Research Progresses on Reliability of Sn-based Solder Joints in Extreme Temperature Environment

doi:10.3901/JME.2022.02.236

Abstract

Abstract: The solder joints played a crucial role for the provide mechanical, thermal and electrical continuity in electronics system for the deep space detector, the failure of the electronics system mainly caused by the failure of the solder joints, this result had an important relationship with the mechanical properties and microstructure evolution of the solder alloy under the various temperature conditions. Sn-based solder was widely used at the present, and the viscoplastic equation was established by the mechanical properties of the solder alloy, such as Anand, Garofalo-Arrheninus, Norton, Wiese model, etc. However, a few of studies about the constitutive equation of the solder alloy at extremely temperature (lower than -55℃) were investigated. The mechanical constitutive models in the temperature range from -55℃ to +150℃ were reviewed and elaborated the effects of mechanical property and microstructure on the solder joint reliability for different temperatures. The current problems and challenges were summarized, finally looked forward to the development trend of the mechanical constitutive model of the Sn-based solder and solder joint under extremely low temperature (lower than -55℃)

Key words: Sn-based solder, mechanical constitutive equation, mechanical behavior, deep space

CLC Number:

TG407

LI Shengli, NIU Piao, HANG Chunjin, TIAN Yanhong, CUI Ning, JIANG Qian. Research Progresses on Reliability of Sn-based Solder Joints in Extreme Temperature Environment[J]. Journal of Mechanical Engineering, 2022, 58(2): 236-245.

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