• CN:11-2187/TH
  • ISSN:0577-6686

机械工程学报 ›› 2021, Vol. 57 ›› Issue (22): 184-200.doi: 10.3901/JME.2021.22.184

• 材料科学与工程 • 上一篇    下一篇

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梯度功能合金的增材制造技术研究进展

李祺祺1, 温耀杰1, 张百成1,2,3, 曲选辉1,2,3   

  1. 1. 北京科技大学新材料技术研究院 北京 100083;
    2. 北京材料基因工程高精尖创新中心 北京 100083;
    3. 现代交通金属材料与加工技术北京实验室 北京 100083
  • 收稿日期:2020-11-11 修回日期:2021-06-13 出版日期:2021-11-20 发布日期:2022-02-28
  • 通讯作者: 张百成(通信作者),男,1984年出生,博士,副教授,硕士研究生导师。主要研究方向为增材制造。E-mail:zhangbc@ustb.edu.cn
  • 作者简介:李祺祺,男,1997年出生,硕士研究生。主要研究方向为增材制造。E-mail:G20199366@xs.ustb.edu.cn
  • 基金资助:
    国家自然科学基金(51901020)、山东省重大科技创新工程(2019JZZY010327)、航空科学基金(201942074001)和中央高校基本科研(FRF-IP-20-05)资助项目。

Research Progress of Functional Graded Alloy Prepared by Additive Manufacturing Technology

LI Qiqi1, WEN Yaojie1, ZHANG Baicheng1,2,3, QU Xuanhui1,2,3   

  1. 1. Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083;
    2. Beijing Advanced Innovation Center for Materials Genome Engineering, Beijing 100083;
    3. Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, Beijing 100083
  • Received:2020-11-11 Revised:2021-06-13 Online:2021-11-20 Published:2022-02-28

摘要: 梯度功能材料是由两种或多种材料复合且成分呈连续梯度变化的一种新型复合材料,在当今飞速发展的工程领域受到了广泛的关注。但传统的梯度功能材料制备技术无法满足航空、医疗、军事等工业领域的需要。而增材制造作为一种新兴技术,提供了一种全新的思路来解决梯度功能材料的制备问题。系统总结了增材制造制备梯度功能合金的主要方法,讨论了利用激光熔覆与选区激光熔化技术制备钛基、铁基及金属-陶瓷等梯度合金的研究现状及在相应领域的重要应用,并结合现有工作论述利用选区激光熔化制备连续梯度功能合金的原理与研究进展,最后阐述了利用增材制造技术制备梯度功能合金的挑战和机遇,并展望了本领域的未来发展方向。

关键词: 梯度功能材料, 增材制造, 激光熔覆, 选区激光熔化

Abstract: As a key component of active phased array radar, the size and performance of T/R (Transmitter and Receiver) components determine the weight and function of the equipment. Wire bonding is one of the commonly used interconnection technologies in T/R components. With the improvement of component integration, it is necessary to develop corresponding high-density wire bonding technologies, which is essential for the miniaturization of bonding wires. However, ultra-fine leads will reduce the mechanical properties and reliability of the solder joints. Ultrasonic hot-press wedge bonding method is used to realize the connection of ultra-fine gold wire and gold pad, and the process parameters are optimized. The results show that with the increase of bonding pressure, bonding time and ultrasonic power, the wire deformation after bonding gradually increases, while the tension of the gold wire after bonding first increases and then decreases. And the influence of process parameters on the deformation of gold ribbon is less than that of gold wire. The excessive force of the second bonding point causes the lead deformation to be larger and the maximum tensile force is less than the first bonding point. Therefore, the number of bonding points needs to be increased. Finally, the best bonding process parameters of the gold wire and gold pad are obtained through the orthogonal experiment method. The bonding of ultra-fine size leads is realized, which is of great significance to the miniaturization of T/R components.

Key words: functional graded material, additive manufacturing, laser cladding, selective laser melting

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