Effect of Cu5Zn8 and Sn/Ag3Sn/Ag Diffusion Barrier on Interface Reaction of Sn/Cu Soldering

doi:10.3901/JME.2022.02.043

Abstract

Abstract: The miniaturization of electronic devices is seriously strict with the reliability of soldering interfaces. Therefore, it is of great significance to study the morphology evolution and growth mechanism of intermetallic compounds (IMC) at the soldering interface. Cu has excellent electrical and thermal conductivity that used as matrix material in the microelectronic packaging industry. During the soldering process, intermetallic compound(IMC) formed by interfacial reaction between Cu and Sn solder. Due to the high brittleness of IMC, the excessive growth of IMC will seriously reduce the reliability of welded joints. To overcome the excessive growth of IMC, Cu₅Zn₈diffusion barrier layer and Sn/Ag₃Sn/Ag diffusion barrier laye are prepared on Cu substrate. The morphology evolution and growth mechanism of IMC on Cu, Cu₅Zn₈diffusion barrier layer/Cu and Sn/Ag₃Sn/Ag diffusion barrier layer/Cu under different soldering process are studied. The results show that Cu₅Zn₈diffusion barrier layer, Sn/Ag₃Sn/Ag diffusion barrier layer can inhibit interface reaction of Sn/Cu soldering.

Key words: diffusion barrier, soldering, pure Sn solder, Cu₅Zn₈, Ag₃Sn

CLC Number:

TG425

YAO Jinye, CHEN Xiangxu, LI Hua, MA Haitao, WANG Yunpeng, MA Haoran. Effect of Cu₅Zn₈ and Sn/Ag₃Sn/Ag Diffusion Barrier on Interface Reaction of Sn/Cu Soldering[J]. Journal of Mechanical Engineering, 2022, 58(2): 43-49.

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Effect of Cu₅Zn₈ and Sn/Ag₃Sn/Ag Diffusion Barrier on Interface Reaction of Sn/Cu Soldering

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