BGA无铅焊点再流焊焊后残余应力分析与优化
赵胜军, 黄春跃, 梁颖, 匡兵, 唐香琼
Analysis and Optimization of Residual Stress after Reflow Soldering of BGA Lead Free Solder Joints
ZHAO Shengjun, HUANG Chunyue, LIANG Ying, KUANG Bing, TANG Xiangqiong
机械工程学报
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2020, (10): 86
-94
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DOI: 10.3901/JME.2020.10.086
