玻璃通孔三维互连技术中的应力问题

doi:10.3901/JME.2022.02.246

摘要/Abstract

摘要： 玻璃通孔（Through glass via，TGV）三维互连技术由于具有优异的电学、光学特性，良好的力学稳定性和低成本等优势，在三维封装、集成无源器件和光电器件集成方面具有广泛应用前景。然而，玻璃通孔三维互连结构复杂，由多种材料间热膨胀系数不匹配引起的热应力将影响器件和封装的性能和可靠性，针对玻璃通孔三维互连技术的应力和可靠性问题，很多学者开展了相关研究。首先总结了TGV三维互连结构中的应力问题，包括TGV铜填充热应力理论模型、TGV孔完全填充或不完全填充铜在应力、局部应力集中引发的热机械可靠性问题。其次，针对TGV互连结构应力问题，总结了应力解析和有限元仿真分析进展，明确孔内填充聚合物可缓解残余应力及热应力，具有较高的抗热应力可靠性。最后，指出TGV互连应力和可靠性还存在亟待解决的问题。

关键词: 玻璃通孔(TGV), 可靠性, 应力, 裂纹

Abstract: At present, the three-dimensional (3D) interconnection technology based on glass through vias (TGVs) has been applied to integration passive devices, three-dimensional packaging and optoelectronic device integration because of its excellent electrical and optical properties, good mechanical stability and low-cost. However, the thermal stress caused by the mismatch of thermal expansion coefficients among multi-materials structure and the complex structure of TGV would affect the performance and reliability of the device. In view of this, many scholars have carried out relevant studies. The stress issues in 3D interconnect technology using TGVs are reviewed at home and abroad survey. Thermal stress theoretical models are constructed, the mechanism of size and distribution of stress is summarized for the filled and unfilled copper of the TGVs. The local stress concentration would induce serious thermo and mechanical reliability. Secondly, after times of finite element model analysis, it is concluded that filling polymer in the vias would alleviate the residual stress. Finally, put forward some problems to be solved urgently.

Key words: through glass via(TGV), reliability, stress, crack

中图分类号:

TG156

赵瑾, 李威, 钟毅, 于大全, 秦飞. 玻璃通孔三维互连技术中的应力问题[J]. 机械工程学报, 2022, 58(2): 246-258.

ZHAO Jin, LI Wei, ZHONG Yi, YU Daquan, QIN Fei. Stress Issues in 3D Interconnect Technology Using Through Glass Vias[J]. Journal of Mechanical Engineering, 2022, 58(2): 246-258.

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