[1] |
YUAN Weizheng, CHANG Honglong, XIE Jianbing.
Advances in MEMS Integrated Design and Manufacturing Technology
[J]. Journal of Mechanical Engineering, 2023, 59(19): 176-186.
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[2] |
HU Tengjiang, REN Wei, ZHAO Yulong, WANG Kexin.
Research on High Structural Strength MEMS S & A Device for Micro Initiator
[J]. Journal of Mechanical Engineering, 2022, 58(17): 206-214.
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[3] |
HU Tengjiang, REN Wei, ZHAO Yulong.
Research Status and Development Trend of MEMS Detonators
[J]. Journal of Mechanical Engineering, 2021, 57(22): 359-368.
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[4] |
WANG Jia, ZHANG Yunan, HAN Xu.
Research on the Degradation Process and Random Shocks Modeling Based on Their Interdependency
[J]. Journal of Mechanical Engineering, 2021, 57(2): 230-238.
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[5] |
HAO Yongping, WANG Yongjie, DONG Fulu, LU Chao.
Study of Control Strategy and Software Architecture Based on Flat Type Small Parts Assembly
[J]. Journal of Mechanical Engineering, 2015, 51(4): 193-198.
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[6] |
CHEN Xiaohui;LIU Xiaojun;ZHAO Huadong;ZHANG Jun;LU Wenlong.
Novel Method for Automatic Three-dimensional Stitching of Microscopic Images of MEMS Microstructure
[J]. , 2013, 49(18): 85-91.
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[7] |
LI Junhong;WANG Chenghao;LIU Mengwei;MA Jun;WEI Jianhui.
MEMS Piezoelectric Microphone with Circular Diaphragm
[J]. , 2012, 48(18): 85-88.
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[8] |
CUI Jiuzheng;SUN Bo;FENG Qiang.
Finite Element Analysis of MEMS Package under High Impact
[J]. , 2011, 47(24): 177-185.
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[9] |
LIU Yaxin;CHEN Liguo;SUN Lining.
Non-contact Liquid Rationing System Based on Compound Intelligent Control
[J]. , 2010, 46(20): 175-181.
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[10] |
ZHOU Wu;HE Xiaoping;SU Wei;ZHANG Fengtian;LI Bailin.
Frequency Robustness Design of Electrostatic Stiffness Resonant Micro Accelerometer Based on Error Sensitivity
[J]. , 2010, 46(10): 14-18.
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[11] |
LI Lin;GUO Yinbiao;CHEN Xuyuan.
Design and Analysis of Vibration Energy Collector Based on MEMS
[J]. , 2009, 45(9): 238-242.
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[12] |
SHEN Xuejin.
Mechanical Performance of Micro One-sided Straight-leg Beam Resonator
[J]. , 2009, 45(5): 49-56.
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[13] |
SHEN Guangping;ZHANG Hua;WU Jian;QIN Ming;HUANG Qingan.
Direct Chip Attachment Packaging of a 2-D Thermal Flow Sensor
[J]. , 2009, 45(1): 218-222.
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[14] |
BAI Lan;FENG Zhiqing;WU Yihui.
Solid-liquid Coupling Analysis of Valveless Micropumps Dynamic Characteristics
[J]. , 2008, 44(7): 69-74.
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[15] |
ZHANG Wenming;MENG Guang;CHEN Di.
Characteristics of the Gas Journal Bearing in Micro-rotor Systems
[J]. , 2008, 44(5): 25-33.
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