Bond Reliability under High Temperature and Humid Environment for Copper Bonding Wire

doi:10.3901/JME.2016.06.086

Abstract

Abstract: The copper wire bonding devices are investigated by high temperature storage(HTS) and pressure cooking test(PCT), and the ball shear strength and ball pull strength are analyzed of before experiments and finished experiments. Scanning electron microscope(SEM) and transmission electron microscope(TEM) are used to identify the bonding interface photography and intermetallic compounds, the bonding interface compositions are analyzed by energy dispersive spectrometer(EDS). The results show that the Cu and Al intermetallic compounds are not found on Cu/Al bonding interface, the ball shear strength and ball pull strength are high for bonding interface before HTS and PCT test. After HTS, the CuAl and Cu₉Al₄ intermetallic compounds are found on Cu/Al bonding interface, and the ball shear strength and ball pull strength are increased because of the CuAl and Cu₉Al₄ intermetallic compounds. After PCT, the ball shear strength and ball pull strength decrease excessively and some voids are found on Cu/Al bonding interface, the Cu₉Al₄ intermetallic compounds disappeared. The environment around Cu/Al interface is weak acid due to halogen atoms, Cu₉Al₄ intermetallic compounds corroded in weak acid environment, the reaction equation is , and the reliability of the device decreases.

Key words: bonding strength, Cu bonding wire, intermetallic compounds, reliability

CLC Number:

TG249

CAO Jun, FAN Junling, SHANG Xianguang, LIU Zhiqiang. Bond Reliability under High Temperature and Humid Environment for Copper Bonding Wire[J]. Journal of Mechanical Engineering, 2016, 52(6): 86-91.

References

[1] 丁雨田,曹军,胡勇,等. 冷变形和热处理对单晶Cu键合丝性能影响[J]. 机械工程学报,2009,45(4)：83-88.
DING Yutian,CAO Jun,HU Yong,et al. Effects of annealing and drawing on properties of single crystal copper bonding wire[J]. Journal of Mechanical Engineering,2009,45(4)：83-88.
[2] BREACH C D,WULFF F,TOK C W. An unusual mechanical failure mode in gold ball bonds at 50 μm pitch due to degradation at the Au-Au 4 Al interface during ageing in air at 175 ℃[J]. Microelectronics Reliability,2006,46(1)：543-557.
[3] 曹军,丁雨田,郭庭彪. 铜线性能及键合参数对键合质量影响研究[J]. 材料科学与工艺,2012,20(4)：76-79.
CAO Jun,DING Yutian,GUO Tingbiao. Effect of copper properties and bonding parameters on bonding quality[J]. Materials Science and Technology,2012,20(4)：76-79.
[4] HUNG F Y,LUI T S,CHEN L H,et al. An investigation into the crystallization and electric flame-off characteristics of 20 μm copper wires[J]. Microelectronics Reliability,2011,51(1)：21-24.
[5] HANG C J,LUM I,LEE J,et al. Bonding wire characterization using automatic deformability measurement
. Microelectronics Engineering,2008,85(8)：1795-1803.
[6] GAM S A,KIM H J. Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability[J]. Journal of Electronic Material,2006,35(11)：2048-2055.
[7] KIM H J,LEE J Y,PAIK K W,et al. Effects of Cu/Al intermetallic compound on copper wire and aluminum pad bondability[J]. IEEE Transactions on Components and Packaging Technology,2003,26(2)：367-371.
[8] HANG C J,TIAN Y H,WANG C Q,et al. High temperature storage reliability of Cu bonds by ultrasonic bonding with fine copper wire[J]. Transactions of the China Welding Institution,2013,34(2)：13-16.
[9] WULFF F,BREACH C,STEPHAN D,et al. Further characterization of intermetallic growth in copper and gold ball bonds on aluminum metallization[C]// International Conference on Electronic Packaging Technology,2006：1-6.
[10] HANG C,WANG C,MAYER M,et al. Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging[J]. Microelectronics Reliability,2008,48(3)：416-424.
[11] TAN C,DAUD A,YARMO M. Corrosion study at Cu-Al interface in microelectronic packaging[J]. Applied Surface Science,2002,191(1)：67-73.
[12] ZHONG Z W,HO H M,TAN Y C,et al. Study of factors affecting the hardness of ball bonds in copper wire bonding[J]. Microelectronic Engineering,2007,84(2)：368-384.
[13] ZDOV M,GUR G,ATZMON Z,et al. Detailed investigation of ultrasonic Al-Cu wire-bond: Microstructural evolution during annealing[J]. Journal of Material Science,2008,43(18)：6038-6048.
[14] UNO T,YAMADA T. Improving humidity bond reliability of copper bonding wires[C]//Electronic Components and Technology Conference,2010：1725-1732.

