• CN:11-2187/TH
  • ISSN:0577-6686

›› 2007, Vol. 43 ›› Issue (10): 14-19.

• 论文 • 上一篇    下一篇

热超声键合换能系统阻抗/导纳模型

隆志力;吴运新;韩雷;段吉安;钟掘   

  1. 中南大学机电工程学院
  • 发布日期:2007-10-15

IMPEDANCE/ADMITTANCE MODEL OF ULTRASONIC TRANSDUCER SYSTEM IN THERMOSONIC BONDING

LONG Zhili; WU Yunxin; HAN Lei;DUAN Jian;ZHONG Jue   

  1. College of Electromechanical Engineering, Central South University
  • Published:2007-10-15

摘要: 采用等效电路方法建立换能系统的阻抗/导纳集总参数模型,包含各子部分的材料特性、尺寸、系统损耗因子、谐振频率、激励电信号以及不同负载下系统阻抗和导纳等动力学特性。以无键合工具与有键合工具两种不同负载为例计算得到,在100 kHz范围内系统包含4阶轴向谐振频率;相比于无键合工具条件,有键合工具负载条件下的各阶谐振频率增大,其电阻值增大,电导值降低。阻抗分析仪试验与有限元分析结果均验证系统阻抗/导纳模型的正确性。

关键词: 等效电路模型, 换能系统, 热超声键合, 阻抗/导纳

Abstract: An impedance and admittance model of transducer system, which includes system features such as material, size, loss factor, resonance frequency, exciting electrical signal and different loads, is established by equivalent circuit method. For two different loads with/without bonding tool, the impedance and admittance of transducer system are calculated based on above model. The numerical computations show that, there are four axial vibration modes of transducer system in 100 kHz. Comparing to no-tool condition, each resonance frequency and its impedance increase when with bonding tool. The result of sweeping measurement by impedance analyzer and FEM model are used to verify the impedance/admittance model.

Key words: Equivalent circuit model, Impedance/admittance, Thermosonic bonding, Ultrasonic transducer

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