T/R组件Au-Al引线键合工艺优化与失效机理

doi:10.3901/JME.2023.22.322

机械工程学报 ›› 2023, Vol. 59 ›› Issue (22): 322-331.doi: 10.3901/JME.2023.22.322

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T/R组件Au-Al引线键合工艺优化与失效机理

李庚, 冯佳运, 王尚, 吴芃, 田艳红

哈尔滨工业大学先进焊接与连接国家重点实验室哈尔滨 150001

收稿日期:2022-12-07 修回日期:2023-03-15 出版日期:2023-11-20 发布日期:2024-02-19
通讯作者: 田艳红(通信作者)，女，1975年出生，博士，教授，博士研究生导师。主要研究方向为微纳连接与电子封装，纳米材料与器件。E-mail：tianyh@hit.edu.cn
作者简介:李庚，男，1999年出生，博士研究生。主要研究方向为微纳连接与电子封装。E-mail：li-geng@hit.edu.cn
基金资助:
黑龙江省“头雁”团队经费资助项目。

Process Optimization and Failure Mechanisms of Au-Al Wire Bonding for T/R Components

LI Geng, FENG Jiayun, WANG Shang, WU Peng, TIAN Yanhong

State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001

Received:2022-12-07 Revised:2023-03-15 Online:2023-11-20 Published:2024-02-19

摘要/Abstract

摘要： 射频收发(Transmitter and receiver, T/R)组件作为雷达的核心部分向着小型化、高功率发展，较高的服役温度以及周期性高低温载荷给其高密度封装互连结构可靠性带来了严峻挑战，Au-Al引线键合作为T/R组件中最常用的互连形式，仍然存在着工艺参数与退化机理研究不系统等问题，限制T/R组件的发展。对T/R组件中超声热压Au-Al引线键合结构进行工艺参数优化及高温老化与温度循环可靠性试验。结果表明，键合界面结合力在一定范围内与键合压力和超声输入呈正相关；150 ℃老化过程中键合界面出现多种金属间化合物并不断生长演化，高温老化下的键合结构失效模式为互连界面柯肯达尔孔洞聚集产生的裂纹；温度循环过程中的金属间化合物主要为Au₅Al₂，键合界面退化机理为交变热应力在脆性相Au₅Al₂处造成的损伤，1 000个温度循环后键合点仍具备较高的界面结合力。通过以上工作最终获得高可靠性的Au-Al引线键合结构，阐明该键合结构的失效机理，对射频收发组件的发展有重要意义。

关键词: 引线键合, 可靠性, 金属间化合物, 失效机理

Abstract: As the crucial part of radar, radio frequency transmitter and receiver (T/R) modules are developing towards miniaturization and high power. High working temperature and periodic thermal loads have brought severe challenges to the reliability of high-density packaging interconnect structures. Au-Al wire bonding is the most commonly interconnection form in T/R modules, but there are still problems such as unclear process parameters and degradation mechanism, which limit the development of T/R modules. The process parameters optimization, high temperature aging and thermal cycling reliability tests of the ultrasonic thermosonic Au-Al wire bonding structure in T/R module are carried out. The adhesion force of bonding interface is positively correlated with bonding pressure and ultrasonic input within limits. During aging process, a variety of intermetallic compounds appear on the bonding interface, the intermetallic compounds grow and evolve continuously with the increase of the aging time. The failure mode of the bonding structure under high temperature aging is the crack caused by the aggregation of Kirkendall voids at the interconnect interface; the intermetallic compound during the thermal cycling is mainly Au₅Al₂, and the degradation mechanism of the bonding interface is the damage caused by thermal mismatch at the brittle phase Au₅Al₂, the bonding structure still has a high interfacial adhesion force after 1 000 temperature cycles. Through the above work, a high-reliability Au-Al wire bonding structure is finally obtained, and the failure mechanisms of the bonding structure are clarified, which is of great significance to the development of radio frequency T/R modules.

Key words: wire bonding, reliability, intermetallic compound, failure mechanisms

中图分类号:

TN405

李庚, 冯佳运, 王尚, 吴芃, 田艳红. T/R组件Au-Al引线键合工艺优化与失效机理[J]. 机械工程学报, 2023, 59(22): 322-331.

LI Geng, FENG Jiayun, WANG Shang, WU Peng, TIAN Yanhong. Process Optimization and Failure Mechanisms of Au-Al Wire Bonding for T/R Components[J]. Journal of Mechanical Engineering, 2023, 59(22): 322-331.

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T/R组件Au-Al引线键合工艺优化与失效机理

Process Optimization and Failure Mechanisms of Au-Al Wire Bonding for T/R Components

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