[1] |
CHU Qiang, YANG Xiawei, LI Wenya, FAN Wenlong, ZOU Yangfan, HAO Sijie.
Microstructure Evolution and Strengthening Mechanism of the Probeless Friction Stir Spot Welding of a Al-Li Alloy
[J]. Journal of Mechanical Engineering, 2024, 60(2): 150-158.
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[2] |
GAO Kai, GU Hongli, LI Kun.
Cr, Si Trace Elements on Steel/Aluminium Induction Hydrostatic Welding Joint Organization and Properties of the Impact
[J]. Journal of Mechanical Engineering, 2024, 60(2): 178-187.
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[3] |
XIE Yunfei, GE Shipeng, GUO Zhenguo, CHU Qiang, ZHANG Yong, LI Wenya.
Microstructure Characteristics of Refill Friction Stir Spot Welded Multilayered Aluminum Foils Joint
[J]. Journal of Mechanical Engineering, 2024, 60(18): 128-137.
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[4] |
ZHANG Shuye, DUAN Xiaokang, LUO Keyu, XU Sunwu, ZHANG Zhihao, CHEN Jieshi, HE Peng.
Current Status of Electronic Packaging Materials Using Machine Learning
[J]. Journal of Mechanical Engineering, 2023, 59(22): 222-233.
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[5] |
MENG Zhenghua, ZHOU Rui, GONG Mengyuan, LIU Wei, GUO Wei.
Effects of Impact Welding Parameters on the Aluminum/Steel Joint Interface
[J]. Journal of Mechanical Engineering, 2023, 59(22): 254-264.
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[6] |
LI Geng, FENG Jiayun, WANG Shang, WU Peng, TIAN Yanhong.
Process Optimization and Failure Mechanisms of Au-Al Wire Bonding for T/R Components
[J]. Journal of Mechanical Engineering, 2023, 59(22): 322-331.
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[7] |
TANG Shuwei, LUO Dongming, WU Mengxiu, ZHANG Jingyi, HE Zikang.
Substituent Effects of Mg, Ag, and Si on Electronic Structures and Mechanical Properties of AlCu3 Alloy
[J]. Journal of Mechanical Engineering, 2023, 59(18): 207-218.
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[8] |
CHENG Qi, GUO Ning, ZHANG Di, ZHANG Shuai, CHEN Hao, HE Jinlong.
Research Progress on Laser Welding of NiTi Shape Memory Alloy Dissimilar Materials
[J]. Journal of Mechanical Engineering, 2023, 59(16): 182-191.
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[9] |
WANG Xiaoqiang, GAO Xiaolong, LIU Jing, LI Lunkun.
ffects of V/Nb Composite Interlayer on Microstructure and Mechanical Properties of NiTi Alloy/Stainless Steel Dissimilar Metal Laser Welding
[J]. Journal of Mechanical Engineering, 2022, 58(8): 136-142.
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[10] |
ZHOU Minbo, ZHAO Xingfei, CHEN Mingqiang, KE Changbo, ZHANG Xinping.
Size Effects of Growth and Evolution of Interfacial Intermetallic Compound and the Mechanical Behavior of Bump Structure Sn3.0Ag0.5Cu/Cu Cross-scale Joints in Electronic Packages
[J]. Journal of Mechanical Engineering, 2022, 58(2): 259-268.
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[11] |
WANG Fengjiang, HE Qihang.
Effect of Trace Zn Addition on Interfacial Evolution and Mechanical Properties of Sn-58Bi/Cu Solder Joints during Aging
[J]. Journal of Mechanical Engineering, 2022, 58(2): 284-290.
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[12] |
LI Shengli, REN Chunxiong, HANG Chunjin, TIAN Yanhong, WANG Chenxi, CUI Ning, JIANG Qian.
Microstructure Evolution of Sn-3.0Ag-0.5Cu Solder Joints under Extreme Temperature Changes and Current Stressing
[J]. Journal of Mechanical Engineering, 2022, 58(2): 291-299.
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[13] |
KONG Xiangxia, ZHAI Junjun, SUN Fenglian.
Research Progress of Low-Silver Sn-0.3Ag-0.7Cu Solder for Electronic Packaging
[J]. Journal of Mechanical Engineering, 2022, 58(12): 39-54.
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[14] |
LI Huan, ZHOU Kang, CAO Biao, ZHANG Jinzhou.
Analysis of Welding Interface and Joint Properties of High Power Ultrasonic Welding of Aluminum Alloy
[J]. Journal of Mechanical Engineering, 2021, 57(6): 87-95.
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[15] |
QIN Guoliang, GENG Peihao, CHEN Yong, REN Wenjian.
Numerical Analysis of Stress Evolution in MIG Arc Brazing-fusion Welding of Al Alloy to Galvanized Steel Plate
[J]. Journal of Mechanical Engineering, 2021, 57(2): 87-96.
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