• CN:11-2187/TH
  • ISSN:0577-6686

机械工程学报 ›› 2023, Vol. 59 ›› Issue (18): 207-218.doi: 10.3901/JME.2023.18.207

• 材料科学与工程 • 上一篇    下一篇

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Mg, Ag, Si掺杂AlCu3合金的电子结构与力学性能

唐树伟1,2, 罗东明1, 吴孟修1, 张静怡1, 贺子康1   

  1. 1. 辽宁工程技术大学材料科学与工程学院 阜新 123000;
    2. 东北师范大学化学学院 长春 130024
  • 收稿日期:2022-09-23 修回日期:2023-05-19 出版日期:2023-09-20 发布日期:2023-12-07
  • 通讯作者: 唐树伟(通信作者),男,1982年出生,博士,副教授,硕士研究生导师。主要研究方向为锂(钠)离子电池正极材料的设计与模拟和新型热电材料结构设计与性能。E-mail:tangsw911@nenu.edu.cn
  • 基金资助:
    国家自然科学基金(21503039)、辽宁省科技厅基金(2019MS164)、辽宁省教育厅基金(LJ2020JCL034)和辽宁工程技术大学学科创新团队(LNTU20TD-16)资助项目。

Substituent Effects of Mg, Ag, and Si on Electronic Structures and Mechanical Properties of AlCu3 Alloy

TANG Shuwei1,2, LUO Dongming1, WU Mengxiu1, ZHANG Jingyi1, HE Zikang1   

  1. 1. College of Materials Science and Engineering, Liaoning Technical University, Fuxin 123000;
    2. Faculty of Chemistry, Northeast Normal University, Changchun 130024
  • Received:2022-09-23 Revised:2023-05-19 Online:2023-09-20 Published:2023-12-07

摘要: 采用第一性原理计算方法研究了AlCu3合金及Mg、Ag、Si在Al位或Cu位通过取代掺杂方式形成的Al7Cu24X和Al8Cu23X (X=Mg,Ag,Si)合金体系的结构稳定性、电子结构和力学性能。Mg、Ag、Si倾向于在Cu位进行取代掺杂,对AlCu3合金晶体几何结构影响较小,Al7Cu24X和Al8Cu23X (X=Mg,Ag,Si)体系具有很好的热力学稳定性和机械稳定性。态密度和差分电荷密度计算结果表明,Al7Cu24X和Al8Cu23X (X=Mg,Ag,Si)掺杂体系仍然保持明显的AlCu3合金特征,Cu 3d价电子轨道对Al7Cu24X和Al8Cu23X (X=Mg,Ag,Si)掺杂体系的总态密度具有主要贡献,Si、Mg元素掺杂对原结构产生的影响较小,而Ag原子由于4d轨道电子的存在会加强原子间的键合作用。力学性能的计算结果表明,Mg掺杂能够有效提升AlCu3合金的延展性及塑性性能,Al7Cu24X和Al8Cu23X (X=Mg,Ag,Si)体系均为各向异性的韧性材料,能够有效地提升AlCu3合金材料硬度及抗变形能力。因此,X (X=Mg,Ag,Si)取代掺杂提高了AlCu3合金材料的综合力学性能。

关键词: 金属间化合物, AlCu3合金, 电子结构, 力学性能, 第一性原理计算

Abstract: With the aim to evaluation of the substituent effects of Mg, Ag, Si on the Al-Cu alloy, the structural stabilities, electronic and mechanical properties of AlCu3 alloy and the substituted structures Al7Cu24X and Al8Cu23X (X=Mg, Ag, Si) in Al or Cu sites were explored by first-principles calculations. The computational results show that the X (X=Mg, Ag, Si) substitution have minimal influence on the AlCu3 crystal structure, and the three doped elements tend to replace the position of Cu atoms. All Al7Cu24X and Al8Cu23X (X=Mg, Ag, Si) satisfy the criteria of thermodynamical and mechanical stabilities, so Al7Cu24X and Al8Cu23X (X=Mg, Ag, Si) alloys exhibit high structural stabilities. The density of states and charge density differences demonstrate that all doped Al7Cu24X and Al8Cu23X (X=Mg, Ag, Si) structures still maintain noticeably metallic characteristics of the AlCu3 alloy. The valence electron orbitals of Cu 3d provide dominant contributions to the total density of states of the AlCu3 intermetallic compounds, and the doped Si and Mg atoms have slight effect on the AlCu3 alloy, while the Ag atom enhances the interatomic bonding on account of the existence of electrons in 4d orbitals. The mechanical properties indicate that the doped Mg atom effectively improves the ductility and plasticity of the AlCu3 alloy, and Mg, Ag and Si doped structures are ductile materials with anisotropy. Therefore, the alloying with Mg, Ag and Si doping improves the hardness and deformation resistance of AlCu3 alloy, which could effectively improve the mechanical properties.

Key words: intermetallic compounds, AlCu3 alloy, electronic structure, mechanical properties, first-principles calculations

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