Abstract: New lapping method using replacement of sapphire wafer is named as progressive mechanical lapping and verified according to ultra-smooth and free-defect for growth process of amorphous alloy films. Numerical simulation shows that introduce of sapphire wafer can effectively reduce surface stress for copper substrate, value of roughness Rt could be improved by progressive mechanical lapping process. Polishing substrate with hydrodynamic effect is designed and used to achieve soft contact and lubrication status between polishing abrasive grain and copper substrate. Surface and sub-surface characteristics are measured by nanoindentation, NT9800 white light interferometer and transmission electron microscopy, preparation of ultra-smooth surface with Ra0.37 nm and Rt4.94 nm and free-defcet with normal lattice distances, uniformity, density and non lattice dislocation could be finished by progressive mechanical lapping coulped with hydrodynamic float polishing processes.

Key words: amorphous alloy films;copper substrate;free-defect;ultra-smooth surface