BGA无铅焊点再流焊焊后残余应力分析与优化

doi:10.3901/JME.2020.10.086

机械工程学报 ›› 2020, Vol. 56 ›› Issue (10): 86-94.doi: 10.3901/JME.2020.10.086

扫码分享

BGA无铅焊点再流焊焊后残余应力分析与优化

赵胜军¹, 黄春跃¹, 梁颖², 匡兵¹, 唐香琼¹

1. 桂林电子科技大学机电工程学院桂林 541004;
2. 成都航空职业技术学院信息工程学院成都 610021

收稿日期:2019-05-15 修回日期:2020-01-07 出版日期:2020-05-20 发布日期:2020-06-11
通讯作者: 黄春跃(通信作者),男,1971年出生,博士,教授,博士研究生导师。主要从事微电子封装与组装可靠性技术研究。E-mail:hcymail@163.com
作者简介:赵胜军,男,1992年出生,硕士研究生。主要从事微电子封装与组装可靠性技术研究。E-mail:1308800217@qq.com
基金资助:
军委装备发展部“十三五”装备预研领域基金、国家自然科学基金（51465012）、四川省科技计划（2018JY0292）和广西科技重大专项（AA19046004）资助项目。

Analysis and Optimization of Residual Stress after Reflow Soldering of BGA Lead Free Solder Joints

ZHAO Shengjun¹, HUANG Chunyue¹, LIANG Ying², KUANG Bing¹, TANG Xiangqiong¹

1. College of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004;
2. School of Electronical and Information Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu 610021

Received:2019-05-15 Revised:2020-01-07 Online:2020-05-20 Published:2020-06-11

摘要/Abstract

摘要： 建立BGA无铅焊点再流焊焊后残余应力有限元分析模型，对其进行热结构耦合条件下的焊后残余应力分析；基于钻孔应变法设计并完成了焊后残余应力测量验证性试验；基于灵敏度法分析焊点高度、焊点直径、焊盘直径和焊点间距对焊点残余应力影响的显著性及大小排序；以对残余应力影响显著的因素为变量，采用响应面-遗传算法对焊点结构参数进行了优化。结果表明，验证试验结果证明了仿真分析结果的有效性；置信度为90%时，焊点直径、焊点间距和焊点高度对焊点残余应力影响显著，灵敏度从大到小排序为焊点直径 > 焊点间距 > 焊点高度；焊点焊后残余应力最小的最优结构参数水平组合如下：焊点直径0.55 mm、焊点高度0.36 mm、焊点间距1.07 mm；对该焊点仿真验证表明最大焊后残余应力下降了0.998 MPa。研究结果对减小BGA焊点焊后残余应力具有一定的指导意义和参考价值。

关键词: 球栅阵列, 再流焊, 残余应力, 灵敏度分析, 响应曲面, 遗传算法

Abstract: A finite element model of residual stress after reflow soldering of lead free BGA solder joints is established, and analyzed the residual stress after reflow soldering under the structure-thermal coupling conditions. The deterministic experiment is designed and completed based on the Hole drilling strain-gauge method. The significance and the order of the influence of solder joint height, solder joint diameter, pad diameter and solder joint pitch on the residual stress of solder joints are analyzed based on the sensitivity method. Setting the factors that have significant influence on residual stress are variable, and then the structural parameters of solder joints are optimized by response surface method and genetic algorithm. The results show that the deterministic experiment results verify the effectiveness of the simulation analysis results. The significant factors for the residual stress are the solder joint diameter, solder joint pitch and solder joint height when the confidence is 95%, and the order of sensitivity from large to small is solder joint diameter, solder joint diameter and solder joint height. The optimal structure parameter combination of the solder joint of the minimum residual stress after reflow soldering is that solder joint diameter of 0.55 mm, the solder joint height of 0.36 mm and the solder joint pitch of 1.07 mm.The simulation results of the solder joint show that the maximum residual stress decreased 0.998 MPa.The research results have certain guiding significance and reference value for reducing the residual stress after reflow soldering of BGA solder joints.

Key words: ball grid array, reflow soldering, residual stress, sensitivity analysis, response surface, genetic algorithm

中图分类号:

TG404

赵胜军, 黄春跃, 梁颖, 匡兵, 唐香琼. BGA无铅焊点再流焊焊后残余应力分析与优化[J]. 机械工程学报, 2020, 56(10): 86-94.

ZHAO Shengjun, HUANG Chunyue, LIANG Ying, KUANG Bing, TANG Xiangqiong. Analysis and Optimization of Residual Stress after Reflow Soldering of BGA Lead Free Solder Joints[J]. Journal of Mechanical Engineering, 2020, 56(10): 86-94.

