合金韧窝断口微观形貌的扫描白光干涉三维检测重构及Motif表征

›› 2011, Vol. 47 ›› Issue (10): 8-13.

合金韧窝断口微观形貌的扫描白光干涉三维检测重构及Motif表征

邹文栋;黄长辉;欧阳小琴;郑玱;徐周珏;董娜

南昌航空大学无损检测技术教育部重点实验室;中航工业江西洪都航空工业集团公司理化测试中心

发布日期:2011-05-20

Scanning White-light Interferometric Measurement 3D Reconstruction and Motif Evaluation of Alloy Dimple Fracture Microtopography

ZOU Wendong;HUANG Changhui;OUYANG Xiaoqin;ZHENG Qiang;XU Zhoujue;DONG Na

Key Laboratory of Nondestructive Test of Ministry of Education, Nanchang Hangkong University Physical & Chemical Test Center, AVIC Jiangxi Hongdu Aviation Industry Group Co., Ltd

Published:2011-05-20

摘要/Abstract

摘要： 针对30CrMnSiA合金韧窝断口复杂的表面特征，运用扫描白光干涉法检测微观形貌。系统采用Linnik结构，并通过空间频域分析算法重建断口表面三维形貌，试验中扫描行程达120 µm，纵向检测精度优于5 nm，频域分析表现出很强的位相提取和噪声抑制能力。研究韧窝断口的三维Motif表征方法，提出包含深度、长度、宽度、面积、方向角和各向异性率等6参数的定义，以及基于面积和深度阈值的合并算法。考虑到韧窝三维形态的各向异性，对基于纵横比的表面微观粗糙度定义进行修正。采用3D-Motif法对试验获得的断口三维形貌进行表面纹理分割，提取韧窝个体特征参数和统计数据，其中测得断口表面微观粗糙度为0.15～0.70，从而为定量化研究材料的断裂机理提供客观依据。

关键词: 韧窝断口, 三维Motif, 扫描白光干涉

Abstract: In view of the complex surface properties of 30CrMnSiA dimple fracture, scanning white-light interferometry is used to measure microscopic topography. The Linnik structure is adopted in the system and the 3D image of dimple fracture is rebuilt by spatial frequency analysis. Longitudinal accuracy is better than 5 nm for a scan range of 120 µm in the experiment. The frequency-domain analysis approach exhibits strong abilities of phase extraction and noise suppression. 3D-Motif method for assessing dimple fracture surface is studied, six parameters including depth, length, width, area, direction angle and anisotropy rate are defined, and combination algorithm based on area and depth threshold is proposed. Considering the anisotropy of dimple microtopography, the definition for surface micro-roughness based on aspect ratio is modified. The obtained three-dimensional surface topography is partitioned to extract both single dimple character and statistical parameters, in which the micro-roughness of the fracture surface is tested to be around 0.15～0.70, thereby providing the objective basis for quantitative study on the mechanism of fracture.

Key words: 3D-motif, Dimple fracture, Scanning white-light interferometry

中图分类号:

TH878 O436

邹文栋;黄长辉;欧阳小琴;郑玱;徐周珏;董娜. 合金韧窝断口微观形貌的扫描白光干涉三维检测重构及Motif表征[J]. , 2011, 47(10): 8-13.

ZOU Wendong;HUANG Changhui;OUYANG Xiaoqin;ZHENG Qiang;XU Zhoujue;DONG Na. Scanning White-light Interferometric Measurement 3D Reconstruction and Motif Evaluation of Alloy Dimple Fracture Microtopography[J]. , 2011, 47(10): 8-13.