[1]	YU Shui, WU Xiao, GUO Peng, WANG Zhihua. Adaptive Approximation of the First-crossing PDF for Time-variant Reliability Analysis [J]. Journal of Mechanical Engineering, 2024, 60(5): 264-275.
[2]	LI Ying, ZHANG Jiafang, ZHANG Zhaoyong, WANG Xincheng, ZHANG Jin, KONG Xiangdong. Design of Minimum Diameter of Piston Neck in Swashplate Axial Piston Pump [J]. Journal of Mechanical Engineering, 2024, 60(4): 430-437.
[3]	QIAN Ping, LIU Xinyu, CHEN Wenhua, WANG Zhe, GUO Mingda. Storage Reliability Modeling of Polyurethane Seals for Electrical Connectors [J]. Journal of Mechanical Engineering, 2024, 60(20): 361-371.
[4]	GAO Kai, GU Hongli, LI Kun. Cr, Si Trace Elements on Steel/Aluminium Induction Hydrostatic Welding Joint Organization and Properties of the Impact [J]. Journal of Mechanical Engineering, 2024, 60(2): 178-187.
[5]	WEI Xinpeng, YAO Zhongyang, BAO Wenli, ZHANG Zhe, JIANG Chao. Evidence-theory-based Reliability Analysis Method Using Active-learning Kriging Model [J]. Journal of Mechanical Engineering, 2024, 60(2): 356-368.
[6]	WANG Wenlin, ZHANG Zibo, LI Yingzi, WU Yongming, WANG Qixin, LIANG Ruoshuang. Testing and Data Analysis Platform for the Reliability Research of Hydraulic Cylinder [J]. Journal of Mechanical Engineering, 2024, 60(18): 385-393.
[7]	YANG Xufeng, CHENG Xin, LIU Zeqing. Reliability Analysis Method Combining Cross-entropy Adaptive Sampling and ALK Model [J]. Journal of Mechanical Engineering, 2024, 60(16): 73-82.
[8]	HU Junyu, HAN Xu, TAO Yourui, LI Shanhu, ZHANG Jianning. Reliability Analysis of Residual Vibration Suppression in Flexible Servo Systems under S-curve Trajectory with Bounded Uncertainty [J]. Journal of Mechanical Engineering, 2024, 60(16): 390-399.
[9]	HU Weifei, LIAO Jiale, GUO Yunfei, YAN Jiquan, LI Guang, YUE Haifeng, TAN Jianrong. Time-dependent Reliability Analysis Based on Physics-Informed Neutral Network [J]. Journal of Mechanical Engineering, 2024, 60(13): 141-153.
[10]	ZHANG Xiancheng, GU Hanghang, LIU Yu, WANG Runzi, SONG Lukai, XIE Liyang, ZHAO Bingfeng, XIAHOU Tangfan, LI Yong, SUN Li, WEN Jianfeng, TU Shantung. Engineering Damage Theory-based Reliability Assessment and Management of High-temperature Equipment [J]. Journal of Mechanical Engineering, 2024, 60(13): 154-172.
[11]	HAO Peng, YANG Hao, CHEN Faxin, ZENG Yaoxiang, WANG Mingjie, WANG Bo. A Precise Design Method for Structural Safety Factor Considering Load and Strength Uncertainty [J]. Journal of Mechanical Engineering, 2024, 60(13): 182-192.
[12]	CHANG Qi, ZHOU Zhang-cong, LIU Fu-chao, ZHANG Hao, YUE Zhu-feng. Reliability Analysis of Aircraft Door Lock Mechanism with Interval Joint Clearance Uncertainties [J]. Journal of Mechanical Engineering, 2023, 59(8): 264-272.
[13]	FAN Xiao-ning, WANG Kai, YU Chang. Reliability-based Design Optimization of Crane Metal Structure Based on Constraint Boundary Sampling [J]. Journal of Mechanical Engineering, 2023, 59(8): 288-298.
[14]	SONG Shouxu, PANG Shaocong, ZHOU Dan, TIAN Yongting. Identification Method of Key Components in Design Process of DC Charging Pile Considering Reliability and Reusability [J]. Journal of Mechanical Engineering, 2023, 59(7): 18-28.
[15]	YANG Qiang, SUN Benqi, LI Shujun, DAI Jiansheng. Reliability Optimization Design Method of Constrained Metamorphic Mechanism Oriented to the Stability of Configuration Transformation [J]. Journal of Mechanical Engineering, 2023, 59(3): 22-37.