• CN: 11-2187/TH
  • ISSN: 0577-6686

Journal of Mechanical Engineering ›› 2023, Vol. 59 ›› Issue (19): 164-175.doi: 10.3901/JME.2023.19.164

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Research Advances in Several Key Technologies for High Precision and High Efficiency Manufacturing of Electronic Devices

CHEN Xin, CHEN Yun, YANG Zhijun, GAO Jian, CHEN Xun   

  1. State Key Laboratory of Electronics Precision Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006
  • Received:2023-04-01 Revised:2023-08-23 Online:2023-10-05 Published:2023-12-11

Abstract: In the post-Moore era, high-density multi-chip interconnection is an important development direction for electronic device manufacturing. For the high-precision and high-efficiency processing and manufacturing of high-density electronic devices, two major types of common technical challenges are summarized, including the high-precision and high-efficiency processing technology of massive microstructure arrays of difficult-to-process materials such as interconnect substrates, and the structure dynamic optimization design methods for high-speed and high-precision operation of actuation mechanisms, etc. Combined with the group's research practice in recent years, the research progress in the four sub-directions is reviewed and discussed, including the new mechanism of massive microstructure creation for high-density multichip interconnection, the morphology and physical property adjustment and control in the high-precision and high-efficient manufacturing, the modeling and motion optimization control of flexible multibody dynamics of high-speed mechanisms, and the theory and technique in positioning and real-time compensation of high-speed precision motion stages, etc. Based on this, the development trend of the relevant technology is analyzed and the outlook is given. It will provide an important reference for the continuous development and improvement of the theory and technology of high-density electronic device processing and manufacturing.

Key words: microelectronic device, high-density interconnection, microstructure array processing, structure dynamic optimization, precision motion and positioning

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