: Sn-Bi solder, intermetallic compounds, aging, reliability, mechanical properties

中图分类号:

TG425

王凤江, 何其航. 添加微量Zn对Sn-58Bi/Cu焊点老化过程中界面演变以及力学性能的影响[J]. 机械工程学报, 2022, 58(2): 284-290.

WANG Fengjiang, HE Qihang. Effect of Trace Zn Addition on Interfacial Evolution and Mechanical Properties of Sn-58Bi/Cu Solder Joints during Aging[J]. Journal of Mechanical Engineering, 2022, 58(2): 284-290.

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添加微量Zn对Sn-58Bi/Cu焊点老化过程中界面演变以及力学性能的影响

Effect of Trace Zn Addition on Interfacial Evolution and Mechanical Properties of Sn-58Bi/Cu Solder Joints during Aging

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