参考文献

[1] 张翼,薛齐文,王云峰. 微电子封装的发展历史和新动态[J]. 机械工程与自动化,2016,2(1):215-216. ZHANG Yi,XUE Qiwen,WANG Yunfeng. Development history and new development of microelectronic packa-ging[J]. Mechanical Engineering & Automation,2016,2(1):215-216.
[2] 蒋延彪,田刚领,杨道国,等. PBGA器件固化残余应力的有限元分析[J]. 电子元件与材料,2005,24(2):3-6. JIANG Yanbiao,TIAN Gangling,YANG Daoguo,et al. Finite element simulation analysis on cure-residual stress in PBGA device[J]. Electronic Components & Materials,2005,24(2):3-6.
[3] 田艳红,贺晓斌,杭春进. 残余应力对混合组装BGA热循环可靠性影响[J]. 机械工程学报,2014,50(2):86-91. TIAN Yanhong,HE Xiaobin,HANG Chunjin. Influence of the hybrid BGA residual stress after reflow on the thermal cycling reliability[J]. Journal of Mechanical Engineering,2014,50(2):86-91.
[4] 钟开少,代宣军. 无铅BGA回流焊残余应力仿真分析[J]. 装备制造技术,2014,2(10):44-46. ZHONG Kaishao,DAI Xuanjun. BGA lead-free reflow residual stress simulation analysis[J]. Equipment Manu-facturing Technology. 2014,2(10):44-46.
[5] SAKAI H,YAMAOKA N. Shape prediction and residual stress evaluation of BGA and flip chip solder joints[J]. Thermal and Thermomechanical Phenomena in Electronic Systems,2000:181-186.
[6] UETA N,SASAKI T,MIURA H. Proposal of area-arrayed bump joint structures for minimizing residual stress in stacked silicon chips mounted by flip chip technology[J]. Electronic Materials and Packaging,2008:228-231.
[7] XU Yaowu. Residual stress evaluation in welded large thin-walled structures based on eigenstrain analysis and small sample residualstress measurement[J]. Thin-Walled Structures,2018,1(31):782-791.
[8] 甘世明,韩永全,陈芙蓉. 钻孔法测量焊接残余应力误差因素分析[J]. 焊接学报,2018,39(10):48-53. GAN Shiming,HAN Yongquan,CHEN Furong. Analysis on error factors of welding residual stress measured by hole drilling method[J]. Transactions of the China Welding Institution,2018,39(10):48-53.
[9] 李响铸. 基于ANSYS软件PDS模块机械零件状态函数灵敏度分析[D]. 长春:吉林大学,2006. LI Xiangzhu. Function of state sensitivity analysis of mechanical part based on ANSYS of PDS module[D]. Changchun:Jilin University,2006.
[10] PARK J U,AN G. The effect of initial stress induced during the steel manufacturing process on the welding residual stress in multi-pass butt welding[J]. International Journal of Naval Architectureand Ocean Engineering,2018,10(2):129-140.
[11] MOHAMMAD A G. Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology[J]. Microelectronics Reliability,2018,8(4):238-247.
[12] VOTI R L. Optimization of a perfect absorber multilayer structure by genetic algorithms[J]. Journal of the European Optical Society-Rapid Publications,2018,14(1):11-15.

[1]	郑逸凡, 钱斌, 胡蓉, 张长胜, 向凤红. CE-GA协同进化算法求解人机共同作业的U形装配线平衡问题[J]. 机械工程学报, 2020, 56(9): 199-214.
[2]	徐春广, 李培禄. 无应力制造技术[J]. 机械工程学报, 2020, 56(8): 113-132.
[3]	杨赟, 朱梦瑞, 李慧敏, 杜正春, 杨建国. 基于灵敏度分析的立式加工中心批量空间误差建模和补偿[J]. 机械工程学报, 2020, 56(7): 204-212.
[4]	李淳, 王志权, 司晓庆, 亓钧雷, 冯吉才, 曹健. 轻质金属与陶瓷连接研究综述[J]. 机械工程学报, 2020, 56(6): 73-84.
[5]	董星, 刘雨庆, 段雄. 前混合水射流多弹丸喷丸模型及残余应力场的数值模拟[J]. 机械工程学报, 2020, 56(4): 224-232.
[6]	郭伟飞, 雷琦, 宋豫川, 吕向飞, 李磊. 基于虚拟零部件的零等待约束复杂产品综合调度算法[J]. 机械工程学报, 2020, 56(4): 246-257.
[7]	曾小华, 王振伟, 宋大凤, 陈琴琴, 杨南南. 基于多岛遗传算法的功率分流式双模混合动力客车参数优化[J]. 机械工程学报, 2020, 56(2): 98-105.
[8]	林歆悠, 郑清香, 吴超宇. 基于GA-ECMS电机转矩优化的混合动力系统协调控制[J]. 机械工程学报, 2020, 56(2): 145-153.
[9]	汪应春, 唐登平, 李兴鹏. 基于报价修正的输电线路负值网损经济性结算研究 ^*[J]. 电气工程学报, 2020, 15(1): 89-94.
[10]	李天箭, 吴晨帆, 沈磊, 孔祥志, 丁晓红. 基于模态预测及敏度分析的机床动特性设计方法[J]. 机械工程学报, 2019, 55(7): 178-186.
[11]	逯世杰, 郑乔, 张超华, 王义峰, 邓德安. 不同有限元软件对Q390钢厚板T型接头焊接残余应力和变形预测精度与计算效率的比较[J]. 机械工程学报, 2019, 55(6): 11-22.
[12]	石小秋, 李炎炎, 邓丁山, 龙伟. 基于自适应变级遗传杂草算法的FJSP研究[J]. 机械工程学报, 2019, 55(6): 223-232.
[13]	余陈, 陈静, 陈怀宁, 张宇鹏, 房卫萍. TC4钛合金磁控窄间隙TIG焊试板热处理前后三维应力[J]. 机械工程学报, 2019, 55(6): 61-66.
[14]	郑乔, 逯世杰, 李索, 林旭东, 王义峰, 邓德安. 熔敷顺序和管壁厚度对异种钢管板接头焊接残余应力与变形的影响[J]. 机械工程学报, 2019, 55(6): 46-53.
[15]	刘秀全, 姬景奇, 郑健, 王向磊, 陈国明, 张浩. 基于涡激抑制的深水钻井隔水管系统浮力块配置智能优化[J]. 机械工程学报, 2019, 55(4): 164-171.

BGA无铅焊点再流焊焊后残余应力分析与优化

Analysis and Optimization of Residual Stress after Reflow Soldering of BGA Lead Free Solder Joints

PDF

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 15

编辑推荐

Metrics

本文评价