多线摇摆往复式线锯切割加工运动的理论及试验研究

doi:10.3901/JME.2020.11.219

机械工程学报 ›› 2020, Vol. 56 ›› Issue (11): 219-228.doi: 10.3901/JME.2020.11.219

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多线摇摆往复式线锯切割加工运动的理论及试验研究

杨沁, 黄辉, 郑生龙

华侨大学制造工程研究院厦门 361021

收稿日期:2019-10-11 修回日期:2019-12-20 出版日期:2020-06-05 发布日期:2020-06-12
通讯作者: 黄辉(通信作者),男,1974年出生,博士,教授,博士研究生导师。主要研究方向为脆性材料精密加工。E-mail:huangh@hqu.edu.cn
作者简介:杨沁,女,1995年出生。主要研究方向为脆性材料精密加工。E-mail:yangqin199@qq.com
基金资助:
国家自然科学基金（51375179）、福建省高校产学研项目（2017H6014）、教育部创新团队（IRT_17R41）和华侨大学研究生科研创新基金（17013080041）资助项目。

Theoretical and Experimental Research on Machining Movement of Multi-wire Sawing with Rocking and Reciprocating

YANG Qin, HUANG Hui, ZHENG Shenglong

Institute of Manufacturing Engineering, Huaqiao University, Xiamen 361021

Received:2019-10-11 Revised:2019-12-20 Online:2020-06-05 Published:2020-06-12

摘要/Abstract

摘要： 多线摇摆往复式切割加工因其切割效率高和加工精度好的优点，现已逐渐成为硬脆材料晶圆的主要切割方式；分析了多线摇摆往复式切割加工中三个主要的运动方式，建立了多线摇摆往复式切割加工运动的理论模型，推导了线锯摇摆切割过程中的材料去除率（Q）和单位长度新线材料去除体积（R）的理论计算公式；理论分析了加工工艺参数对Q和R的影响规律；从加工运动学的角度提出了固定R的线锯切割新构想，并逆向推导了晶圆切割过程的相关工艺参数变化曲线；通过与工厂现有加工工艺的线锯切割试验比较，证实本文所提出的线锯切割新构想能有效地提高晶圆切割质量。

关键词: 多线摇摆往复切割, 材料去除率, 单位长度新线材料去除体积, 切割质量

Abstract: Multi-wire sawing with rocking and reciprocating has gradually become a main way to slice the hard and brittle material wafers due to its high efficiency and good accuracy. Three main motions in multi-wire sawing with rocking and reciprocating are analyzed. The theoretical models of three main motions are established. The theoretical derivation of the material removal rate (Q) and the material removal volume of new wire with per unit length (R) in the sawing process is proposed. The influence of processing parameters on Q and R is analyzed theoretically. A new concept of wire sawing with fixing R is proposed according the kinematics. The relevant process parameters variation curve in the wafer sawing process is derived inversely. It is found that the new sawing method improved the wafer sawing quality effectively compared with the actual sawing experimental results of the factory.

Key words: multi-wire sawing with rocking and reciprocating, material removal rate, material removal volume of new wire with per unit length, sawing quality

中图分类号:

杨沁, 黄辉, 郑生龙. 多线摇摆往复式线锯切割加工运动的理论及试验研究[J]. 机械工程学报, 2020, 56(11): 219-228.

YANG Qin, HUANG Hui, ZHENG Shenglong. Theoretical and Experimental Research on Machining Movement of Multi-wire Sawing with Rocking and Reciprocating[J]. Journal of Mechanical Engineering, 2020, 56(11): 219-228.

