• CN：11-2187/TH
  • ISSN：0577-6686
机械工程学报

机械工程学报 ›› 2017, Vol. 53 ›› Issue (7): 180-188.doi: 10.3901/JME.2017.07.180

• 制造工艺与装备 • 上一篇    下一篇

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微晶玻璃超精密磨削的表面/亚表面损伤及其材料去除机理研究*

高尚, 朱祥龙, 康仁科, 郭东明, 王紫光, 张璧   

  1. 大连理工大学精密与特种加工教育部重点实验室 大连 116024
  • 出版日期:2017-04-05 发布日期:2017-04-05
  • 作者简介:

    高尚，男，1982年出生，博士，讲师，硕士研究生导师。主要研究方向为精密与超精密加工技术。

    E-mail：gaoshangf@gmail.com

    康仁科(通信作者)，男，1962年出生，博士，教授，博士生导师。主要研究方向为超精密加工与特种加工技术、难加工材料高效加工技术、半导体制造技术与设备。

    E-mail：kangrk@dlut.edu.cn

  • 基金资助:
    * 国家自然基金重大研究计划(91323302)、国家自然基金创新研究群体(51621064)和国家自然基金科学基金(51505063， 51305058)资助项目; 20160419收到初稿，20161126收到修改稿;

Surface/Subsurface Damage and Material Removal Mechanism of Glass-ceramics Induced by Ultra-precision Grinding

GAO Shang, ZHU Lianglong, KANG Renke, GUO Dongming, WANG Ziguang, ZHANG Bi   

  1. Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education，Dalian University of Technology， Dalian 116024
  • Online:2017-04-05 Published:2017-04-05

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摘要：

针对微晶玻璃超精密磨削加工不可避免的表面/亚表面损伤问题，通过微晶玻璃磨削试验研究500#、1 500#、2 000#和5 000#金刚石砂轮磨削微晶玻璃的表面形貌、表面/亚表面损伤特征及其材料去除机理，揭示微晶玻璃脆性域磨削和塑性域磨削的表面/亚表面损伤特征，提出依次采用500#金刚石砂轮粗磨和5 000#金刚石砂轮精磨的微晶玻璃高效低损伤磨削工艺。结果表明， 500#和1 500#金刚石砂轮磨削表面的材料去除方式为脆性断裂去除， 2 000#金刚石砂轮磨削表面的材料去除方式同时包括脆性断裂去除和塑性流动去除，5 000#金刚石砂轮磨削表面的材料去除方式为塑性流动去除;脆性域磨削微晶玻璃的表面损伤形式为凹坑、微裂纹、深划痕，亚表面损伤形式为微裂纹;塑性域磨削微晶玻璃的表面损伤形式为微磨痕，亚表面损伤形式为靠近磨削表面的材料的塑性流动。

关键词: 表面损伤, 材料去除机理, 磨削, 亚表面损伤, 微晶玻璃

Abstract:

The surface/subsurface damage is generated inevitably in grinding glass-ceramics. In this study, the surface topography, surface/subsurface damage characteristics and material removal mechanism of glass-ceramics ground by diamond wheels with different abrasive sizes of 500#, 1 500#, 2 000# and 5 000# are investigated. The surface/subsurface damage characteristics of glass-ceramics in brittle-mode grinding and ductile-mode grinding respectively are revealed, and a high-efficiency and low-damage ultra-precision grinding process of glass-ceramics by stages using 500# diamond wheel for rough grinding and 5 000# diamond wheel for fine grinding is proposed. The experiment results show that the material is removed in brittle mode when glass-ceramics are ground by 500 #and 1 500# diamond wheels, in both brittle mode and ductile mode when ground by 2 000# diamond wheel, and in ductile mode when ground by 5 000# diamond wheel. In the brittle-mode grinding of glass-ceramics, the surface damage consists of pits, microcracks and deep scratches, and the subsurface damage takes the form of microcracks. But in the ductile mode grinding of glass-ceramics, the surface damage has only micro-scratches, and subsurface damage is the plastic flow of workpiece material closed to the ground surface.

Key words: grinding, material removal mechanism, subsurface damage, surface damage, glass-ceramic

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