参考文献

[1] 贺东葛,王家鹏,刘国敬. 碳化硅半导体材料应用及发展前景[J]. 电子工业专用设备,2018(3):1-3. HE Dongge,WANG Jiapeng,LIU Guojing,et al. Application and development prospect of silicon carbide semiconductor materials[J]. Equipment for Electronic Products Manufacturing,2018(3):1-3.
[2] 魏昕,杜宏伟,袁慧,等. 晶片材料的超精密加工技术现状[J]. 组合机床与自动化加工技术,2004(3):75-79. WEI Xin,DU Hongwei,YUAN Hui,et al. Ultra-precision machining technology for crystal wafers[J]. Combined Machine Tool and Automatic Machining Technology,2004(3):75-79.
[3] 孟剑峰. 环形电镀金刚石线锯加工技术及加工质量研究[D]. 济南:山东大学,2006. MENG Jianfeng. Research on machined technology and machined quality of endless electroplated diamond wire saw[D]. Jinan:Shandong University,2006.
[4] WANG X Y,LI Y,LI S J. Study on the impact of the cutting process of wire saw on SiC wafers[J]. Applied Mechanics and Materials,2011,120:593-597.
[5] HUANG H,ZHANG Yuxing,XU Xipeng. Experimental investigation on the machining characteristics of single-crystal SiC sawing with the fixed diamond wire[J]. Interna-tional Journal of Advanced Manufacturing Technology,2015,81(5-8):955-965.
[6] HARDIN C W,QU J,SHIH A J. Fixed abrasive diamond wire saw slicing of single crystal SiC wafers[C]//ASME International Mechanical Engineering Congress & Exposi-tion. 2003.
[7] ZHANG M J. Experimental study on slicing of sapphire with fixed abrasive diamond wire saw[J]. International Journal of Mechanical,Aerospace,Industrial,Manu-facturing Engineering,2015,9(5):661-664.
[8] GAO Y,GE P,LIU T. Experiment study on electroplated diamond wire saw slicing single-crystal silicon[J]. Materials Science in Semiconductor Processing,2016,56:106-114.
[9] 高玉飞,陈阳,葛培琪. SiC单晶线锯切片微裂纹损伤深度的有限元分析[J]. 西安交通大学学报,2016(12):y1-y6. GAO Yufei,CHEN Yang,GE Peiqi. Finite element analysis on wafer micro-crack damage depth of SiC crystal in wire saw slicing process[J]. Journal of Xi'an Jiaotong University,2016(12):y1-y6.
[10] HUANG X,HUANG H,GUO H. Simulation and experimental research on the slicing temperature of the sapphire with diamond wire[J]. International Journal of Computational Methods,2018:1843003.
[11] 张辽远. 电镀金刚石线锯超声波切割试验装置的研制和加工机理的研究[D]. 长春:长春理工大学,2007. ZHANG Liaoyuan. Research of processing principle and development of experiment setup for electroplated diamond wire saw with ultrasonic vibration[D]. Changchun:Changchun University of Science and Technology,2007.
[12] MÖLLER H J. Basic mechanisms and models of multi-wire sawing[J]. Advanced Engineering Materials,2010,6(7):501-513.
[13] LIEDKE T,KUNA M. A macroscopic mechanical model of the wire sawing process[J]. International Journal of Machine Tools & Manufacture,2011,51(9):711-720.
[14] KIM H,KIM D,KIM C,et al. Multi-wire sawing of sapphire crystals with reciprocating motion of electrop-lated diamond wires[J]. CIRP Annals-Manufacturing Technology,2013,62(1):335-338.
[15] KIM D,KIM H,LEE S,et al. Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw[J]. International Journal of Precision Engineering and Manufacturing-Green Technology,2015,2(2):117-121.
[16] BHAGAVAT S,KAO I. A finite element analysis of temperature variation in silicon wafers during wiresaw slicing[J]. International Journal of Machine Tools and Manufacture,2008,48(1):95-106.
[17] SHINYA M,YAZAWA T,OTUBO T. Study on the slicing of sapphire using a wire tool[J]. Advanced Materials Research,2015,806:333-337.
[18] ABE Y,ISHIKAWA K I,SUWABE H. Effects of thermal deformation of multi-wire saw's wire guides and ingot on slicing accuracy[J]. Key Engineering Materials,2009,389-390:442-447.
[19] MAEDA H,TAKANABE R,TAKEDA A,et al. High-speed slicing of SiC ingot by high-speed multi wire saw[C]//Trans Tech Publications,2014:771-775.
[20] 林志树,黄辉,郑生龙. 多线往复式线锯切割中单位长度材料去除量的理论分析与试验研究[J]. 机械工程学报,2018,54(13):208-214. LIN Zhishu,HUANG Hui,ZHENG Shenglong. Theore-tical analysis and experimental study on material removal per length of wire in the cutting of multi-wire saw with reciprocating[J]. Journal of Mechanical Engineering,2018,54(13):208-214.
[21] CLARK W I,SHIH A J,HARDIN C W,et al. Fixed abrasive diamond wire machining-part i:Process monitoring and wire tension force[J]. International Journal of Machine Tools & Manufacture,2003,43(5):523-532.
[22] TEOMETE E. Investigation of long waviness induced by the wire saw process[J]. Proceedings of the Institution of Mechanical Engineers,Part B:Journal of Engineering Manufacture,2011,225(7):1153-1162.
[23] MALKIN S,GUO C. Grinding technology:Theory and applications of machining with abrasives[J]. International Journal of Machine Tools & Manufacture,1991,31(3):435-436.

多线摇摆往复式线锯切割加工运动的理论及试验研究

Theoretical and Experimental Research on Machining Movement of Multi-wire Sawing with Rocking and Reciprocating

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